JP5775908B2 - トランジスタ形成方法及びトランジスタ用中間形成物 - Google Patents
トランジスタ形成方法及びトランジスタ用中間形成物 Download PDFInfo
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- JP5775908B2 JP5775908B2 JP2013145969A JP2013145969A JP5775908B2 JP 5775908 B2 JP5775908 B2 JP 5775908B2 JP 2013145969 A JP2013145969 A JP 2013145969A JP 2013145969 A JP2013145969 A JP 2013145969A JP 5775908 B2 JP5775908 B2 JP 5775908B2
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- 238000000034 method Methods 0.000 title claims description 53
- 239000013067 intermediate product Substances 0.000 title description 3
- 239000007788 liquid Substances 0.000 claims description 54
- 239000002070 nanowire Substances 0.000 claims description 50
- 239000000758 substrate Substances 0.000 claims description 32
- 238000000151 deposition Methods 0.000 claims description 29
- 239000003989 dielectric material Substances 0.000 claims description 10
- 230000002209 hydrophobic effect Effects 0.000 claims description 7
- 230000007850 degeneration Effects 0.000 claims description 4
- 238000007599 discharging Methods 0.000 claims 1
- 239000002086 nanomaterial Substances 0.000 description 53
- 230000000694 effects Effects 0.000 description 23
- 230000008021 deposition Effects 0.000 description 18
- 239000002105 nanoparticle Substances 0.000 description 18
- 239000004065 semiconductor Substances 0.000 description 16
- 238000001704 evaporation Methods 0.000 description 14
- 239000010410 layer Substances 0.000 description 13
- 238000007639 printing Methods 0.000 description 13
- 230000008020 evaporation Effects 0.000 description 12
- 239000000463 material Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 238000009826 distribution Methods 0.000 description 4
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000002041 carbon nanotube Substances 0.000 description 2
- 229910021393 carbon nanotube Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- -1 for example Substances 0.000 description 2
- 239000002159 nanocrystal Substances 0.000 description 2
- 239000002071 nanotube Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000007781 pre-processing Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000609 electron-beam lithography Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000007646 gravure printing Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
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- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
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- 238000010019 resist printing Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000003396 thiol group Chemical class [H]S* 0.000 description 1
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 1
- 239000005052 trichlorosilane Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/191—Deposition of organic active material characterised by provisions for the orientation or alignment of the layer to be deposited
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/701—Integrated with dissimilar structures on a common substrate
- Y10S977/723—On an electrically insulating substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
- Y10S977/786—Fluidic host/matrix containing nanomaterials
