JP2005199269A5 - - Google Patents
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- Publication number
- JP2005199269A5 JP2005199269A5 JP2004364373A JP2004364373A JP2005199269A5 JP 2005199269 A5 JP2005199269 A5 JP 2005199269A5 JP 2004364373 A JP2004364373 A JP 2004364373A JP 2004364373 A JP2004364373 A JP 2004364373A JP 2005199269 A5 JP2005199269 A5 JP 2005199269A5
- Authority
- JP
- Japan
- Prior art keywords
- composition
- shaping
- shape
- display device
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000007493 shaping process Methods 0.000 claims 17
- 238000000034 method Methods 0.000 claims 13
- 230000015572 biosynthetic process Effects 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 239000004065 semiconductor Substances 0.000 claims 8
- 239000004020 conductor Substances 0.000 claims 7
- 239000011810 insulating material Substances 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- 238000007599 discharging Methods 0.000 claims 3
- 239000007789 gas Substances 0.000 claims 3
- 229910052736 halogen Inorganic materials 0.000 claims 3
- 150000002367 halogens Chemical class 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims 2
- 239000007788 liquid Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000013078 crystal Substances 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004364373A JP4583904B2 (ja) | 2003-12-17 | 2004-12-16 | 表示装置の作製方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003419923 | 2003-12-17 | ||
| JP2004364373A JP4583904B2 (ja) | 2003-12-17 | 2004-12-16 | 表示装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005199269A JP2005199269A (ja) | 2005-07-28 |
| JP2005199269A5 true JP2005199269A5 (enExample) | 2008-02-07 |
| JP4583904B2 JP4583904B2 (ja) | 2010-11-17 |
Family
ID=34829237
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004364373A Expired - Fee Related JP4583904B2 (ja) | 2003-12-17 | 2004-12-16 | 表示装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4583904B2 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8053850B2 (en) | 2005-06-30 | 2011-11-08 | Semiconductor Energy Laboratory Co., Ltd. | Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof |
| JP4914589B2 (ja) | 2005-08-26 | 2012-04-11 | 三菱電機株式会社 | 半導体製造装置、半導体製造方法および半導体装置 |
| JP4696957B2 (ja) * | 2006-02-22 | 2011-06-08 | ソニー株式会社 | 配線基板修正方法及び配線基板修正装置 |
| KR100785038B1 (ko) | 2006-04-17 | 2007-12-12 | 삼성전자주식회사 | 비정질 ＺｎＯ계 ＴＦＴ |
| JPWO2009035036A1 (ja) * | 2007-09-14 | 2010-12-24 | コニカミノルタホールディングス株式会社 | 電極の形成方法及び有機薄膜トランジスタ |
| JP2012109581A (ja) * | 2011-12-19 | 2012-06-07 | Mitsubishi Electric Corp | 半導体製造方法および半導体装置 |
| KR20170059523A (ko) * | 2015-11-20 | 2017-05-31 | 삼성디스플레이 주식회사 | 표시 장치, 타일형 표시 장치 및 이의 제조 방법 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59130562A (ja) * | 1983-01-14 | 1984-07-27 | Kinugawa Rubber Ind Co Ltd | 長尺物用塗布装置 |
| JPS59193571U (ja) * | 1983-06-13 | 1984-12-22 | ナショナル住宅産業株式会社 | コ−キングノズル |
| JP2593434B2 (ja) * | 1985-06-29 | 1997-03-26 | 株式会社東芝 | 記録装置 |
| US4868138A (en) * | 1988-03-23 | 1989-09-19 | Sgs-Thomson Microelectronics, Inc. | Method for forming a self-aligned source/drain contact for an MOS transistor |
| JPH0864937A (ja) * | 1994-08-24 | 1996-03-08 | Ibiden Co Ltd | ペースト状物質塗布装置 |
| JPH10223138A (ja) * | 1996-12-04 | 1998-08-21 | Dainippon Printing Co Ltd | 蛍光体充填装置 |
| JPH1157574A (ja) * | 1997-08-20 | 1999-03-02 | Ricoh Co Ltd | 混合塗布装置及びそれを用いた混合塗布方法 |
| JP4003273B2 (ja) * | 1998-01-19 | 2007-11-07 | セイコーエプソン株式会社 | パターン形成方法および基板製造装置 |
| JPH11237790A (ja) * | 1998-02-23 | 1999-08-31 | Brother Ind Ltd | 画像形成装置 |
| JPH11329221A (ja) * | 1998-05-15 | 1999-11-30 | Canon Inc | ペースト状物質の塗布方法及び前記塗布方法を用いた画像表示装置 |
| JP3726667B2 (ja) * | 1999-11-02 | 2005-12-14 | 松下電器産業株式会社 | Ａｃ型プラズマディスプレイ装置 |
| JP2002316401A (ja) * | 2001-04-20 | 2002-10-29 | Matsushita Electric Ind Co Ltd | 粘性材料塗布方法及び装置 |
| JP2002086020A (ja) * | 2000-09-11 | 2002-03-26 | Fuji Photo Film Co Ltd | 液体塗布装置 |
| JP2002177842A (ja) * | 2000-12-07 | 2002-06-25 | Kawasaki Steel Corp | 鋼管に対する接着剤の塗布方法および塗布装置 |
| JP2003059940A (ja) * | 2001-08-08 | 2003-02-28 | Fuji Photo Film Co Ltd | ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法 |
| JP3793709B2 (ja) * | 2001-10-19 | 2006-07-05 | アイカ工業株式会社 | 塗床とその施工方法 |
| JP2003151443A (ja) * | 2001-11-12 | 2003-05-23 | Matsushita Electric Ind Co Ltd | Ａｃ型プラズマディスプレイパネル |
| JP2003311196A (ja) * | 2002-04-19 | 2003-11-05 | Seiko Epson Corp | 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、非接触型カード媒体、圧電体素子、並びにインクジェット式記録ヘッド |
| JP4615197B2 (ja) * | 2002-08-30 | 2011-01-19 | シャープ株式会社 | Ｔｆｔアレイ基板の製造方法および液晶表示装置の製造方法 |
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2004
- 2004-12-16 JP JP2004364373A patent/JP4583904B2/ja not_active Expired - Fee Related