JP2005085089A - Ｉｃカードおよびその製造方法 - Google Patents

Ｉｃカードおよびその製造方法 Download PDF

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Publication number
JP2005085089A
JP2005085089A JP2003318099A JP2003318099A JP2005085089A JP 2005085089 A JP2005085089 A JP 2005085089A JP 2003318099 A JP2003318099 A JP 2003318099A JP 2003318099 A JP2003318099 A JP 2003318099A JP 2005085089 A JP2005085089 A JP 2005085089A
Authority
JP
Japan
Prior art keywords
tape substrate
mold resin
plug
chip
mold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003318099A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005085089A5 (enExample
Inventor
Nobuaki Yamada
信昭 山田
Kazunari Suzuki
一成 鈴木
Bunji Kuratomi
文司 倉冨
Hiroaki Tanaka
宏明 田中
Akira Onozawa
朗 小野澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2003318099A priority Critical patent/JP2005085089A/ja
Priority to EP04254322A priority patent/EP1515269A3/en
Priority to CNA2004100703215A priority patent/CN1595439A/zh
Priority to US10/902,024 priority patent/US7176060B2/en
Publication of JP2005085089A publication Critical patent/JP2005085089A/ja
Publication of JP2005085089A5 publication Critical patent/JP2005085089A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07733—Physical layout of the record carrier the record carrier containing at least one further contact interface not conform ISO-7816
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/494—Connecting portions
    • H01L2224/4943—Connecting portions the connecting portions being staggered
    • H01L2224/49433—Connecting portions the connecting portions being staggered outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2003318099A 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法 Pending JP2005085089A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003318099A JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法
EP04254322A EP1515269A3 (en) 2003-09-10 2004-07-19 An integrated circuit card and a method of manufacturing the same
CNA2004100703215A CN1595439A (zh) 2003-09-10 2004-07-29 集成电路卡及其制造方法
US10/902,024 US7176060B2 (en) 2003-09-10 2004-07-30 Integrated circuit card and a method of manufacturing the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003318099A JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法

Publications (2)

Publication Number Publication Date
JP2005085089A true JP2005085089A (ja) 2005-03-31
JP2005085089A5 JP2005085089A5 (enExample) 2006-10-26

Family

ID=34131994

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003318099A Pending JP2005085089A (ja) 2003-09-10 2003-09-10 Ｉｃカードおよびその製造方法

Country Status (4)

Country Link
US (1) US7176060B2 (enExample)
EP (1) EP1515269A3 (enExample)
JP (1) JP2005085089A (enExample)
CN (1) CN1595439A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007141238A (ja) * 2005-11-14 2007-06-07 Tyco Electronics France Sas スマートカード本体、スマートカード及びその製造方法
JP2008310400A (ja) * 2007-06-12 2008-12-25 Disco Abrasive Syst Ltd メモリカードの製造方法
US8301884B2 (en) 2002-09-16 2012-10-30 Samsung Electronics Co., Ltd. Method of managing metadata
JP2014063313A (ja) * 2012-09-20 2014-04-10 Toshiba Corp 小型ｉｃカードの製造方法
JP2021040057A (ja) * 2019-09-04 2021-03-11 三菱電機株式会社 電子機器ユニット
JP7016200B1 (ja) * 2020-10-30 2022-02-04 株式会社フェニックスソリューション ゴム製品用ｒｆｉｄタグ及びゴム製品用ｒｆｉｄタグの製造方法

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EP1784765A2 (en) * 2004-06-30 2007-05-16 Koninklijke Philips Electronics N.V. Chip card for insertion into a holder
DE102008005320A1 (de) * 2008-01-21 2009-07-23 Giesecke & Devrient Gmbh Kartenförmiger Datenträger
JP5207868B2 (ja) 2008-02-08 2013-06-12 ルネサスエレクトロニクス株式会社 半導体装置
US8030746B2 (en) * 2008-02-08 2011-10-04 Infineon Technologies Ag Integrated circuit package
US20140025520A1 (en) * 2008-06-06 2014-01-23 Ebay Inc. Biometric authentication of mobile financial transactions by trusted service managers
US20090307140A1 (en) * 2008-06-06 2009-12-10 Upendra Mardikar Mobile device over-the-air (ota) registration and point-of-sale (pos) payment
USD686214S1 (en) * 2011-07-28 2013-07-16 Lifenexus, Inc. Smartcard with iChip contact pad
US8862767B2 (en) 2011-09-02 2014-10-14 Ebay Inc. Secure elements broker (SEB) for application communication channel selector optimization
US8649820B2 (en) 2011-11-07 2014-02-11 Blackberry Limited Universal integrated circuit card apparatus and related methods
EP2605188A1 (fr) * 2011-12-14 2013-06-19 Gemalto SA Procédé de fabrication de cartes à puce
USD703208S1 (en) 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
JP5952074B2 (ja) * 2012-04-27 2016-07-13 ラピスセミコンダクタ株式会社 半導体装置及び計測機器