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Nanotechnology (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Thin Film Transistor (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Description
Claims (2)
- 基板に複数のゲートラインを堆積するステップと、
前記複数のゲートラインを覆って誘電体材料を堆積するステップと、
前記ゲートラインの直上に位置する前記誘電体材料の領域の表面を前記ゲートラインの間隙の直上に位置する前記誘電体材料の領域の表面に比べて疎水性とする処理を施すステップと、
ナノワイヤを含む溶液の液滴を前記ゲートラインの間隙の直上に位置する前記誘電体材料の上に吐出するステップと、
を含み、
前記ナノワイヤを含む溶液は、前記液滴が拡がりつつあるときの接触角即ち拡張時接触角と、前記液滴が縮まりつつあるときの接触角即ち縮退時接触角について、前記拡張時接触角に対する前記縮退時接触角の角度差が10度超となる溶液であるトランジスタ形成方法。 - 複数のゲートライン、及びその上に堆積される誘電体材料を含む基板と、
前記誘電体材料の表面上に吐出された液滴であって、キャリア溶液の中に懸濁して浮遊する長尺ナノワイヤを含む溶液の液滴と、
を備え、
前記複数のゲートライン上に堆積された前記誘電体材料は、
前記ゲートラインの直上に位置する領域の表面が前記隣接するゲートラインの前記間隙の直上の領域の表面よりも疎水性となる処理が施され、
前記キャリア溶液の中に懸濁して浮遊する長尺ナノワイヤを含む溶液は、前記液滴が拡がりつつあるときの接触角即ち拡張時接触角と、前記液滴が縮まりつつあるときの接触角即ち縮退時接触角について、前記拡張時接触角に対する前記縮退時接触角の角度差が10度超となる溶液であるトランジスタ用中間形成物。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/644,055 US7838933B2 (en) | 2006-12-22 | 2006-12-22 | Printing method for high performance electronic devices |
US11/644,055 | 2006-12-22 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007328274A Division JP2008160122A (ja) | 2006-12-22 | 2007-12-20 | 液滴付着による高性能電子デバイス形成方法 |
Related Child Applications (1)
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JP2015093890A Division JP2015167246A (ja) | 2006-12-22 | 2015-05-01 | トランジスタ形成方法及び電子デバイス用中間形成物 |
Publications (2)
Publication Number | Publication Date |
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JP2013251557A JP2013251557A (ja) | 2013-12-12 |
JP5775908B2 true JP5775908B2 (ja) | 2015-09-09 |
Family
ID=39027273
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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JP2007328274A Pending JP2008160122A (ja) | 2006-12-22 | 2007-12-20 | 液滴付着による高性能電子デバイス形成方法 |
JP2013145969A Active JP5775908B2 (ja) | 2006-12-22 | 2013-07-12 | トランジスタ形成方法及びトランジスタ用中間形成物 |
JP2015093890A Pending JP2015167246A (ja) | 2006-12-22 | 2015-05-01 | トランジスタ形成方法及び電子デバイス用中間形成物 |
Family Applications Before (1)
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JP2007328274A Pending JP2008160122A (ja) | 2006-12-22 | 2007-12-20 | 液滴付着による高性能電子デバイス形成方法 |
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JP2015093890A Pending JP2015167246A (ja) | 2006-12-22 | 2015-05-01 | トランジスタ形成方法及び電子デバイス用中間形成物 |
Country Status (3)
Country | Link |
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US (2) | US7838933B2 (ja) |
EP (1) | EP1936711B1 (ja) |
JP (3) | JP2008160122A (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR101335405B1 (ko) * | 2011-08-08 | 2013-12-02 | 광주과학기술원 | 용액법 기반의 미세구조 패턴 형성방법 |
US9609755B2 (en) * | 2013-01-17 | 2017-03-28 | Hewlett-Packard Development Company, L.P. | Nanosized particles deposited on shaped surface geometries |
KR101424603B1 (ko) | 2013-09-10 | 2014-08-04 | 한국과학기술연구원 | 박막 트랜지스터의 제조 방법 |
KR101647038B1 (ko) * | 2015-06-24 | 2016-08-10 | 울산과학기술원 | 은나노와이어 기반의 고효율 투명전극 제조장치 및 투명전극 제조방법 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2846682B2 (ja) * | 1989-12-21 | 1999-01-13 | 三洋電機株式会社 | アクテイブマトリクス表示装置の薄膜トランジスタアレーの製造方法 |
GB0105145D0 (en) * | 2001-03-02 | 2001-04-18 | Koninkl Philips Electronics Nv | Thin film transistors and method of manufacture |
US6872645B2 (en) | 2002-04-02 | 2005-03-29 | Nanosys, Inc. | Methods of positioning and/or orienting nanostructures |
