JP2004532513A5 - - Google Patents
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- JP2004532513A5 JP2004532513A5 JP2002568402A JP2002568402A JP2004532513A5 JP 2004532513 A5 JP2004532513 A5 JP 2004532513A5 JP 2002568402 A JP2002568402 A JP 2002568402A JP 2002568402 A JP2002568402 A JP 2002568402A JP 2004532513 A5 JP2004532513 A5 JP 2004532513A5
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor structure
- substrate
- heat sink
- dissipating layer
- heat dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 22
- 239000000758 substrate Substances 0.000 claims 11
- 229910002601 GaN Inorganic materials 0.000 claims 7
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 7
- 239000000463 material Substances 0.000 claims 7
- 238000000034 method Methods 0.000 claims 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 229910052710 silicon Inorganic materials 0.000 claims 2
- 239000010703 silicon Substances 0.000 claims 2
- 230000007704 transition Effects 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 150000004767 nitrides Chemical class 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/792,409 US6956250B2 (en) | 2001-02-23 | 2001-02-23 | Gallium nitride materials including thermally conductive regions |
| PCT/US2002/005460 WO2002069373A2 (en) | 2001-02-23 | 2002-02-22 | Gallium nitride material based semiconductor devices including thermally conductive regions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004532513A JP2004532513A (ja) | 2004-10-21 |
| JP2004532513A5 true JP2004532513A5 (https=) | 2005-12-22 |
| JP4311939B2 JP4311939B2 (ja) | 2009-08-12 |
Family
ID=25156801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002568402A Expired - Fee Related JP4311939B2 (ja) | 2001-02-23 | 2002-02-22 | 熱伝導性領域を含む窒化ガリウム材料 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6956250B2 (https=) |
| EP (2) | EP1386354B1 (https=) |
| JP (1) | JP4311939B2 (https=) |
| AU (1) | AU2002306569A1 (https=) |
| TW (1) | TW529179B (https=) |
| WO (1) | WO2002069373A2 (https=) |
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| JP4801306B2 (ja) | 2000-02-09 | 2011-10-26 | ノースカロライナ ステート ユニバーシティー | 窒化ガリウム半導体構造体の製造方法および窒化ガリウム半導体構造体 |
| US6403451B1 (en) | 2000-02-09 | 2002-06-11 | Noerh Carolina State University | Methods of fabricating gallium nitride semiconductor layers on substrates including non-gallium nitride posts |
| US6261929B1 (en) | 2000-02-24 | 2001-07-17 | North Carolina State University | Methods of forming a plurality of semiconductor layers using spaced trench arrays |
| JP3751791B2 (ja) * | 2000-03-28 | 2006-03-01 | 日本電気株式会社 | ヘテロ接合電界効果トランジスタ |
| US6707074B2 (en) * | 2000-07-04 | 2004-03-16 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light-emitting device and apparatus for driving the same |
| EP1307903A1 (en) | 2000-08-04 | 2003-05-07 | The Regents Of The University Of California | Method of controlling stress in gallium nitride films deposited on substrates |
| US6649287B2 (en) * | 2000-12-14 | 2003-11-18 | Nitronex Corporation | Gallium nitride materials and methods |
| US6956250B2 (en) * | 2001-02-23 | 2005-10-18 | Nitronex Corporation | Gallium nitride materials including thermally conductive regions |
| US6611002B2 (en) * | 2001-02-23 | 2003-08-26 | Nitronex Corporation | Gallium nitride material devices and methods including backside vias |
| US6489636B1 (en) * | 2001-03-29 | 2002-12-03 | Lumileds Lighting U.S., Llc | Indium gallium nitride smoothing structures for III-nitride devices |
-
2001
- 2001-02-23 US US09/792,409 patent/US6956250B2/en not_active Expired - Lifetime
-
2002
- 2002-02-22 JP JP2002568402A patent/JP4311939B2/ja not_active Expired - Fee Related
- 2002-02-22 AU AU2002306569A patent/AU2002306569A1/en not_active Abandoned
- 2002-02-22 TW TW091103117A patent/TW529179B/zh not_active IP Right Cessation
- 2002-02-22 WO PCT/US2002/005460 patent/WO2002069373A2/en not_active Ceased
- 2002-02-22 EP EP02790164.4A patent/EP1386354B1/en not_active Expired - Lifetime
- 2002-02-22 EP EP19173082.9A patent/EP3561866A1/en not_active Withdrawn
-
2005
- 2005-02-03 US US11/050,598 patent/US20050127397A1/en not_active Abandoned
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