JP2005101028A - 基板処理装置 - Google Patents
基板処理装置 Download PDFInfo
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- JP2005101028A JP2005101028A JP2003329416A JP2003329416A JP2005101028A JP 2005101028 A JP2005101028 A JP 2005101028A JP 2003329416 A JP2003329416 A JP 2003329416A JP 2003329416 A JP2003329416 A JP 2003329416A JP 2005101028 A JP2005101028 A JP 2005101028A
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- 238000012545 processing Methods 0.000 claims description 328
- 238000001816 cooling Methods 0.000 claims description 77
- 230000008569 process Effects 0.000 claims description 33
- 101000582989 Homo sapiens Phospholipid phosphatase-related protein type 4 Proteins 0.000 abstract description 41
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- 230000032258 transport Effects 0.000 description 123
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- 102100030373 HSPB1-associated protein 1 Human genes 0.000 description 44
- 101000843045 Homo sapiens HSPB1-associated protein 1 Proteins 0.000 description 44
- 230000007246 mechanism Effects 0.000 description 28
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- 229920002120 photoresistant polymer Polymers 0.000 description 8
- 239000007788 liquid Substances 0.000 description 7
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- 102100026533 Cytochrome P450 1A2 Human genes 0.000 description 5
- 101000855342 Homo sapiens Cytochrome P450 1A2 Proteins 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 4
- 238000007726 management method Methods 0.000 description 4
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- 238000001514 detection method Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
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- 101100322810 Arabidopsis thaliana AHL1 gene Proteins 0.000 description 2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67184—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the presence of more than one transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Automation & Control Theory (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
【解決手段】セルコントローラは、搬送ロボットの動作を制御して、後投入ロットの基板の搬送が先投入ロットの基板の搬送に干渉しないように、搬送サイクル4で加熱部PHP1に搬入された後投入ロットの基板B1が、次の搬送サイクル5で加熱部PHP1から搬出されないようにしている。このように、後投入ロットの基板搬送と先投入ロットの基板搬送とが干渉しそうになる場合に、後投入ロットの基板を搬送せずに処理ユニットに残存させることによって、次の搬送サイクルだけを考慮して後投入ロットの基板搬送を行うことが可能になる。
【選択図】図9
Description
28 ホットプレート
CC セルコントローラ
CP1〜CP13 冷却処理ユニット
HP1〜HP11 加熱処理ユニット
PASS1〜PASS10 基板載置部
PHP1〜PHP12 加熱部
W 基板
Claims (3)
- 基板が搬送される複数の搬送対象部と、
第1の搬送順序が定められた先投入ロットの基板と、前記第1の搬送順序とは異なる第2の搬送順序が定められた後投入ロットの基板とに対して、前記複数の搬送対象部の間で循環搬送を順次行う搬送手段と、
前記搬送手段の動作制御を行う動作制御手段と
を備え、
前記複数の搬送対象部は、基板に対して所定の処理を行う少なくとも一つの処理ユニットを含み、
前記動作制御手段は、
新たな搬送サイクルにおいて、前記後投入ロットの基板の搬送と、前記先投入ロットの基板の搬送との間に干渉が生じるか否かを、前記第1と第2の搬送順序を表現した情報に基づいて予測的に判定する判定手段と、
前記干渉が生じると判定されたときには、当該新たな搬送サイクルにおいて、前記後投入ロットの基板のうちいずれかの処理ユニットに滞在中であって当該処理ユニットからの搬出によって前記干渉の原因となる特定の基板の搬送をとばして、前記特定の基板を当該処理ユニットに残存させつつ、当該新たな搬送サイクルを実行させる搬送サイクル修正手段と、
を備えることを特徴とする基板処理装置。 - 第1の基板載置部を更に備え、
前記複数の搬送対象部は第2の基板載置部を含み、
前記搬送手段は、
前記第1の基板載置部に置かれた基板を前記複数の搬送対象部に搬送し、
前記少なくとも一つの処理ユニットでの処理が完了した基板を前記第2の基板載置部に載置することを特徴する請求項1に記載の基板処理装置。 - 前記少なくとも一つの処理ユニットは加熱部を含み、
前記加熱部は、
搬送されてきた基板に対して加熱処理を行う加熱手段と、
前記加熱手段で加熱された基板を保持して、当該基板に対して冷却処理を行う保持アームと
を有することを特徴とする請求項1及び請求項2のいずれか一つに記載の基板処理装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003329416A JP4080405B2 (ja) | 2003-09-22 | 2003-09-22 | 基板処理装置 |
US10/947,000 US7497912B2 (en) | 2003-09-22 | 2004-09-22 | Substrate processing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003329416A JP4080405B2 (ja) | 2003-09-22 | 2003-09-22 | 基板処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005101028A true JP2005101028A (ja) | 2005-04-14 |
JP4080405B2 JP4080405B2 (ja) | 2008-04-23 |
Family
ID=34308858
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Application Number | Title | Priority Date | Filing Date |
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JP2003329416A Expired - Lifetime JP4080405B2 (ja) | 2003-09-22 | 2003-09-22 | 基板処理装置 |
Country Status (2)
Country | Link |
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US (1) | US7497912B2 (ja) |
