JP2005085089A5 - - Google Patents

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Publication number
JP2005085089A5
JP2005085089A5 JP2003318099A JP2003318099A JP2005085089A5 JP 2005085089 A5 JP2005085089 A5 JP 2005085089A5 JP 2003318099 A JP2003318099 A JP 2003318099A JP 2003318099 A JP2003318099 A JP 2003318099A JP 2005085089 A5 JP2005085089 A5 JP 2005085089A5
Authority
JP
Japan
Prior art keywords
manufacturing
card
mold
tape substrate
card according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003318099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005085089A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2003318099A priority Critical patent/JP2005085089A/ja
Priority claimed from JP2003318099A external-priority patent/JP2005085089A/ja
Priority to EP04254322A priority patent/EP1515269A3/en
Priority to CNA2004100703215A priority patent/CN1595439A/zh
Priority to US10/902,024 priority patent/US7176060B2/en
Publication of JP2005085089A publication Critical patent/JP2005085089A/ja
Publication of JP2005085089A5 publication Critical patent/JP2005085089A5/ja
Pending legal-status Critical Current

Links

JP2003318099A 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法 Pending JP2005085089A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003318099A JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法
EP04254322A EP1515269A3 (en) 2003-09-10 2004-07-19 An integrated circuit card and a method of manufacturing the same
CNA2004100703215A CN1595439A (zh) 2003-09-10 2004-07-29 集成电路卡及其制造方法
US10/902,024 US7176060B2 (en) 2003-09-10 2004-07-30 Integrated circuit card and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003318099A JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2005085089A JP2005085089A (ja) 2005-03-31
JP2005085089A5 true JP2005085089A5 (enExample) 2006-10-26

Family

ID=34131994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003318099A Pending JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法

Country Status (4)

Country Link
US (1) US7176060B2 (enExample)
EP (1) EP1515269A3 (enExample)
JP (1) JP2005085089A (enExample)
CN (1) CN1595439A (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8301884B2 (en) 2002-09-16 2012-10-30 Samsung Electronics Co., Ltd. Method of managing metadata
EP1784765A2 (en) * 2004-06-30 2007-05-16 Koninklijke Philips Electronics N.V. Chip card for insertion into a holder
DE502005007956D1 (de) * 2005-11-14 2009-10-01 Tyco Electronics Amp Gmbh Smartcard-Körper, Smartcard und Herstellungsverfahren
JP4989323B2 (ja) * 2007-06-12 2012-08-01 株式会社ディスコ メモリカードの製造方法
DE102008005320A1 (de) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Kartenförmiger Datenträger
JP5207868B2 (ja) 2008-02-08 2013-06-12 ルネサスエレクトロニクス株式会社 半導体装置
US8030746B2 (en) * 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package
US20140025520A1 (en) * 2008-06-06 2014-01-23 Ebay Inc. Biometric authentication of mobile financial transactions by trusted service managers
US20090307140A1 (en) * 2008-06-06 2009-12-10 Upendra Mardikar Mobile device over-the-air (ota) registration and point-of-sale (pos) payment
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US8862767B2 (en) 2011-09-02 2014-10-14 Ebay Inc. Secure elements broker (SEB) for application communication channel selector optimization
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
EP2605188A1 (fr) * 2011-12-14 2013-06-19 Gemalto SA Procédé de fabrication de cartes à puce
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
JP5952074B2 (ja) * 2012-04-27 2016-07-13 ラピスセミコンダクタ株式会社 半導体装置及び計測機器
JP2014063313A (ja) * 2012-09-20 2014-04-10 Toshiba Corp 小型ｉｃカードの製造方法
JP6880128B2 (ja) * 2019-09-04 2021-06-02 三菱電機株式会社 電子機器ユニット
CN116529735B (zh) * 2020-10-30 2024-03-05 凤凰解决方案股份有限公司 橡胶产品用rfid标签以及橡胶产品用rfid标签的制造方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2586831B2 (ja) * 1994-09-22 1997-03-05 日本電気株式会社 樹脂封止用金型および半導体装置の製造方法
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US6171888B1 (en) * 1996-03-08 2001-01-09 Lsi Logic Corp. Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
US6177288B1 (en) * 1998-06-19 2001-01-23 National Semiconductor Corporation Method of making integrated circuit packages
JP2000012745A (ja) * 1998-06-24 2000-01-14 Nec Corp 半導体パッケージおよびその製造方法
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2797977B1 (fr) * 1999-08-25 2004-09-24 Gemplus Card Int Procede de fabrication d'un dispositif electronique portable comportant une etape de surmoulage directement sur le film support
JP3768761B2 (ja) * 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
JP2001274316A (ja) * 2000-03-23 2001-10-05 Hitachi Ltd 半導体装置及びその製造方法
WO2001084490A1 (fr) 2000-04-28 2001-11-08 Hitachi,Ltd Carte a circuit integre
JP2001344583A (ja) 2000-06-01 2001-12-14 Dainippon Printing Co Ltd Ｉｃキャリア
US6824063B1 (en) 2000-08-04 2004-11-30 Sandisk Corporation Use of small electronic circuit cards with different interfaces in an electronic system
JP2003086750A (ja) * 2001-09-11 2003-03-20 Rohm Co Ltd 電子部品の製造方法
US6965160B2 (en) * 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
JP4159431B2 (ja) * 2002-11-15 2008-10-01 株式会社ルネサステクノロジ 半導体装置の製造方法

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