JP2005203695A - 半導体装置およびその製造方法 - Google Patents
半導体装置およびその製造方法 Download PDFInfo
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- JP2005203695A JP2005203695A JP2004010688A JP2004010688A JP2005203695A JP 2005203695 A JP2005203695 A JP 2005203695A JP 2004010688 A JP2004010688 A JP 2004010688A JP 2004010688 A JP2004010688 A JP 2004010688A JP 2005203695 A JP2005203695 A JP 2005203695A
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Abstract
【解決手段】本発明によれば、外部接続電極が形成された表面と、表面に対向し、鏡面状態である裏面10(#a)を有する半導体装置であって、裏面10(#a)の一部に、レーザマーキング法によって粗面化処理された粗面化領域14を設ける。この粗面化領域14は、レーザマーキング法によって印字された該半導体装置自体の製品情報マーク14(#a)を含んでいる。また、この粗面化領域14は、裏面10(#a)に光を照射した場合、粗面化領域14と鏡面化領域12との光反射率の違いから製品情報を読み取ることができる程度に、粗面化領域14の個数、大きさ、形状、配置場所を決定する。
【選択図】 図1
Description
本発明の第1の実施の形態を図1から図25を用いて説明する。
本発明の第2の実施の形態を図26を用いて説明する。
Claims (7)
- 外部接続電極が形成された第1面と、第1面に対向し、鏡面状態である第2面を有する半導体装置であって、
前記第2面の一部に、レーザマーキング法によって粗面化処理された粗面化領域を設け、
前記粗面化領域は、レーザマーキング法によって入力された該半導体装置自体の製品情報を含む半導体装置。 - 請求項1に記載の半導体装置において、
前記粗面化領域は、凹部と、前記凹部の周囲の凸部とによって形成されてなる複数のクレータからなり、前記凹部の底部と前記凸部の頂部との差を1μm以上10μm以下になるようにした半導体装置。 - 請求項1または請求項2に記載の半導体装置において、
前記粗面化領域は、凹部と、前記凹部の周囲の凸部とによって形成されてなる複数のクレータからなり、互いに隣接するクレータ同士がオーバーラップしないようにした半導体装置。 - 請求項1または請求項2に記載の半導体装置において、
前記粗面化領域は、凹部と、前記凹部の周囲の凸部とによって形成されてなる複数のクレータからなり、互いに隣接するクレータ間の前記第2面に沿った隔離距離を、前記クレータの前記第2面に沿った最大幅以下とした半導体装置。 - 請求項1乃至4のうち何れか1項に記載の半導体装置において、
前記第2面に光を照射した場合、前記粗面化領域と前記粗面化領域以外の領域との光反射率の違いから前記製品情報を読み取ることができる程度に、前記粗面化領域の個数、大きさ、形状、配置場所を決定するようにした半導体装置。 - 請求項1乃至5のうち何れか1項に記載の半導体装置において、
前記粗面化領域は、レーザマーキング法によって形成された該半導体装置自体のインデクス用マークを含む半導体装置。 - 請求項1乃至6のうち何れか1項に記載の複数の半導体装置からなる半導体装置集合体を作成した後に、前記半導体装置集合体を予め定めた大きさに分割することによって前記半導体装置を製造するようにした製造方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2004010688A JP2005203695A (ja) | 2004-01-19 | 2004-01-19 | 半導体装置およびその製造方法 |
TW093112000A TWI248173B (en) | 2004-01-19 | 2004-04-29 | Semiconductor device and method of manufacturing the same |
US10/842,412 US7279792B2 (en) | 2004-01-19 | 2004-05-10 | Semiconductor device and method of manufacturing same |
KR1020040033835A KR100618213B1 (ko) | 2004-01-19 | 2004-05-13 | 반도체 장치 및 그 제조 방법 |
CN2004100447191A CN1645597B (zh) | 2004-01-19 | 2004-05-17 | 半导体器件及其制造方法 |
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JP2004010688A JP2005203695A (ja) | 2004-01-19 | 2004-01-19 | 半導体装置およびその製造方法 |
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JP2007105276A Division JP4499761B2 (ja) | 2007-04-12 | 2007-04-12 | 半導体装置 |
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JP2005203695A true JP2005203695A (ja) | 2005-07-28 |
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US (1) | US7279792B2 (ja) |
JP (1) | JP2005203695A (ja) |
KR (1) | KR100618213B1 (ja) |
CN (1) | CN1645597B (ja) |
TW (1) | TWI248173B (ja) |
Cited By (5)
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US7830011B2 (en) | 2004-03-15 | 2010-11-09 | Yamaha Corporation | Semiconductor element and wafer level chip size package therefor |
WO2010150330A1 (ja) * | 2009-06-22 | 2010-12-29 | パナソニック株式会社 | 光半導体装置、及びそれを用いた光ピックアップ装置、並びに電子機器 |
US8513823B2 (en) | 2010-08-05 | 2013-08-20 | Renesas Electronics Corporation | Semiconductor package having main stamp and sub-stamp |
WO2021049400A1 (ja) * | 2019-09-12 | 2021-03-18 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
CN114121898A (zh) * | 2022-01-28 | 2022-03-01 | 甬矽电子(宁波)股份有限公司 | 晶圆级芯片封装结构、封装方法和电子设备 |
