JP2005228304A5 - - Google Patents

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Publication number
JP2005228304A5
JP2005228304A5 JP2005005908A JP2005005908A JP2005228304A5 JP 2005228304 A5 JP2005228304 A5 JP 2005228304A5 JP 2005005908 A JP2005005908 A JP 2005005908A JP 2005005908 A JP2005005908 A JP 2005005908A JP 2005228304 A5 JP2005228304 A5 JP 2005228304A5
Authority
JP
Japan
Prior art keywords
integrated circuit
thin film
antenna
film integrated
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2005005908A
Other languages
English (en)
Japanese (ja)
Other versions
JP4610348B2 (ja
JP2005228304A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2005005908A priority Critical patent/JP4610348B2/ja
Priority claimed from JP2005005908A external-priority patent/JP4610348B2/ja
Publication of JP2005228304A publication Critical patent/JP2005228304A/ja
Publication of JP2005228304A5 publication Critical patent/JP2005228304A5/ja
Application granted granted Critical
Publication of JP4610348B2 publication Critical patent/JP4610348B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2005005908A 2004-01-16 2005-01-13 半導体装置 Expired - Fee Related JP4610348B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005005908A JP4610348B2 (ja) 2004-01-16 2005-01-13 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004008752 2004-01-16
JP2005005908A JP4610348B2 (ja) 2004-01-16 2005-01-13 半導体装置

Publications (3)

Publication Number Publication Date
JP2005228304A JP2005228304A (ja) 2005-08-25
JP2005228304A5 true JP2005228304A5 (enExample) 2008-02-07
JP4610348B2 JP4610348B2 (ja) 2011-01-12

Family

ID=34792247

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005005908A Expired - Fee Related JP4610348B2 (ja) 2004-01-16 2005-01-13 半導体装置

Country Status (4)

Country Link
US (1) US7633145B2 (enExample)
JP (1) JP4610348B2 (enExample)
CN (1) CN1910596B (enExample)
WO (1) WO2005069204A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1910600B (zh) 2004-01-23 2011-12-14 株式会社半导体能源研究所 Id标记、id卡和id标签
CN1910598A (zh) 2004-01-23 2007-02-07 株式会社半导体能源研究所 膜状物品及其制作方法
TWI372413B (en) 2004-09-24 2012-09-11 Semiconductor Energy Lab Semiconductor device and method for manufacturing the same, and electric appliance
US7212127B2 (en) 2004-12-20 2007-05-01 Avery Dennison Corp. RFID tag and label
CN101111938B (zh) * 2005-01-28 2010-08-11 株式会社半导体能源研究所 半导体器件和制造它的方法
WO2007009048A2 (en) * 2005-07-13 2007-01-18 Kestrel Wireless Inc. Devices, packaging, and methods for rf communication with targets
US7564354B2 (en) * 2005-12-29 2009-07-21 International Business Machines Corporation Monitoring device for detecting opening of packaging
JP5469799B2 (ja) * 2006-03-15 2014-04-16 株式会社半導体エネルギー研究所 無線通信によりデータの交信を行う半導体装置
JP5209182B2 (ja) * 2006-04-24 2013-06-12 矢崎総業株式会社 Ｌｃｄの駆動電圧設定方法
KR100806847B1 (ko) * 2006-09-12 2008-02-22 삼성전자주식회사 마이크로 안테나 및 그 제조방법
DE102006059454A1 (de) 2006-12-15 2008-06-19 Bundesdruckerei Gmbh Personaldokument und Verfahren zu seiner Herstellung
JP2009093507A (ja) 2007-10-11 2009-04-30 Hitachi Ltd Ｒｆｉｄタグ
JP2009134658A (ja) * 2007-12-03 2009-06-18 Dainippon Printing Co Ltd 開梱確認用の非接触ｉｃタグ及び非接触ｉｃタグを用いた開梱確認方法
WO2010032602A1 (en) * 2008-09-18 2010-03-25 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5300558B2 (ja) * 2009-03-27 2013-09-25 日東電工株式会社 半導体装置の製造方法
GB201020947D0 (en) * 2010-12-10 2011-01-26 Maxgear Europ Ltd Security sticker
JP5967566B2 (ja) * 2012-01-31 2016-08-10 国立大学法人山形大学 Ｒｆｉｄラベル
US10276006B1 (en) * 2017-12-02 2019-04-30 The Boeing Company Wireless tamper device
CN110510249A (zh) * 2018-05-22 2019-11-29 江峰 一种利用ras标签有效防止包装箱重复使用的封盖箱

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000020665A (ja) 1998-06-30 2000-01-21 Toshiba Corp 半導体装置
EP1014302B1 (en) * 1998-07-08 2005-09-21 Dai Nippon Printing Co., Ltd. Noncontact ic card and manufacture thereof
JP2001013874A (ja) * 1999-06-25 2001-01-19 Matsushita Electric Works Ltd Ｉｄラベル
JP4095741B2 (ja) 1999-06-29 2008-06-04 シチズンミヨタ株式会社 Ｉｃタグ構造
JP2001109866A (ja) * 1999-10-13 2001-04-20 Hitachi Maxell Ltd 非接触通信式半導体装置
US6509217B1 (en) * 1999-10-22 2003-01-21 Damoder Reddy Inexpensive, reliable, planar RFID tag structure and method for making same
ES2351549T3 (es) * 2000-03-21 2011-02-07 Mikoh Corporation Una etiqueta de identificación por radiofrecuencia con indicación de manipulación indebida.
JP2003080694A (ja) * 2001-06-26 2003-03-19 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体
JP2003123047A (ja) * 2001-10-15 2003-04-25 Sharp Corp 半導体装置及びその製造方法
JP2003318133A (ja) 2002-04-22 2003-11-07 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、半導体チップの実装構造、半導体装置、発光装置、電気光学装置、電子機器、並びに非接触型カード媒体
JP4342771B2 (ja) 2002-05-15 2009-10-14 リンテック株式会社 Ｉｃタグ
EP1434264A3 (en) * 2002-12-27 2017-01-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method using the transfer technique

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