JP2005184003A - 電圧可変材料、これを含む組成物、及びこれを用いた装置 - Google Patents
電圧可変材料、これを含む組成物、及びこれを用いた装置 Download PDFInfo
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- H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
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- H01C17/0656—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of silicides
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Abstract
【解決手段】 導電及び非導電表面に固有に付着するように構成された絶縁バインダーを含む電圧可変材料(“VVM”)を提供する。バインダー及びVVMは使用前に乾燥する拡がり可能な形態で自己硬化性を有しかつ付けることができる。バインダーは、分離した装置にVVMを配置する必要性、及び、VVMに電気的に接続する分離したプリント配線板パッドを提供する必要性を除去するものである。バインダー及びVVMは、リジッド(FR−4)ラミネート、ポリイミド、又はポリマーのような異なる種類の基板に直接付けることができる。一実施形態では、VVMはシリコンであり得るコアと、酸化物であり得る不活性コーティングとを有するドープされた半導体粒子を含む。
【選択図】 図2
Description
本願は以下の同じ出願人の係属出願に関連するものである:“静電放電保護用のポリマーコンポジット材料”シリアル番号09/232,387号、アトニードケット番号0112690−020;“電圧可変基板材料”シリアル番号09/976,964号、アトニードケット番号0112690−098。
一の好適なドープ半導体粒子80を図3Aに示す。半導体粒子80は少なくとも一のドーパント84でドープされた内部コア82を含む。内部コアは外部シェル(外殻)又はコーティング86によって囲繞されている。
図3Aに示したドープ半導体コアシェル粒子は、EOS過渡電流に対抗するのに適した電圧可変材料を製造するのに多くの異なる種類の組み合わせに適している。一実施形態では、図3Aの粒子80は、ここに記載された導電性粒子90のいずれかと共に、上述のバインダー50のような絶縁バインダーにおいて混合される。一実施形態では、導電性粒子90は、実質的に酸化されていないピュアニッケルのような実質的にピュアな材料を含む。しかしながら、図3Aの粒子は、図3Bと関連して以下のコアシェル型の導電性粒子と共に用いることができる。さらに、図3Aに関連して図示された粒子80は、非ドープ半導体粒子70、導電性粒子90、及び、絶縁性粒子60と組み合わせて備えることができる。一実施形態では、ナノタングステンパウダーをさらに加える。
図4に、本質的に付着性のVVM100用の可能な一の構成115を示す。この例においては、この構成115がリジッドPCBである基板上に配備されている。PCB基板110を最終形態にするときにVVM100をオープンにし露出することを示すが多くの他の電気装置113を図示している。電気装置113は、スルーホール及び表面実装装置の両方を含むPCBに共通に結合された種々の電気装置を含む。電気装置113は、抵抗又はキャパシタのような電気的コンポーネントを含む。電気装置113は、種々の集積回路、コネクタ、フィルタ等も含む。
図11に、本発明のVVM100は装置内で用いてもよい。図11に示す装置の一種類は、ドイチェ・インスティチュート・フュア・ノームング(Deutsches Institut fur Normung)eV(“DIN”)標準を含む。本発明は、小型DINコネクタ、二重列延伸DINコネクタ、シールドDINコネク等用に対して適用される。本発明はプラグ若しくはリセプタクルに組み込まれてもよい。ケーブルに取り付けられた垂直、水平及びインラインコネクタを用いてもよい。さもなければ、DINコネクタはパネル実装されてもよい。
60 絶縁性粒子
70 半導体粒子
80 ドープ半導体粒子
82 コア
84 ドーパント
86 コーティング
100 VVM
110 基板
115、120、125、130 回路又は構成
127、129 導体
130
132、134 導体
250 炉
252 ハウジング
254 ベース
Claims (37)
- 電気過大応力に対する保護を提供する組成物であって:
絶縁性バインダーと;
ドープされたコアとそのコア上に備えたコーティングとを有する半導体粒子であって、バインダーに保持された半導体粒子と;
バインダーに保持された導電性粒子と;
を備えた組成物。 - 前記絶縁性バインダーはポリマー樹脂を含む請求項1に記載の組成物。
- 前記のドープされたコアはシリコンとドーパント材料とを含む請求項1に記載の組成物。
- 前記ドーパント材料は、アンチモン、ヒ素、リン、及びボロンから成る群から選択された少なくとも一のコンポーネントを含む請求項3に記載の組成物。
- 前記のドープされたコアは約5μmから約100μmの平均サイズを有する請求項1に記載の組成物。
- 前記コーティングは約100Åから約10,000Åの平均厚さを有する請求項1に記載の組成物。
- 前記コーティングは、二酸化シリコン、エピタキシャルシリコン、及び、ガラスから成る群から選択された少なくとも一の材料を含む請求項1に記載の組成物。
- 前記導電性粒子は単一材料から成る請求項1に記載の組成物。
- 前記導電性粒子は酸化物コーティングを含む請求項1に記載の組成物。
- 前記導電性粒子は、アルミニウム、真ちゅう、カーボンブラック、銅、グラファイト、金、鉄、ニッケル、銀、ステンレス鋼、すず、亜鉛、及びこれらの合金を含む群から選択された少なくとも一の材料を含む請求項1に記載の組成物。
- 前記導電性粒子は約5μmから約50μmの平均サイズを有する請求項1に記載の組成物。
- 装置内に封入されることなく、使用に際して直接付けられるように配備された請求項1に記載の組成物。
- 装置内に備えられるように配備された請求項1に記載の組成物。
- 絶縁性粒子、半導体粒子及びタングステンパウダーから成る群から選択された少なくとも一の添加粒子を含む請求項1に記載の組成物。
- 電気過大応力に対する保護用組成物であって:
絶縁性バインダーと;
バインダーに保持されたドープされた半導体粒子と;
バインダーに保持され、単一材料から成る導電性粒子と;を備え、
前記バインダーと、前記半導体粒子と、前記導電性粒子とが電極ギャップ内に積層されるように配備されている組成物。 - 前記ドープ半導体粒子はコアとシェルとを含む請求項15に記載の組成物。
- 前記導電性粒子は、アルミニウム、真ちゅう、カーボンブラック、銅、グラファイト、金、鉄、ニッケル、銀、ステンレス鋼、すず、亜鉛、及びこれらの合金を含む群から選択された少なくとも一の材料を含む請求項15に記載の組成物。
- 装置内に封入されることなく、使用に際して直接付けられるように配備された請求項15に記載の組成物。
- 装置内に備えられるように配備された請求項15に記載の組成物。
- 絶縁性粒子、半導体粒子及びタングステンパウダーから成る群から選択された少なくとも一の添加粒子を含む請求項15に記載の組成物。
- 電気過大応力組成物において使用される粒子であって:
ドープされた半導体コアと;
該コアを囲繞する不活性コーティングと;を備えた粒子。 - 前記のドープされたコアがシリコンとドーパント材料とを含む請求項21に記載の粒子。
- 前記ドーパント材料は、アンチモン、ヒ素、リン、及びボロンから成る群から選択された少なくとも一のコンポーネントを含む請求項22に記載の組成物。
- 前記のドープされたコアは約5μmから約100μmの平均サイズを有する請求項21に記載の組成物。
- 前記コーティングは約100Åから約10,000Åの平均厚さを有する請求項21に記載の組成物。
- 前記コーティングは、二酸化シリコン、エピタキシャルシリコン、及び、ガラスから成る群から選択された少なくとも一の材料を含む請求項21に記載の組成物。
- 電気過大応力組成物において使用される粒子であって:
シリコン内側部と;