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WO2007138647A1 (ja) * | 2006-05-25 | 2007-12-06 | Mitsubishi Electric Corporation | 回転電機の固定子 |
US8217514B2 (en) * | 2008-04-07 | 2012-07-10 | Stats Chippac Ltd. | Integrated circuit packaging system with warpage control system and method of manufacture thereof |
JP5472275B2 (ja) * | 2011-12-14 | 2014-04-16 | 株式会社村田製作所 | エキスパンド装置及び部品の製造方法 |
WO2014181766A1 (ja) * | 2013-05-07 | 2014-11-13 | ピーエスフォー ルクスコ エスエイアールエル | 半導体装置及び半導体装置の製造方法 |
JP6113019B2 (ja) * | 2013-08-07 | 2017-04-12 | 株式会社ディスコ | ウエーハの分割方法 |
WO2016100560A1 (en) * | 2014-12-16 | 2016-06-23 | Deca Technologies Inc. | Method of marking a semiconductor package |
US9728508B2 (en) * | 2015-09-18 | 2017-08-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Semiconductor device and method of manufacture |
WO2018003602A1 (ja) * | 2016-06-28 | 2018-01-04 | リンテック株式会社 | 整列治具、整列方法及び転着方法 |
US20180005916A1 (en) * | 2016-06-30 | 2018-01-04 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
JP6855955B2 (ja) * | 2017-06-19 | 2021-04-07 | 株式会社Sumco | レーザマークの印字方法、レーザマーク付きシリコンウェーハの製造方法 |
US10535812B2 (en) * | 2017-09-04 | 2020-01-14 | Rohm Co., Ltd. | Semiconductor device |
JP2019066750A (ja) * | 2017-10-04 | 2019-04-25 | 株式会社ジャパンディスプレイ | 表示装置 |
JP6866884B2 (ja) * | 2018-10-04 | 2021-04-28 | カシオ計算機株式会社 | ケース、時計、ケースの製造方法及び時計の製造方法 |
JP6795019B2 (ja) * | 2018-10-04 | 2020-12-02 | カシオ計算機株式会社 | ケース及び時計 |
US20210233867A1 (en) * | 2020-01-24 | 2021-07-29 | Intel Corporation | Keep out zone with hydrophobic surface for integrated circuit (ic) package |
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JPH04106960A (ja) | 1990-08-27 | 1992-04-08 | Nec Corp | Icチップ |
JPH08191038A (ja) | 1995-01-11 | 1996-07-23 | Kawasaki Steel Corp | 半導体基板へのマーキング方法 |
JPH10106905A (ja) | 1996-09-27 | 1998-04-24 | Sanyo Electric Co Ltd | 半導体装置 |
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-
2004
- 2004-01-19 JP JP2004010688A patent/JP2005203695A/ja active Pending
- 2004-04-29 TW TW093112000A patent/TWI248173B/zh not_active IP Right Cessation
- 2004-05-10 US US10/842,412 patent/US7279792B2/en not_active Expired - Fee Related
- 2004-05-13 KR KR1020040033835A patent/KR100618213B1/ko not_active IP Right Cessation
- 2004-05-17 CN CN2004100447191A patent/CN1645597B/zh not_active Expired - Lifetime
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7830011B2 (en) | 2004-03-15 | 2010-11-09 | Yamaha Corporation | Semiconductor element and wafer level chip size package therefor |
WO2010150330A1 (ja) * | 2009-06-22 | 2010-12-29 | パナソニック株式会社 | 光半導体装置、及びそれを用いた光ピックアップ装置、並びに電子機器 |
US8513823B2 (en) | 2010-08-05 | 2013-08-20 | Renesas Electronics Corporation | Semiconductor package having main stamp and sub-stamp |
WO2021049400A1 (ja) * | 2019-09-12 | 2021-03-18 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
JPWO2021049400A1 (ja) * | 2019-09-12 | 2021-03-18 | ||
JP7151906B2 (ja) | 2019-09-12 | 2022-10-12 | 株式会社村田製作所 | 電子部品モジュール、および、電子部品モジュールの製造方法 |
CN114121898A (zh) * | 2022-01-28 | 2022-03-01 | 甬矽电子(宁波)股份有限公司 | 晶圆级芯片封装结构、封装方法和电子设备 |
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KR100618213B1 (ko) | 2006-09-01 |
CN1645597A (zh) | 2005-07-27 |
CN1645597B (zh) | 2010-11-24 |
KR20050076571A (ko) | 2005-07-26 |
TW200525707A (en) | 2005-08-01 |
US7279792B2 (en) | 2007-10-09 |
US20050167800A1 (en) | 2005-08-04 |
TWI248173B (en) | 2006-01-21 |
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