JP (1) | JP4080405B2 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008251978A (ja) * | 2007-03-30 | 2008-10-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2009146975A (ja) * | 2007-12-12 | 2009-07-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010045125A (ja) * | 2008-08-11 | 2010-02-25 | Tokyo Electron Ltd | 塗布、現像装置、その方法及び記憶媒体 |
JP2010171249A (ja) * | 2009-01-23 | 2010-08-05 | Sokudo Co Ltd | 基板処理装置 |
JP2014135381A (ja) * | 2013-01-10 | 2014-07-24 | Sokudo Co Ltd | 基板処理装置および基板処理方法 |
JP2018029125A (ja) * | 2016-08-18 | 2018-02-22 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7904182B2 (en) * | 2005-06-08 | 2011-03-08 | Brooks Automation, Inc. | Scalable motion control system |
JP4492875B2 (ja) * | 2005-06-21 | 2010-06-30 | 東京エレクトロン株式会社 | 基板処理システム及び基板処理方法 |
JP5355590B2 (ja) * | 2008-12-12 | 2013-11-27 | 芝浦メカトロニクス株式会社 | 基板冷却装置および基板処理システム |
JP5402284B2 (ja) * | 2008-12-18 | 2014-01-29 | 株式会社安川電機 | 基板搬送ロボット、基板搬送装置、半導体製造装置および基板搬送ロボットの干渉物回避方法 |
US8703581B2 (en) * | 2011-06-15 | 2014-04-22 | Applied Materials, Inc. | Water soluble mask for substrate dicing by laser and plasma etch |
JP6105982B2 (ja) * | 2012-09-21 | 2017-03-29 | 株式会社Screenホールディングス | スケジュール作成装置、基板処理装置、スケジュール作成プログラム、スケジュール作成方法、および基板処理方法 |
JP6748524B2 (ja) * | 2015-09-30 | 2020-09-02 | 芝浦メカトロニクス株式会社 | 基板処理装置及び基板処理方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2918464B2 (ja) | 1994-04-08 | 1999-07-12 | 大日本スクリーン製造株式会社 | 基板処理装置 |
KR100198477B1 (ko) * | 1994-04-08 | 1999-06-15 | 이시다 아키라 | 기판처리장치 및 방법 |
JP2994553B2 (ja) * | 1994-04-08 | 1999-12-27 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JPH07297258A (ja) * | 1994-04-26 | 1995-11-10 | Tokyo Electron Ltd | 板状体の搬送装置 |
US5975740A (en) * | 1996-05-28 | 1999-11-02 | Applied Materials, Inc. | Apparatus, method and medium for enhancing the throughput of a wafer processing facility using a multi-slot cool down chamber and a priority transfer scheme |
JP3600692B2 (ja) | 1996-07-05 | 2004-12-15 | 大日本スクリーン製造株式会社 | 基板処理装置 |
US5928389A (en) * | 1996-10-21 | 1999-07-27 | Applied Materials, Inc. | Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool |
US6122566A (en) * | 1998-03-03 | 2000-09-19 | Applied Materials Inc. | Method and apparatus for sequencing wafers in a multiple chamber, semiconductor wafer processing system |
US6336204B1 (en) * | 1998-05-07 | 2002-01-01 | Applied Materials, Inc. | Method and apparatus for handling deadlocks in multiple chamber cluster tools |
JP3851751B2 (ja) | 1999-03-24 | 2006-11-29 | 東京エレクトロン株式会社 | 処理システム |
JP4014192B2 (ja) | 1999-09-16 | 2007-11-28 | 東京エレクトロン株式会社 | 基板処理装置 |
JP2002134592A (ja) * | 2000-10-19 | 2002-05-10 | Tokyo Ohka Kogyo Co Ltd | 熱処理装置および熱処理方法 |
JP2003007795A (ja) | 2001-06-19 | 2003-01-10 | Tokyo Electron Ltd | 基板処理装置 |
-
2003
- 2003-09-22 JP JP2003329416A patent/JP4080405B2/ja not_active Expired - Lifetime
-
2004
- 2004-09-22 US US10/947,000 patent/US7497912B2/en active Active
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008251978A (ja) * | 2007-03-30 | 2008-10-16 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2009146975A (ja) * | 2007-12-12 | 2009-07-02 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2010045125A (ja) * | 2008-08-11 | 2010-02-25 | Tokyo Electron Ltd | 塗布、現像装置、その方法及び記憶媒体 |
JP4640469B2 (ja) * | 2008-08-11 | 2011-03-02 | 東京エレクトロン株式会社 | 塗布、現像装置、その方法及び記憶媒体 |
KR101410592B1 (ko) | 2008-08-11 | 2014-06-20 | 도쿄엘렉트론가부시키가이샤 | 도포, 현상 장치, 그 방법 및 기억 매체 |
JP2010171249A (ja) * | 2009-01-23 | 2010-08-05 | Sokudo Co Ltd | 基板処理装置 |
JP2014135381A (ja) * | 2013-01-10 | 2014-07-24 | Sokudo Co Ltd | 基板処理装置および基板処理方法 |
JP2018029125A (ja) * | 2016-08-18 | 2018-02-22 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
US10656524B2 (en) | 2016-08-18 | 2020-05-19 | SCREEN Holdings Co., Ltd. | Substrate processing apparatus including transport device |
Also Published As
Publication number | Publication date |
---|---|
US7497912B2 (en) | 2009-03-03 |
US20050061248A1 (en) | 2005-03-24 |
JP4080405B2 (ja) | 2008-04-23 |
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