二酸化シリコン、エピタキシャルシリコン、及び、ガラスから成る群から選択された少なくとも一の材料を含む外側部と;を備えた粒子。 - 前記外側部は熱制御環境で成長させた請求項27に記載の粒子。
- 前記外側部は流動床プラズマ炉を用いて付けられた請求項27に記載の粒子。
- 電気過大応力組成物を作製する方法であって:
シリコンに所望の抵抗率となるまでドープする段階と;
ドープされたシリコンを、ドープされたシリコン上に酸化物層を成長させる時間全体にわたって加熱させる段階と;
形成されたシリコンと酸化物材料とにバインダーを混ぜる段階と;を備えた方法。 - 溶媒においてポリマーを溶解することによって絶縁性バインダーを準備する段階を含む請求項30に記載の方法。
- ドープされたシリコンを適当な粒子サイズまでつぶす段階を含む請求項30に記載の方法。
- ドープされたシリコンを約500℃から約1500℃の温度にさらす請求項30に記載の方法。
- ドープされたシリコンを、約15分から約3時間の時間全体にわたって加熱する請求項30に記載の方法。
- ドープされたシリコンを、多段の加熱及び冷却のインターバルにさらすことを含む請求項30に記載の方法。
- ドープされたシリコンを真空下で冷却することを含む請求項35に記載の方法。
- バインダー内の形成されたシリコン及び酸化物材料を、導電性粒子、導電性コア/シェル粒子、絶縁性粒子、半導体粒子、及び、タングステンパウダーから成る群から選択された少なくとも一の添加コンポーネントに混ぜることを含む請求項35に記載の方法。
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US10/746,020 US7132922B2 (en) | 2002-04-08 | 2003-12-23 | Direct application voltage variable material, components thereof and devices employing same |
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Cited By (6)
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KR100907094B1 (ko) * | 2007-06-13 | 2009-07-09 | 리더 웰 테크놀로지 컴퍼니 리미티드 | 이중기능을 갖는 서지 흡수재 |
JP2010521058A (ja) * | 2006-09-24 | 2010-06-17 | ショッキング テクノロジーズ,インコーポレイテッド | ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法 |
JP2010537429A (ja) * | 2007-08-20 | 2010-12-02 | ショッキング テクノロジーズ インコーポレイテッド | 修飾された高アスペクト比の粒子を含む電圧で切替可能な誘電体材料 |
JP2013247247A (ja) * | 2012-05-25 | 2013-12-09 | Toshiba Corp | 半導体発光装置 |
JP2015517196A (ja) * | 2012-01-25 | 2015-06-18 | リテルヒューズ・インク | 電圧で切替可能な誘電体材料を備えるフレキシブル回路及びフレキシブル基板 |
US10680415B2 (en) | 2016-04-13 | 2020-06-09 | Murata Manufacturing Co., Ltd. | ESD protection device and method for manufacturing the same |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001017320A1 (en) | 1999-08-27 | 2001-03-08 | Lex Kosowsky | Current carrying structure using voltage switchable dielectric material |
US7825491B2 (en) | 2005-11-22 | 2010-11-02 | Shocking Technologies, Inc. | Light-emitting device using voltage switchable dielectric material |
US7695644B2 (en) | 1999-08-27 | 2010-04-13 | Shocking Technologies, Inc. | Device applications for voltage switchable dielectric material having high aspect ratio particles |
DE10392524B4 (de) * | 2002-04-08 | 2008-08-07 | OTC Littelfuse, Inc., Des Plaines | Vorrichtungen mit spannungsvariablem Material zur direkten Anwendung |
US7923844B2 (en) | 2005-11-22 | 2011-04-12 | Shocking Technologies, Inc. | Semiconductor devices including voltage switchable materials for over-voltage protection |
US7968010B2 (en) | 2006-07-29 | 2011-06-28 | Shocking Technologies, Inc. | Method for electroplating a substrate |
US8313672B2 (en) * | 2007-05-18 | 2012-11-20 | Leader Well Technology Co., Ltd. | Process for producing surge absorbing material with dual functions |
US20080286582A1 (en) * | 2007-05-18 | 2008-11-20 | Leader Well Technology Co., Ltd. | Surge absorbing material with dual functions |
US7793236B2 (en) | 2007-06-13 | 2010-09-07 | Shocking Technologies, Inc. | System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices |
US20090143216A1 (en) * | 2007-12-03 | 2009-06-04 | General Electric Company | Composition and method |
TWI421996B (zh) | 2008-01-10 | 2014-01-01 | Ind Tech Res Inst | 靜電放電防護架構 |
US8206614B2 (en) * | 2008-01-18 | 2012-06-26 | Shocking Technologies, Inc. | Voltage switchable dielectric material having bonded particle constituents |
US20090224213A1 (en) * | 2008-03-06 | 2009-09-10 | Polytronics Technology Corporation | Variable impedance composition |
TWI378960B (en) * | 2008-03-20 | 2012-12-11 | Ind Tech Res Inst | Organic/inorganic hybrid material of dielectric composition with electrostatic discharge protection property |
US7952848B2 (en) * | 2008-04-04 | 2011-05-31 | Littelfuse, Inc. | Incorporating electrostatic protection into miniature connectors |
US8203421B2 (en) | 2008-04-14 | 2012-06-19 | Shocking Technologies, Inc. | Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration |
DE102008024479A1 (de) * | 2008-05-21 | 2009-12-03 | Epcos Ag | Elektrische Bauelementanordnung |
US8693012B2 (en) * | 2008-09-04 | 2014-04-08 | Xerox Corporation | Run cost optimization for multi-engine printing system |
CN102246246A (zh) | 2008-09-30 | 2011-11-16 | 肖克科技有限公司 | 含有导电芯壳粒子的电压可切换电介质材料 |
US9208931B2 (en) | 2008-09-30 | 2015-12-08 | Littelfuse, Inc. | Voltage switchable dielectric material containing conductor-on-conductor core shelled particles |
US8362871B2 (en) | 2008-11-05 | 2013-01-29 | Shocking Technologies, Inc. | Geometric and electric field considerations for including transient protective material in substrate devices |
US20100157492A1 (en) * | 2008-12-23 | 2010-06-24 | General Electric Company | Electronic device and associated method |
US9226391B2 (en) | 2009-01-27 | 2015-12-29 | Littelfuse, Inc. | Substrates having voltage switchable dielectric materials |
US8399773B2 (en) | 2009-01-27 | 2013-03-19 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US8272123B2 (en) | 2009-01-27 | 2012-09-25 | Shocking Technologies, Inc. | Substrates having voltage switchable dielectric materials |
US20100223860A1 (en) * | 2009-03-03 | 2010-09-09 | Sheng-Po Hu | Process for preventing the encroachment of termites |
KR101679099B1 (ko) | 2009-03-26 | 2016-11-23 | 쇼킹 테크놀로지스 인코포레이티드 | 전압 스위칭형 유전 물질을 갖는 소자 |
US9053844B2 (en) | 2009-09-09 | 2015-06-09 | Littelfuse, Inc. | Geometric configuration or alignment of protective material in a gap structure for electrical devices |
US9224728B2 (en) | 2010-02-26 | 2015-12-29 | Littelfuse, Inc. | Embedded protection against spurious electrical events |
US9082622B2 (en) | 2010-02-26 | 2015-07-14 | Littelfuse, Inc. | Circuit elements comprising ferroic materials |
US9320135B2 (en) | 2010-02-26 | 2016-04-19 | Littelfuse, Inc. | Electric discharge protection for surface mounted and embedded components |
CN102347091B (zh) * | 2010-07-26 | 2013-03-27 | 比亚迪股份有限公司 | 一种复合银粉及其制备方法和含有该复合银粉的导电银浆 |
DE102011079813A1 (de) | 2011-07-26 | 2013-01-31 | Siemens Aktiengesellschaft | Spannungsbegrenzende Zusammensetzung |
WO2013168291A1 (ja) * | 2012-05-11 | 2013-11-14 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
WO2016100405A1 (en) * | 2014-12-16 | 2016-06-23 | Amphenol Corporation | High-speed interconnects for printed circuit boards |
JP6480969B2 (ja) * | 2017-03-17 | 2019-03-13 | 株式会社鷺宮製作所 | 圧力センサ |
US20210110953A1 (en) * | 2017-03-31 | 2021-04-15 | Dongguan Littelfuse Electronics Company Limited | Circuit protection apparatus including structurally resilient electrical transient material and method for making same |
WO2018205092A1 (en) * | 2017-05-08 | 2018-11-15 | Dongguan Littelfuse Electronics Co., Ltd. | Electrical transient material and method for making same |
GB2588409B (en) * | 2019-10-22 | 2023-12-13 | Pragmatic Printing Ltd | Electronic circuits and their methods of manufacture |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5145298A (ja) * | 1974-10-16 | 1976-04-17 | Hitachi Ltd | Denatsuhichokusenteikotai oyobi sonoseizoho |
JPS63100702A (ja) * | 1986-07-10 | 1988-05-02 | エオス テクノロジ−ズ インコ−ポレ−テツド | 電気的過剰ストレス防止材料および防止方法 |
Family Cites Families (144)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2273704A (en) | 1935-10-10 | 1942-02-17 | Bell Telephone Labor Inc | Electrical conducting material |
US2796505A (en) | 1952-12-22 | 1957-06-18 | Philco Corp | Precision voltage regulating element |
