JP2005085089A - Ｉｃカードおよびその製造方法 - Google Patents

Ｉｃカードおよびその製造方法 Download PDF

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Publication number
JP2005085089A
JP2005085089A JP2003318099A JP2003318099A JP2005085089A JP 2005085089 A JP2005085089 A JP 2005085089A JP 2003318099 A JP2003318099 A JP 2003318099A JP 2003318099 A JP2003318099 A JP 2003318099A JP 2005085089 A JP2005085089 A JP 2005085089A
Authority
JP
Japan
Prior art keywords
tape substrate
mold resin
plug
chip
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003318099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005085089A5 (enExample
Inventor
Nobuaki Yamada
信昭 山田
Kazunari Suzuki
一成 鈴木
Bunji Kuratomi
文司 倉冨
Hiroaki Tanaka
宏明 田中
Akira Onozawa
朗 小野澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003318099A priority Critical patent/JP2005085089A/ja
Priority to EP04254322A priority patent/EP1515269A3/en
Priority to CNA2004100703215A priority patent/CN1595439A/zh
Priority to US10/902,024 priority patent/US7176060B2/en
Publication of JP2005085089A publication Critical patent/JP2005085089A/ja
Publication of JP2005085089A5 publication Critical patent/JP2005085089A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07733—Physical layout of the record carrier the record carrier containing at least one further contact interface not conform ISO-7816
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07551—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting
    • H10W72/07554—Connecting or disconnecting of bond wires characterised by changes in properties of the bond wires during the connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2003318099A 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法 Pending JP2005085089A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003318099A JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法
EP04254322A EP1515269A3 (en) 2003-09-10 2004-07-19 An integrated circuit card and a method of manufacturing the same
CNA2004100703215A CN1595439A (zh) 2003-09-10 2004-07-29 集成电路卡及其制造方法
US10/902,024 US7176060B2 (en) 2003-09-10 2004-07-30 Integrated circuit card and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003318099A JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2005085089A true JP2005085089A (ja) 2005-03-31
JP2005085089A5 JP2005085089A5 (enExample) 2006-10-26

Family

ID=34131994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003318099A Pending JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法

Country Status (4)

Country Link
US (1) US7176060B2 (enExample)
EP (1) EP1515269A3 (enExample)
JP (1) JP2005085089A (enExample)
CN (1) CN1595439A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007141238A (ja) * 2005-11-14 2007-06-07 Tyco Electronics France Sas スマートカード本体、スマートカード及びその製造方法
JP2008310400A (ja) * 2007-06-12 2008-12-25 Disco Abrasive Syst Ltd メモリカードの製造方法
US8301884B2 (en) 2002-09-16 2012-10-30 Samsung Electronics Co., Ltd. Method of managing metadata
JP2014063313A (ja) * 2012-09-20 2014-04-10 Toshiba Corp 小型ｉｃカードの製造方法
JP2021040057A (ja) * 2019-09-04 2021-03-11 三菱電機株式会社 電子機器ユニット
JP7016200B1 (ja) * 2020-10-30 2022-02-04 株式会社フェニックスソリューション ゴム製品用ｒｆｉｄタグ及びゴム製品用ｒｆｉｄタグの製造方法

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006003548A2 (en) * 2004-06-30 2006-01-12 Koninklijke Philips Electronics N.V. Chip card for insertion into a holder
DE102008005320A1 (de) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Kartenförmiger Datenträger
JP5207868B2 (ja) * 2008-02-08 2013-06-12 ルネサスエレクトロニクス株式会社 半導体装置
US8030746B2 (en) * 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package
US20140025520A1 (en) * 2008-06-06 2014-01-23 Ebay Inc. Biometric authentication of mobile financial transactions by trusted service managers
US20090307140A1 (en) 2008-06-06 2009-12-10 Upendra Mardikar Mobile device over-the-air (ota) registration and point-of-sale (pos) payment
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US8862767B2 (en) 2011-09-02 2014-10-14 Ebay Inc. Secure elements broker (SEB) for application communication channel selector optimization
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
EP2605188A1 (fr) 2011-12-14 2013-06-19 Gemalto SA Procédé de fabrication de cartes à puce
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
USD701864S1 (en) 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
JP5952074B2 (ja) 2012-04-27 2016-07-13 ラピスセミコンダクタ株式会社 半導体装置及び計測機器
US10339434B2 (en) * 2015-09-18 2019-07-02 X-Card Holdings, Llc Self-centered inlay and core layer for information carrying card, process and resulting products

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2586831B2 (ja) * 1994-09-22 1997-03-05 日本電気株式会社 樹脂封止用金型および半導体装置の製造方法
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US6171888B1 (en) * 1996-03-08 2001-01-09 Lsi Logic Corp. Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
US6177288B1 (en) * 1998-06-19 2001-01-23 National Semiconductor Corporation Method of making integrated circuit packages
JP2000012745A (ja) * 1998-06-24 2000-01-14 Nec Corp 半導体パッケージおよびその製造方法
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2797977B1 (fr) * 1999-08-25 2004-09-24 Gemplus Card Int Procede de fabrication d'un dispositif electronique portable comportant une etape de surmoulage directement sur le film support
JP3768761B2 (ja) * 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
JP2001274316A (ja) * 2000-03-23 2001-10-05 Hitachi Ltd 半導体装置及びその製造方法
CN1996351B (zh) 2000-04-28 2010-04-21 株式会社日立制作所 集成电路卡
JP2001344583A (ja) 2000-06-01 2001-12-14 Dainippon Printing Co Ltd Ｉｃキャリア
US6824063B1 (en) 2000-08-04 2004-11-30 Sandisk Corporation Use of small electronic circuit cards with different interfaces in an electronic system
JP2003086750A (ja) * 2001-09-11 2003-03-20 Rohm Co Ltd 電子部品の製造方法
US6965160B2 (en) * 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
JP4159431B2 (ja) * 2002-11-15 2008-10-01 株式会社ルネサステクノロジ 半導体装置の製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8301884B2 (en) 2002-09-16 2012-10-30 Samsung Electronics Co., Ltd. Method of managing metadata
US8555071B2 (en) 2002-09-16 2013-10-08 Samsung Electronics Co., Ltd. Method of managing metadata
JP2007141238A (ja) * 2005-11-14 2007-06-07 Tyco Electronics France Sas スマートカード本体、スマートカード及びその製造方法
JP2008310400A (ja) * 2007-06-12 2008-12-25 Disco Abrasive Syst Ltd メモリカードの製造方法
JP2014063313A (ja) * 2012-09-20 2014-04-10 Toshiba Corp 小型ｉｃカードの製造方法
JP2021040057A (ja) * 2019-09-04 2021-03-11 三菱電機株式会社 電子機器ユニット
US11411344B2 (en) 2019-09-04 2022-08-09 Mitsubishi Electric Corporation Electronic device unit
JP7016200B1 (ja) * 2020-10-30 2022-02-04 株式会社フェニックスソリューション ゴム製品用ｒｆｉｄタグ及びゴム製品用ｒｆｉｄタグの製造方法
US12265875B2 (en) 2020-10-30 2025-04-01 Phoenix Solution Co., Ltd. RFID tag for rubber product and method of manufacturing RFID tag for rubber product

Also Published As

Publication number Publication date
EP1515269A3 (en) 2007-05-16
US7176060B2 (en) 2007-02-13
CN1595439A (zh) 2005-03-16
US20050052851A1 (en) 2005-03-10
EP1515269A2 (en) 2005-03-16

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