JP2006237586A5 - - Google Patents

Download PDF

Info

Publication number
JP2006237586A5
JP2006237586A5 JP2006017033A JP2006017033A JP2006237586A5 JP 2006237586 A5 JP2006237586 A5 JP 2006237586A5 JP 2006017033 A JP2006017033 A JP 2006017033A JP 2006017033 A JP2006017033 A JP 2006017033A JP 2006237586 A5 JP2006237586 A5 JP 2006237586A5
Authority
JP
Japan
Prior art keywords
line
droplets
center
mask
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2006017033A
Other languages
English (en)
Japanese (ja)
Other versions
JP4777078B2 (ja
JP2006237586A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2006017033A priority Critical patent/JP4777078B2/ja
Priority claimed from JP2006017033A external-priority patent/JP4777078B2/ja
Publication of JP2006237586A publication Critical patent/JP2006237586A/ja
Publication of JP2006237586A5 publication Critical patent/JP2006237586A5/ja
Application granted granted Critical
Publication of JP4777078B2 publication Critical patent/JP4777078B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2006017033A 2005-01-28 2006-01-26 半導体装置の作製方法 Expired - Fee Related JP4777078B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006017033A JP4777078B2 (ja) 2005-01-28 2006-01-26 半導体装置の作製方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005022214 2005-01-28
JP2005022214 2005-01-28
JP2006017033A JP4777078B2 (ja) 2005-01-28 2006-01-26 半導体装置の作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006260304A Division JP4777203B2 (ja) 2005-01-28 2006-09-26 半導体装置

Publications (3)

Publication Number Publication Date
JP2006237586A JP2006237586A (ja) 2006-09-07
JP2006237586A5 true JP2006237586A5 (enExample) 2010-04-15
JP4777078B2 JP4777078B2 (ja) 2011-09-21

Family

ID=37044838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006017033A Expired - Fee Related JP4777078B2 (ja) 2005-01-28 2006-01-26 半導体装置の作製方法

Country Status (1)

Country Link
JP (1) JP4777078B2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5196870B2 (ja) * 2007-05-23 2013-05-15 キヤノン株式会社 酸化物半導体を用いた電子素子及びその製造方法
US8436349B2 (en) 2007-02-20 2013-05-07 Canon Kabushiki Kaisha Thin-film transistor fabrication process and display device
JP5616038B2 (ja) 2008-07-31 2014-10-29 株式会社半導体エネルギー研究所 半導体装置の作製方法
WO2010038566A1 (ja) * 2008-09-30 2010-04-08 コニカミノルタホールディングス株式会社 薄膜トランジスタおよびその製造方法
WO2010047288A1 (en) * 2008-10-24 2010-04-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductordevice
JP5442234B2 (ja) 2008-10-24 2014-03-12 株式会社半導体エネルギー研究所 半導体装置及び表示装置
JP5422972B2 (ja) * 2008-11-18 2014-02-19 コニカミノルタ株式会社 有機薄膜トランジスタアレイの製造方法、及び有機薄膜トランジスタアレイ
US20100224880A1 (en) * 2009-03-05 2010-09-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR101681884B1 (ko) 2009-03-27 2016-12-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치, 표시장치 및 전자기기
KR101422362B1 (ko) * 2009-07-10 2014-07-22 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 패널 및 전자 기기
KR101519893B1 (ko) * 2009-09-16 2015-05-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터
JP5683179B2 (ja) * 2009-09-24 2015-03-11 株式会社半導体エネルギー研究所 表示装置の作製方法
KR101963300B1 (ko) * 2009-12-04 2019-03-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치
CN102696112A (zh) * 2009-12-21 2012-09-26 夏普株式会社 有源矩阵基板和具有其的显示面板、以及有源矩阵基板的制造方法
WO2011077926A1 (en) 2009-12-24 2011-06-30 Semiconductor Energy Laboratory Co., Ltd. Display device and electronic device
JP5899606B2 (ja) * 2010-03-04 2016-04-06 株式会社リコー 積層構造体の製造方法
WO2011125806A1 (en) * 2010-04-09 2011-10-13 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of semiconductor device
US8809928B2 (en) * 2011-05-06 2014-08-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, memory device, and method for manufacturing the semiconductor device
JP2014060451A (ja) * 2013-12-18 2014-04-03 Semiconductor Energy Lab Co Ltd 発光装置
JP6652124B2 (ja) * 2015-03-02 2020-02-19 コニカミノルタ株式会社 パターン形成方法
CN110808263B (zh) * 2018-08-06 2020-09-22 云谷(固安)科技有限公司 显示面板、显示屏及显示终端
CN110767672B (zh) * 2018-08-06 2020-11-17 云谷(固安)科技有限公司 显示面板、显示屏及显示终端
CN110767106B (zh) * 2018-09-30 2020-09-08 云谷(固安)科技有限公司 显示面板、显示屏及显示终端
CN110767701B (zh) * 2018-12-29 2022-10-21 昆山国显光电有限公司 Oled阵列基板、显示屏及显示终端

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003133691A (ja) * 2001-10-22 2003-05-09 Seiko Epson Corp 膜パターンの形成方法、膜パターン形成装置、導電膜配線、電気光学装置、電子機器、並びに非接触型カード媒体

Similar Documents

Publication Publication Date Title
JP2006237586A5 (enExample)
EP1960119B1 (de) Vorrichtung, anlage und verfahren zur oberflächenbehandlung von substraten
US9609755B2 (en) Nanosized particles deposited on shaped surface geometries
KR101335885B1 (ko) 비접촉 부상 반송 기능을 가지는 기판 처리 장치
CN102858525B (zh) 包括水冷却过程的用于轮胎的橡胶带制造方法
TW200517008A (en) Electro-optical device and electronic apparatus
JP2004095896A (ja) パターン形成基材およびパターン形成方法
JP2006237587A5 (enExample)
JP2005334864A5 (enExample)
CN103676325B (zh) 用于形成膜的方法及液晶显示装置
CN103373071A (zh) 形成漏斗状喷嘴
JP2005244203A5 (enExample)
CN100358115C (zh) 摇动喷淋型传送式基板处理装置
JP2008193061A5 (enExample)
JP6335568B2 (ja) 水平安定化を用いた毛管自己アセンブリのための支持体、その製造方法、およびその使用
US20100136757A1 (en) method for aligning elongated nanostructures
US20060057338A1 (en) Substrate with plane patterns and display device using the same
JP5775908B2 (ja) トランジスタ形成方法及びトランジスタ用中間形成物
WO2002049086A1 (fr) Dispositif de traitement de substrat de transfert
JP2005199269A5 (enExample)
JP2005346043A5 (enExample)
CN100537044C (zh) 流体喷射装置
TWI281693B (en) Apparatus for treating substrates
TWI568500B (zh) 噴射流體裝置
JP2012101364A5 (enExample)