US2978665A (en) | 1956-07-11 | 1961-04-04 | Antioch College | Regulator device for electric current |
US3243753A (en) | 1962-11-13 | 1966-03-29 | Kohler Fred | Resistance element |
US3351882A (en) | 1964-10-09 | 1967-11-07 | Polyelectric Corp | Plastic resistance elements and methods for making same |
NL6705847A (ja) | 1967-04-26 | 1968-10-28 | ||
US3591526A (en) | 1968-01-25 | 1971-07-06 | Polyelectric Corp | Method of manufacturing a temperature sensitive,electrical resistor material |
US3619725A (en) | 1970-04-08 | 1971-11-09 | Rca Corp | Electrical fuse link |
US3685028A (en) | 1970-08-20 | 1972-08-15 | Matsushita Electric Ind Co Ltd | Process of memorizing an electric signal |
US3685026A (en) | 1970-08-20 | 1972-08-15 | Matsushita Electric Ind Co Ltd | Process of switching an electric current |
US3743897A (en) | 1971-08-05 | 1973-07-03 | Gen Electric | Hybrid circuit arrangement with metal oxide varistor shunt |
US3742420A (en) | 1971-10-21 | 1973-06-26 | J Harnden | Protective electrical feed through assemblies for enclosures for electrical devices |
JPS537120B2 (ja) * | 1972-07-06 | 1978-03-14 | ||
GB1433129A (en) | 1972-09-01 | 1976-04-22 | Raychem Ltd | Materials having non-linear resistance characteristics |
US4359414A (en) | 1972-12-22 | 1982-11-16 | E. I. Du Pont De Nemours And Company | Insulative composition for forming polymeric electric current regulating junctions |
US3858144A (en) | 1972-12-29 | 1974-12-31 | Raychem Corp | Voltage stress-resistant conductive articles |
US3823217A (en) | 1973-01-18 | 1974-07-09 | Raychem Corp | Resistivity variance reduction |
JPS5517508B2 (ja) | 1973-03-05 | 1980-05-12 | ||
US3913219A (en) | 1974-05-24 | 1975-10-21 | Lichtblau G J | Planar circuit fabrication process |
US4124747A (en) | 1974-06-04 | 1978-11-07 | Exxon Research & Engineering Co. | Conductive polyolefin sheet element |
US4330703A (en) | 1975-08-04 | 1982-05-18 | Raychem Corporation | Layered self-regulating heating article |
US4177376A (en) | 1974-09-27 | 1979-12-04 | Raychem Corporation | Layered self-regulating heating article |
US3976811A (en) | 1975-03-03 | 1976-08-24 | General Electric Company | Voltage responsive switches and methods of making |
US4177446A (en) | 1975-12-08 | 1979-12-04 | Raychem Corporation | Heating elements comprising conductive polymers capable of dimensional change |
US4388607A (en) | 1976-12-16 | 1983-06-14 | Raychem Corporation | Conductive polymer compositions, and to devices comprising such compositions |
US4164725A (en) | 1977-08-01 | 1979-08-14 | Wiebe Gerald L | Three-piece solderless plug-in electrically conducting component |
US4383942A (en) | 1977-11-21 | 1983-05-17 | Mb Associates | Apparatus and method for enhancing electrical conductivity of conductive composites and products thereof |
US4278706A (en) | 1977-12-15 | 1981-07-14 | Trx, Inc. | Method for making discrete electrical components |
US4169816A (en) | 1978-03-06 | 1979-10-02 | Exxon Research & Engineering Co. | Electrically conductive polyolefin compositions |
JPS54149856A (en) | 1978-05-17 | 1979-11-24 | Matsushita Electric Ind Co Ltd | Method of producing heat impacttproof selffexothermic positive temperature coefficient thermistor |
US4198744A (en) | 1978-08-16 | 1980-04-22 | Harris Corporation | Process for fabrication of fuse and interconnects |
US4304987A (en) | 1978-09-18 | 1981-12-08 | Raychem Corporation | Electrical devices comprising conductive polymer compositions |
US4329726A (en) | 1978-12-01 | 1982-05-11 | Raychem Corporation | Circuit protection devices comprising PTC elements |