US7067867B2 (en) | 2002-09-30 | 2006-06-27 | Nanosys, Inc. | Large-area nonenabled macroelectronic substrates and uses therefor |
US7135728B2 (en) | 2002-09-30 | 2006-11-14 | Nanosys, Inc. | Large-area nanoenabled macroelectronic substrates and uses therefor |
JP4281324B2 (ja) * | 2002-10-23 | 2009-06-17 | コニカミノルタホールディングス株式会社 | 有機薄膜トランジスタ素子、その製造方法及び有機薄膜トランジスタシート |
JP2004289044A (ja) * | 2003-03-25 | 2004-10-14 | Konica Minolta Holdings Inc | 薄膜トランジスタ素子シート及び薄膜トランジスタ素子シートの作製方法 |
ITTO20030145A1 (it) * | 2003-02-28 | 2004-09-01 | Infm Istituto Naz Per La Fisi Ca Della Mater | Procedimento per la fabbricazione di dispositivi ad effetto di campo a film sottile privi di substrato e transistore a film sottile organico ottenibile mediante tale procedimento. |
JP2005028275A (ja) * | 2003-07-11 | 2005-02-03 | Seiko Epson Corp | 膜形成方法、デバイス製造方法、電気光学装置、並びに電子機器 |
JP4387721B2 (ja) * | 2003-07-31 | 2009-12-24 | キヤノン株式会社 | 記録装置および記録方法 |
JP4853607B2 (ja) * | 2004-07-09 | 2012-01-11 | セイコーエプソン株式会社 | 薄膜トランジスタの製造方法 |
WO2006013552A2 (en) | 2004-08-02 | 2006-02-09 | Ramot At Tel Aviv University Ltd. | Articles of peptide nanostructures and method of forming the same |
US7786086B2 (en) | 2004-09-08 | 2010-08-31 | Ramot At Tel-Aviv University Ltd. | Peptide nanostructures containing end-capping modified peptides and methods of generating and using the same |
WO2006033282A1 (ja) * | 2004-09-22 | 2006-03-30 | Konica Minolta Holdings, Inc. | 薄膜トランジスタと薄膜トランジスタ素子シート、及び、薄膜トランジスタと薄膜トランジスタ素子シートの作製方法 |
US7405129B2 (en) * | 2004-11-18 | 2008-07-29 | International Business Machines Corporation | Device comprising doped nano-component and method of forming the device |
JP4865999B2 (ja) * | 2004-11-19 | 2012-02-01 | 株式会社日立製作所 | 電界効果トランジスタの作製方法 |
US7125495B2 (en) * | 2004-12-20 | 2006-10-24 | Palo Alto Research Center, Inc. | Large area electronic device with high and low resolution patterned film features |
CN1976869B (zh) * | 2005-02-10 | 2010-12-22 | 松下电器产业株式会社 | 用于维持微细结构体的结构体、半导体装置、tft驱动电路、面板、显示器、传感器及它们的制造方法 |
JP4239999B2 (ja) * | 2005-05-11 | 2009-03-18 | セイコーエプソン株式会社 | 膜パターンの形成方法、膜パターン、デバイス、電気光学装置、及び電子機器 |
JP2009522197A (ja) | 2005-12-29 | 2009-06-11 | ナノシス・インコーポレイテッド | パターン形成された基板上のナノワイヤの配向した成長のための方法 |
US7851184B2 (en) | 2006-04-18 | 2010-12-14 | Advanced Liquid Logic, Inc. | Droplet-based nucleic acid amplification method and apparatus |
-
2006
- 2006-12-22 US US11/644,055 patent/US7838933B2/en active Active
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2007
- 2007-12-20 JP JP2007328274A patent/JP2008160122A/ja active Pending
- 2007-12-21 EP EP07123988.3A patent/EP1936711B1/en active Active
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2010
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2013
- 2013-07-12 JP JP2013145969A patent/JP5775908B2/ja active Active
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Also Published As
Publication number | Publication date |
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US8058113B2 (en) | 2011-11-15 |
JP2015167246A (ja) | 2015-09-24 |
JP2013251557A (ja) | 2013-12-12 |
US20080149920A1 (en) | 2008-06-26 |
US7838933B2 (en) | 2010-11-23 |
JP2008160122A (ja) | 2008-07-10 |
US20110027947A1 (en) | 2011-02-03 |
EP1936711A3 (en) | 2010-12-15 |
EP1936711B1 (en) | 2016-07-13 |
EP1936711A2 (en) | 2008-06-25 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |