JP2005184003A - 電圧可変材料、これを含む組成物、及びこれを用いた装置 - Google Patents

電圧可変材料、これを含む組成物、及びこれを用いた装置 Download PDF

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Publication number
JP2005184003A
JP2005184003A JP2004369990A JP2004369990A JP2005184003A JP 2005184003 A JP2005184003 A JP 2005184003A JP 2004369990 A JP2004369990 A JP 2004369990A JP 2004369990 A JP2004369990 A JP 2004369990A JP 2005184003 A JP2005184003 A JP 2005184003A
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Japan
Prior art keywords
vvm
particles
composition
binder
silicon
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2004369990A
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English (en)
Japanese (ja)
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JP2005184003A5 (enExample
Inventor
Edwin James Harris
エドウィン・ジェームス・ハリス
Tushar Vyas
トゥシャー・ヴィアス
Stephen J Whitney
スティーヴン・ジェイ・ウィットニー
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Littelfuse Inc
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Littelfuse Inc
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Application filed by Littelfuse Inc filed Critical Littelfuse Inc
Publication of JP2005184003A publication Critical patent/JP2005184003A/ja
Publication of JP2005184003A5 publication Critical patent/JP2005184003A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/62—Protection against overvoltage, e.g. fuses, shunts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06553—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of a combination of metals and oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/0656—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of silicides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02H—EMERGENCY PROTECTIVE CIRCUIT ARRANGEMENTS
    • H02H9/00—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection
    • H02H9/04—Emergency protective circuit arrangements for limiting excess current or voltage without disconnection responsive to excess voltage
    • H02H9/044—Physical layout, materials not provided for elsewhere
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0224—Conductive particles having an insulating coating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/073—High voltage adaptations
    • H05K2201/0738—Use of voltage responsive materials, e.g. voltage switchable dielectric or varistor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Thermistors And Varistors (AREA)
  • Conductive Materials (AREA)
  • Organic Insulating Materials (AREA)
JP2004369990A 2003-12-23 2004-12-21 電圧可変材料、これを含む組成物、及びこれを用いた装置 Pending JP2005184003A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/746,020 US7132922B2 (en) 2002-04-08 2003-12-23 Direct application voltage variable material, components thereof and devices employing same

Publications (2)

Publication Number Publication Date
JP2005184003A true JP2005184003A (ja) 2005-07-07
JP2005184003A5 JP2005184003A5 (enExample) 2005-09-29

Family

ID=34749235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004369990A Pending JP2005184003A (ja) 2003-12-23 2004-12-21 電圧可変材料、これを含む組成物、及びこれを用いた装置

Country Status (4)

Country Link
US (1) US7132922B2 (enExample)
JP (1) JP2005184003A (enExample)
CN (1) CN1637960B (enExample)
DE (1) DE102004061585A1 (enExample)

Cited By (7)

* Cited by examiner, † Cited by third party
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KR100907094B1 (ko) * 2007-06-13 2009-07-09 리더 웰 테크놀로지 컴퍼니 리미티드 이중기능을 갖는 서지 흡수재
JP2010521058A (ja) * 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
JP2010537429A (ja) * 2007-08-20 2010-12-02 ショッキング テクノロジーズ インコーポレイテッド 修飾された高アスペクト比の粒子を含む電圧で切替可能な誘電体材料
JP2013247247A (ja) * 2012-05-25 2013-12-09 Toshiba Corp 半導体発光装置
JP2015517196A (ja) * 2012-01-25 2015-06-18 リテルヒューズ・インク 電圧で切替可能な誘電体材料を備えるフレキシブル回路及びフレキシブル基板
JP2017092441A (ja) * 2015-11-16 2017-05-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 静電気放電保護用組成物及びその組成物を用いた静電気放電保護素子
US10680415B2 (en) 2016-04-13 2020-06-09 Murata Manufacturing Co., Ltd. ESD protection device and method for manufacturing the same