US4367168A (en) | 1979-03-26 | 1983-01-04 | E-B Industries, Inc. | Electrically conductive composition, process for making an article using same |
US4223209A (en) | 1979-04-19 | 1980-09-16 | Raychem Corporation | Article having heating elements comprising conductive polymers capable of dimensional change |
US4318220A (en) | 1979-04-19 | 1982-03-09 | Raychem Corporation | Process for recovering heat recoverable sheet material |
US4272471A (en) | 1979-05-21 | 1981-06-09 | Raychem Corporation | Method for forming laminates comprising an electrode and a conductive polymer layer |
US4327351A (en) | 1979-05-21 | 1982-04-27 | Raychem Corporation | Laminates comprising an electrode and a conductive polymer layer |
DE3033323A1 (de) | 1979-09-11 | 1981-03-26 | Rohm Co. Ltd., Kyoto | Schutzvorrichtung fuer eine halbleitervorrichtung |
US4330704A (en) | 1980-08-08 | 1982-05-18 | Raychem Corporation | Electrical devices comprising conductive polymers |
US4331948A (en) | 1980-08-13 | 1982-05-25 | Chomerics, Inc. | High powered over-voltage protection |
JPS5799719A (en) | 1980-12-12 | 1982-06-21 | Matsushita Electric Ind Co Ltd | Macromolecular electric element |
US4554732A (en) | 1982-02-16 | 1985-11-26 | General Electric Company | High reliability electrical components |
FR2527039A1 (fr) | 1982-05-14 | 1983-11-18 | Inf Milit Spatiale Aeronaut | Dispositif de protection d'un dispositif electronique contre les tensions engendrees par un champ electromagnetique |
DE3301635A1 (de) | 1983-01-19 | 1984-07-26 | Siemens AG, 1000 Berlin und 8000 München | Herstellung von leitfaehigen kunststoffen |
US4503415A (en) | 1983-06-06 | 1985-03-05 | Commercial Enclosed Fuse Co. Of Nj | Encapsulated hot spot fuse link |
US4540969A (en) | 1983-08-23 | 1985-09-10 | Hughes Aircraft Company | Surface-metalized, bonded fuse with mechanically-stabilized end caps |
US4533896A (en) | 1983-11-28 | 1985-08-06 | Northern Telecom Limited | Fuse for thick film device |
US4626818A (en) | 1983-11-28 | 1986-12-02 | Centralab, Inc. | Device for programmable thick film networks |
US4514718A (en) | 1983-12-02 | 1985-04-30 | Emerson Electric Co. | Thermal cutoff construction, member therefor and methods of making the same |
DE3412492A1 (de) | 1984-04-03 | 1985-10-03 | Siemens AG, 1000 Berlin und 8000 München | Elektrischer kondensator als chip-bauelement |
US5399295A (en) * | 1984-06-11 | 1995-03-21 | The Dow Chemical Company | EMI shielding composites |
US4724417A (en) | 1985-03-14 | 1988-02-09 | Raychem Corporation | Electrical devices comprising cross-linked conductive polymers |
US4685025A (en) | 1985-03-14 | 1987-08-04 | Raychem Corporation | Conductive polymer circuit protection devices having improved electrodes |
US4884163A (en) | 1985-03-14 | 1989-11-28 | Raychem Corporation | Conductive polymer devices |
US4774024A (en) | 1985-03-14 | 1988-09-27 | Raychem Corporation | Conductive polymer compositions |
US4857880A (en) | 1985-03-14 | 1989-08-15 | Raychem Corporation | Electrical devices comprising cross-linked conductive polymers |
US4612529A (en) | 1985-03-25 | 1986-09-16 | Cooper Industries, Inc. | Subminiature fuse |
US4837520A (en) | 1985-03-29 | 1989-06-06 | Honeywell Inc. | Fuse status detection circuit |
ES8900238A1 (es) | 1985-03-29 | 1989-04-01 | Raychem Ltd | Un conectador electrico para conectar una pluralidad de lineas electricas. |
US4689475A (en) | 1985-10-15 | 1987-08-25 | Raychem Corporation | Electrical devices containing conductive polymers |
JPS6290236A (ja) | 1985-10-16 | 1987-04-24 | 新日本製鐵株式会社 | 電気抵抗溶接性と接着強度の優れた樹脂複合鋼板 |
ATE103095T1 (de) | 1986-01-14 | 1994-04-15 | Raychem Corp | Leitfaehige polymerzusammensetzung. |
US4801785A (en) | 1986-01-14 | 1989-01-31 | Raychem Corporation | Electrical devices |
DE3603386A1 (de) | 1986-02-05 | 1987-08-06 | Adolff J F Ag | Kuenstlicher rasen mit spielfeldmarkierungen |
US4792781A (en) | 1986-02-21 | 1988-12-20 | Tdk Corporation | Chip-type resistor |
US4652848A (en) | 1986-06-06 | 1987-03-24 | Northern Telecom Limited | Fusible link |
US5303523A (en) * | 1986-10-02 | 1994-04-19 | Hand Herbert H | Pest preventer for location on a structural foundation support or a structure supporting a food source |
US5155462A (en) | 1987-01-22 | 1992-10-13 | Morrill Glasstek, Inc. | Sub-miniature electrical component, particularly a fuse |
US4720402A (en) | 1987-01-30 | 1988-01-19 | American Telephone And Telegraph Company | Method for dispensing viscous material |
US4771260A (en) | 1987-03-24 | 1988-09-13 | Cooper Industries, Inc. | Wire bonded microfuse and method of making |
JPH0813902B2 (ja) | 1987-07-02 | 1996-02-14 | ライオン株式会社 | 導電性樹脂組成物 |
US4869930A (en) | 1987-07-10 | 1989-09-26 | International Business Machines Corporation | Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization |
US5106538A (en) | 1987-07-21 | 1992-04-21 | Raychem Corporation | Conductive polymer composition |
US4907340A (en) | 1987-09-30 | 1990-03-13 | Raychem Corporation | Electrical device comprising conductive polymers |
US4924074A (en) | 1987-09-30 | 1990-05-08 | Raychem Corporation | Electrical device comprising conductive polymers |
JPH01141925A (ja) | 1987-11-30 | 1989-06-02 | Honshu Paper Co Ltd | パラ配向アラミド繊維シートを基材とする改良複合材料 |
US4878038A (en) | 1987-12-07 | 1989-10-31 | Tsai James T | Circuit protection device |
US5068634A (en) | 1988-01-11 | 1991-11-26 | Electromer Corporation | Overvoltage protection device and material |
US4977357A (en) | 1988-01-11 | 1990-12-11 | Shrier Karen P | Overvoltage protection device and material |
US4873506A (en) | 1988-03-09 | 1989-10-10 | Cooper Industries, Inc. | Metallo-organic film fractional ampere fuses and method of making |
US4882466A (en) | 1988-05-03 | 1989-11-21 | Raychem Corporation | Electrical devices comprising conductive polymers |
US4910389A (en) | 1988-06-03 | 1990-03-20 | Raychem Corporation | Conductive polymer compositions |
US4980541A (en) | 1988-09-20 | 1990-12-25 | Raychem Corporation | Conductive polymer composition |
US4992333A (en) | 1988-11-18 | 1991-02-12 | G&H Technology, Inc. | Electrical overstress pulse protection |
US5068061A (en) | 1989-12-08 | 1991-11-26 | The Dow Chemical Company | Electroconductive polymers containing carbonaceous fibers |
US4975551A (en) | 1989-12-22 | 1990-12-04 | S & C Electric Company | Arc-extinguishing composition and articles manufactured therefrom |
US5102712A (en) | 1990-02-13 | 1992-04-07 | Conductive Containers, Inc. | Process for conformal coating of printed circuit boards |
US5089929A (en) | 1990-03-08 | 1992-02-18 | The United States Of America As Represented By The Secretary Of The Air Force | Retrofit integrated circuit terminal protection device |
US5097246A (en) | 1990-04-16 | 1992-03-17 | Cooper Industries, Inc. | Low amperage microfuse |
US5099380A (en) | 1990-04-19 | 1992-03-24 | Electromer Corporation | Electrical connector with overvoltage protection feature |
CH682959A5 (fr) | 1990-05-04 | 1993-12-15 | Battelle Memorial Institute | Fusible. |
JPH0746235B2 (ja) * | 1990-06-04 | 1995-05-17 | 株式会社巴川製紙所 | 導電性支持体 |
US5136365A (en) | 1990-09-27 | 1992-08-04 | Motorola, Inc. | Anisotropic conductive adhesive and encapsulant material |
US5084691A (en) | 1990-10-01 | 1992-01-28 | Motorola, Inc. | Controllable fuse |
US5115220A (en) | 1991-01-03 | 1992-05-19 | Gould, Inc. | Fuse with thin film fusible element supported on a substrate |
US5148141A (en) | 1991-01-03 | 1992-09-15 | Gould Inc. | Fuse with thin film fusible element supported on a substrate |
CA2060709C (en) * | 1991-02-08 | 1996-06-04 | Kiyotaka Komori | Glass fiber forming composition, glass fibers obtained from the composition and substrate for circuit board including the glass fibers as reinforcing material |
US5142263A (en) | 1991-02-13 | 1992-08-25 | Electromer Corporation | Surface mount device with overvoltage protection feature |
CA2061644A1 (en) * | 1991-03-05 | 1992-09-06 | Hisao Tanaka | Thermoplastic resin composition |
US5183698A (en) * | 1991-03-07 | 1993-02-02 | G & H Technology, Inc. | Electrical overstress pulse protection |
US5189092A (en) * | 1991-04-08 | 1993-02-23 | Koslow Technologies Corporation | Method and apparatus for the continuous extrusion of solid articles |
US5102506A (en) | 1991-04-10 | 1992-04-07 | The Boeing Company | Zinc-based microfuse |
US5095297A (en) | 1991-05-14 | 1992-03-10 | Gould Inc. | Thin film fuse construction |
US5097247A (en) | 1991-06-03 | 1992-03-17 | North American Philips Corporation | Heat actuated fuse apparatus with solder link |
US5189387A (en) * | 1991-07-11 | 1993-02-23 | Electromer Corporation | Surface mount device with foldback switching overvoltage protection feature |
US5412865A (en) * | 1991-08-30 | 1995-05-09 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer electronic component |
IT1253683B (it) * | 1991-09-12 | 1995-08-22 | Sgs Thomson Microelectronics | Dispositivo a bassa corrente di perdita per la protezione di un circuito integrato da scariche elettrostatiche. |
US5225126A (en) * | 1991-10-03 | 1993-07-06 | Alfred University | Piezoresistive sensor |
JPH05247255A (ja) * | 1991-10-28 | 1993-09-24 | Bridgestone Corp | 電気応答性弾性体 |
US5250228A (en) * | 1991-11-06 | 1993-10-05 | Raychem Corporation | Conductive polymer composition |
US5294374A (en) * | 1992-03-20 | 1994-03-15 | Leviton Manufacturing Co., Inc. | Electrical overstress materials and method of manufacture |
JP2921722B2 (ja) * | 1992-06-10 | 1999-07-19 | 三菱マテリアル株式会社 | チップ型サージアブソーバ |
US5278535A (en) * | 1992-08-11 | 1994-01-11 | G&H Technology, Inc. | Electrical overstress pulse protection |
US5393597A (en) * | 1992-09-23 | 1995-02-28 | The Whitaker Corporation | Overvoltage protection element |
US5483166A (en) * | 1993-04-02 | 1996-01-09 | Olsen; Ib I. | Electrochemical test cell for conductivity and transport measurements |
US5594611A (en) * | 1994-01-12 | 1997-01-14 | Lsi Logic Corporation | Integrated circuit input/output ESD protection circuit with gate voltage regulation and parasitic zener and junction diode |
US5537108A (en) * | 1994-02-08 | 1996-07-16 | Prolinx Labs Corporation | Method and structure for programming fuses |
US5545910A (en) * | 1994-04-13 | 1996-08-13 | Winbond Electronics Corp. | ESD proctection device |
US6191928B1 (en) * | 1994-05-27 | 2001-02-20 | Littelfuse, Inc. | Surface-mountable device for protection against electrostatic damage to electronic components |
CA2192363C (en) * | 1994-06-08 | 2005-10-25 | Daniel A. Chandler | Electrical devices containing conductive polymers |
CN1113369C (zh) * | 1994-06-09 | 2003-07-02 | 雷伊化学公司 | 包含正温度系数导电聚合物元件的电路保护器件和制造该器件的方法 |
JP3757419B2 (ja) * | 1994-07-14 | 2006-03-22 | サージックス コーポレイション | 可変電圧保護構造及びその製造方法 |
DE19507313C2 (de) * | 1995-03-02 | 1996-12-19 | Siemens Ag | Halbleiterbauelement mit Schutzstruktur zum Schutz vor elektrostatischer Entladung |
CA2215903A1 (en) * | 1995-03-22 | 1996-10-03 | Raychem Corporation | Conductive polymer composition and device |
US5592016A (en) * | 1995-04-14 | 1997-01-07 | Actel Corporation | Antifuse with improved antifuse material |
