JP4583904B2 - 表示装置の作製方法 - Google Patents

表示装置の作製方法 Download PDF

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Publication number
JP4583904B2
JP4583904B2 JP2004364373A JP2004364373A JP4583904B2 JP 4583904 B2 JP4583904 B2 JP 4583904B2 JP 2004364373 A JP2004364373 A JP 2004364373A JP 2004364373 A JP2004364373 A JP 2004364373A JP 4583904 B2 JP4583904 B2 JP 4583904B2
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JP
Japan
Prior art keywords
layer
gate
forming
source
electrode layer
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Expired - Fee Related
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JP2004364373A
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English (en)
Japanese (ja)
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JP2005199269A5 (enExample
JP2005199269A (ja
Inventor
舜平 山崎
馨太郎 今井
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2004364373A priority Critical patent/JP4583904B2/ja
Publication of JP2005199269A publication Critical patent/JP2005199269A/ja
Publication of JP2005199269A5 publication Critical patent/JP2005199269A5/ja
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Publication of JP4583904B2 publication Critical patent/JP4583904B2/ja
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  • Coating Apparatus (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2004364373A 2003-12-17 2004-12-16 表示装置の作製方法 Expired - Fee Related JP4583904B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004364373A JP4583904B2 (ja) 2003-12-17 2004-12-16 表示装置の作製方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003419923 2003-12-17
JP2004364373A JP4583904B2 (ja) 2003-12-17 2004-12-16 表示装置の作製方法

Publications (3)

Publication Number Publication Date
JP2005199269A JP2005199269A (ja) 2005-07-28
JP2005199269A5 JP2005199269A5 (enExample) 2008-02-07
JP4583904B2 true JP4583904B2 (ja) 2010-11-17

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JP2004364373A Expired - Fee Related JP4583904B2 (ja) 2003-12-17 2004-12-16 表示装置の作製方法

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JP (1) JP4583904B2 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8053850B2 (en) 2005-06-30 2011-11-08 Semiconductor Energy Laboratory Co., Ltd. Minute structure, micromachine, organic transistor, electric appliance, and manufacturing method thereof
JP4914589B2 (ja) 2005-08-26 2012-04-11 三菱電機株式会社 半導体製造装置、半導体製造方法および半導体装置
JP4696957B2 (ja) * 2006-02-22 2011-06-08 ソニー株式会社 配線基板修正方法及び配線基板修正装置
KR100785038B1 (ko) 2006-04-17 2007-12-12 삼성전자주식회사 비정질 ＺｎＯ계 ＴＦＴ
JPWO2009035036A1 (ja) * 2007-09-14 2010-12-24 コニカミノルタホールディングス株式会社 電極の形成方法及び有機薄膜トランジスタ
JP2012109581A (ja) * 2011-12-19 2012-06-07 Mitsubishi Electric Corp 半導体製造方法および半導体装置
KR20170059523A (ko) * 2015-11-20 2017-05-31 삼성디스플레이 주식회사 표시 장치, 타일형 표시 장치 및 이의 제조 방법

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59130562A (ja) * 1983-01-14 1984-07-27 Kinugawa Rubber Ind Co Ltd 長尺物用塗布装置
JPS59193571U (ja) * 1983-06-13 1984-12-22 ナショナル住宅産業株式会社 コ−キングノズル
JP2593434B2 (ja) * 1985-06-29 1997-03-26 株式会社東芝 記録装置
US4868138A (en) * 1988-03-23 1989-09-19 Sgs-Thomson Microelectronics, Inc. Method for forming a self-aligned source/drain contact for an MOS transistor
JPH0864937A (ja) * 1994-08-24 1996-03-08 Ibiden Co Ltd ペースト状物質塗布装置
JPH10223138A (ja) * 1996-12-04 1998-08-21 Dainippon Printing Co Ltd 蛍光体充填装置
JPH1157574A (ja) * 1997-08-20 1999-03-02 Ricoh Co Ltd 混合塗布装置及びそれを用いた混合塗布方法
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
JPH11237790A (ja) * 1998-02-23 1999-08-31 Brother Ind Ltd 画像形成装置
JPH11329221A (ja) * 1998-05-15 1999-11-30 Canon Inc ペースト状物質の塗布方法及び前記塗布方法を用いた画像表示装置
JP3726667B2 (ja) * 1999-11-02 2005-12-14 松下電器産業株式会社 Ａｃ型プラズマディスプレイ装置
JP2002316401A (ja) * 2001-04-20 2002-10-29 Matsushita Electric Ind Co Ltd 粘性材料塗布方法及び装置
JP2002086020A (ja) * 2000-09-11 2002-03-26 Fuji Photo Film Co Ltd 液体塗布装置
JP2002177842A (ja) * 2000-12-07 2002-06-25 Kawasaki Steel Corp 鋼管に対する接着剤の塗布方法および塗布装置
JP2003059940A (ja) * 2001-08-08 2003-02-28 Fuji Photo Film Co Ltd ミクロファブリケーション用基板、その製造方法および像状薄膜形成方法
JP3793709B2 (ja) * 2001-10-19 2006-07-05 アイカ工業株式会社 塗床とその施工方法
JP2003151443A (ja) * 2001-11-12 2003-05-23 Matsushita Electric Ind Co Ltd Ａｃ型プラズマディスプレイパネル
JP2003311196A (ja) * 2002-04-19 2003-11-05 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、非接触型カード媒体、圧電体素子、並びにインクジェット式記録ヘッド
JP4615197B2 (ja) * 2002-08-30 2011-01-19 シャープ株式会社 Ｔｆｔアレイ基板の製造方法および液晶表示装置の製造方法

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JP2005199269A (ja) 2005-07-28

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