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WO2001017320A1 (en) 1999-08-27 2001-03-08 Lex Kosowsky Current carrying structure using voltage switchable dielectric material
US7695644B2 (en) 1999-08-27 2010-04-13 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US7825491B2 (en) 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US7446030B2 (en) 1999-08-27 2008-11-04 Shocking Technologies, Inc. Methods for fabricating current-carrying structures using voltage switchable dielectric materials
AU2003224894A1 (en) * 2002-04-08 2003-10-27 Littelfuse, Inc. Voltage variable material for direct application and devices employing same
US7923844B2 (en) 2005-11-22 2011-04-12 Shocking Technologies, Inc. Semiconductor devices including voltage switchable materials for over-voltage protection
US7981325B2 (en) 2006-07-29 2011-07-19 Shocking Technologies, Inc. Electronic device for voltage switchable dielectric material having high aspect ratio particles
US8313672B2 (en) * 2007-05-18 2012-11-20 Leader Well Technology Co., Ltd. Process for producing surge absorbing material with dual functions
US20080286582A1 (en) * 2007-05-18 2008-11-20 Leader Well Technology Co., Ltd. Surge absorbing material with dual functions
US7793236B2 (en) 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20090143216A1 (en) * 2007-12-03 2009-06-04 General Electric Company Composition and method
TWI421996B (zh) 2008-01-10 2014-01-01 財團法人工業技術研究院 靜電放電防護架構
US8206614B2 (en) * 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US20090224213A1 (en) * 2008-03-06 2009-09-10 Polytronics Technology Corporation Variable impedance composition
TWI378960B (en) * 2008-03-20 2012-12-11 Ind Tech Res Inst Organic/inorganic hybrid material of dielectric composition with electrostatic discharge protection property
US7952848B2 (en) * 2008-04-04 2011-05-31 Littelfuse, Inc. Incorporating electrostatic protection into miniature connectors
US8203421B2 (en) 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
DE102008024479A1 (de) * 2008-05-21 2009-12-03 Epcos Ag Elektrische Bauelementanordnung
US8693012B2 (en) * 2008-09-04 2014-04-08 Xerox Corporation Run cost optimization for multi-engine printing system
JP2012504870A (ja) 2008-09-30 2012-02-23 ショッキング テクノロジーズ インコーポレイテッド 導電コアシェル粒子を含有する電圧で切替可能な誘電体材料
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
US8362871B2 (en) 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US20100157492A1 (en) * 2008-12-23 2010-06-24 General Electric Company Electronic device and associated method
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US20100223860A1 (en) * 2009-03-03 2010-09-09 Sheng-Po Hu Process for preventing the encroachment of termites
KR101679099B1 (ko) 2009-03-26 2016-11-23 쇼킹 테크놀로지스 인코포레이티드 전압 스위칭형 유전 물질을 갖는 소자
US9053844B2 (en) 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
US9320135B2 (en) 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
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US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
CN102347091B (zh) * 2010-07-26 2013-03-27 比亚迪股份有限公司 一种复合银粉及其制备方法和含有该复合银粉的导电银浆
DE102011079813A1 (de) * 2011-07-26 2013-01-31 Siemens Aktiengesellschaft Spannungsbegrenzende Zusammensetzung
US9321950B2 (en) * 2012-05-11 2016-04-26 Shin-Etsu Chemical Co., Ltd. Thermally conductive silicone grease composition
JP6996976B2 (ja) * 2014-12-16 2022-01-17 アンフェノール コーポレイション プリント回路基板のための高速インターコネクト
JP6480969B2 (ja) * 2017-03-17 2019-03-13 株式会社鷺宮製作所 圧力センサ
CN110582817A (zh) * 2017-03-31 2019-12-17 东莞令特电子有限公司 包括结构弹性电气瞬态材料的电路保护设备及其制造方法
US20200185133A1 (en) * 2017-05-08 2020-06-11 Dongguan Littelfuse Electronics Company Limited Electrical transient material and method for making same
GB2588409B (en) 2019-10-22 2023-12-13 Pragmatic Printing Ltd Electronic circuits and their methods of manufacture

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US20040201941A1 (en) 2004-10-14

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