US5610436A (en) * | 1995-06-07 | 1997-03-11 | Bourns, Inc. | Surface mount device with compensation for thermal expansion effects |
US5756007A (en) * | 1995-11-16 | 1998-05-26 | Lucent Technologies Inc. | Composition for protection of devices |
US5742223A (en) * | 1995-12-07 | 1998-04-21 | Raychem Corporation | Laminar non-linear device with magnetically aligned particles |
US5763320A (en) * | 1995-12-11 | 1998-06-09 | Stevens; Gary Don | Boron doping a semiconductor particle |
US5777368A (en) * | 1996-05-13 | 1998-07-07 | Winbond Electronics Corp. | Electrostatic discharge protection device and its method of fabrication |
KR100219080B1 (ko) * | 1996-08-09 | 1999-09-01 | 김영환 | 반도체 장치의 패키지용 리드프레임 및 반도체 장치 |
JP3394438B2 (ja) * | 1997-03-13 | 2003-04-07 | 日本碍子株式会社 | コンポジットptc材料 |
TW394961B (en) * | 1997-03-20 | 2000-06-21 | Ceratech Corp | Low capacitance chip varistor and fabrication method thereof |
JPH10321974A (ja) * | 1997-05-22 | 1998-12-04 | Matsushita Electric Ind Co Ltd | 回路形成用基板 |
US6251513B1 (en) * | 1997-11-08 | 2001-06-26 | Littlefuse, Inc. | Polymer composites for overvoltage protection |
US5985173A (en) * | 1997-11-18 | 1999-11-16 | Gray; Henry F. | Phosphors having a semiconductor host surrounded by a shell |
US6242078B1 (en) * | 1998-07-28 | 2001-06-05 | Isola Laminate Systems Corp. | High density printed circuit substrate and method of fabrication |
US6351011B1 (en) * | 1998-12-08 | 2002-02-26 | Littlefuse, Inc. | Protection of an integrated circuit with voltage variable materials |
US6357890B1 (en) * | 2000-09-01 | 2002-03-19 | Armament Systems And Procedures, Inc. | Miniature LED flashlight |
US6263937B1 (en) * | 1999-05-27 | 2001-07-24 | Are Industries, Inc. | Apparatus for making resin-impregnated fiber substrates |
JP3503548B2 (ja) * | 1999-11-12 | 2004-03-08 | 株式会社村田製作所 | 電圧非直線抵抗体及びその製造方法、並びに、この電圧非直線抵抗体を用いたバリスタ |
US6472972B1 (en) * | 2000-02-03 | 2002-10-29 | Ngk Insulators, Ltd. | PTC composite material |
JP3598935B2 (ja) * | 2000-03-15 | 2004-12-08 | 株式会社村田製作所 | 電圧非直線抵抗体、その製造方法及びバリスタ |
-
2003
- 2003-12-23 US US10/746,020 patent/US7132922B2/en not_active Expired - Lifetime
-
2004
- 2004-12-21 DE DE102004061585A patent/DE102004061585A1/de not_active Withdrawn
- 2004-12-21 JP JP2004369990A patent/JP2005184003A/ja active Pending
- 2004-12-23 CN CN2004101024851A patent/CN1637960B/zh not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5145298A (ja) * | 1974-10-16 | 1976-04-17 | Hitachi Ltd | Denatsuhichokusenteikotai oyobi sonoseizoho |
JPS63100702A (ja) * | 1986-07-10 | 1988-05-02 | エオス テクノロジ−ズ インコ−ポレ−テツド | 電気的過剰ストレス防止材料および防止方法 |
Cited By (8)
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JP2010521058A (ja) * | 2006-09-24 | 2010-06-17 | ショッキング テクノロジーズ,インコーポレイテッド | ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法 |
KR100907094B1 (ko) * | 2007-06-13 | 2009-07-09 | 리더 웰 테크놀로지 컴퍼니 리미티드 | 이중기능을 갖는 서지 흡수재 |
JP2010537429A (ja) * | 2007-08-20 | 2010-12-02 | ショッキング テクノロジーズ インコーポレイテッド | 修飾された高アスペクト比の粒子を含む電圧で切替可能な誘電体材料 |
JP2015517196A (ja) * | 2012-01-25 | 2015-06-18 | リテルヒューズ・インク | 電圧で切替可能な誘電体材料を備えるフレキシブル回路及びフレキシブル基板 |
JP2013247247A (ja) * | 2012-05-25 | 2013-12-09 | Toshiba Corp | 半導体発光装置 |
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US10680415B2 (en) | 2016-04-13 | 2020-06-09 | Murata Manufacturing Co., Ltd. | ESD protection device and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
DE102004061585A1 (de) | 2005-08-11 |
US7132922B2 (en) | 2006-11-07 |
CN1637960B (zh) | 2012-06-20 |
CN1637960A (zh) | 2005-07-13 |
US20040201941A1 (en) | 2004-10-14 |
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