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JP2586831B2 (ja) * 1994-09-22 1997-03-05 日本電気株式会社 樹脂封止用金型および半導体装置の製造方法
US6159770A (en) * 1995-11-08 2000-12-12 Fujitsu Limited Method and apparatus for fabricating semiconductor device
US6171888B1 (en) * 1996-03-08 2001-01-09 Lsi Logic Corp. Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same
JP3572833B2 (ja) * 1996-12-19 2004-10-06 株式会社デンソー 樹脂封止型半導体装置の製造方法
US6177288B1 (en) * 1998-06-19 2001-01-23 National Semiconductor Corporation Method of making integrated circuit packages
JP2000012745A (ja) * 1998-06-24 2000-01-14 Nec Corp 半導体パッケージおよびその製造方法
US6404643B1 (en) * 1998-10-15 2002-06-11 Amerasia International Technology, Inc. Article having an embedded electronic device, and method of making same
FR2797977B1 (fr) * 1999-08-25 2004-09-24 Gemplus Card Int Procede de fabrication d'un dispositif electronique portable comportant une etape de surmoulage directement sur le film support
JP3768761B2 (ja) * 2000-01-31 2006-04-19 株式会社日立製作所 半導体装置およびその製造方法
JP2001274316A (ja) * 2000-03-23 2001-10-05 Hitachi Ltd 半導体装置及びその製造方法
WO2001084490A1 (fr) 2000-04-28 2001-11-08 Hitachi,Ltd Carte a circuit integre
JP2001344583A (ja) 2000-06-01 2001-12-14 Dainippon Printing Co Ltd Ｉｃキャリア
US6824063B1 (en) 2000-08-04 2004-11-30 Sandisk Corporation Use of small electronic circuit cards with different interfaces in an electronic system
JP2003086750A (ja) * 2001-09-11 2003-03-20 Rohm Co Ltd 電子部品の製造方法
US6965160B2 (en) * 2002-08-15 2005-11-15 Micron Technology, Inc. Semiconductor dice packages employing at least one redistribution layer
JP4159431B2 (ja) * 2002-11-15 2008-10-01 株式会社ルネサステクノロジ 半導体装置の製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8301884B2 (en) 2002-09-16 2012-10-30 Samsung Electronics Co., Ltd. Method of managing metadata
US8555071B2 (en) 2002-09-16 2013-10-08 Samsung Electronics Co., Ltd. Method of managing metadata
JP2007141238A (ja) * 2005-11-14 2007-06-07 Tyco Electronics France Sas スマートカード本体、スマートカード及びその製造方法
JP2008310400A (ja) * 2007-06-12 2008-12-25 Disco Abrasive Syst Ltd メモリカードの製造方法
JP2014063313A (ja) * 2012-09-20 2014-04-10 Toshiba Corp 小型ｉｃカードの製造方法
JP2021040057A (ja) * 2019-09-04 2021-03-11 三菱電機株式会社 電子機器ユニット
US11411344B2 (en) 2019-09-04 2022-08-09 Mitsubishi Electric Corporation Electronic device unit
JP7016200B1 (ja) * 2020-10-30 2022-02-04 株式会社フェニックスソリューション ゴム製品用ｒｆｉｄタグ及びゴム製品用ｒｆｉｄタグの製造方法
US12265875B2 (en) 2020-10-30 2025-04-01 Phoenix Solution Co., Ltd. RFID tag for rubber product and method of manufacturing RFID tag for rubber product

Also Published As

Publication number Publication date
EP1515269A3 (en) 2007-05-16
EP1515269A2 (en) 2005-03-16
CN1595439A (zh) 2005-03-16
US7176060B2 (en) 2007-02-13
US20050052851A1 (en) 2005-03-10

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