JP2004531634A5 - - Google Patents
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- JP2004531634A5 JP2004531634A5 JP2003509034A JP2003509034A JP2004531634A5 JP 2004531634 A5 JP2004531634 A5 JP 2004531634A5 JP 2003509034 A JP2003509034 A JP 2003509034A JP 2003509034 A JP2003509034 A JP 2003509034A JP 2004531634 A5 JP2004531634 A5 JP 2004531634A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- styrene
- resin
- poly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920005989 resin Polymers 0.000 claims 44
- 239000011347 resin Substances 0.000 claims 44
- -1 poly (arylene ether Chemical compound 0.000 claims 31
- 239000000203 mixture Substances 0.000 claims 25
- 229920001187 thermosetting polymer Polymers 0.000 claims 24
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 20
- 239000003795 chemical substances by application Substances 0.000 claims 13
- 150000001412 amines Chemical class 0.000 claims 11
- 229920002554 vinyl polymer Polymers 0.000 claims 9
- 239000011258 core-shell material Substances 0.000 claims 8
- 229920001971 elastomer Polymers 0.000 claims 8
- 239000005060 rubber Substances 0.000 claims 8
- 150000004982 aromatic amines Chemical class 0.000 claims 7
- 239000003822 epoxy resin Substances 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 229920006132 styrene block copolymer Polymers 0.000 claims 6
- DHKHKXVYLBGOIT-UHFFFAOYSA-N 1,1-Diethoxyethane Chemical compound CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 claims 5
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 4
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 4
- 229920000459 Nitrile rubber Polymers 0.000 claims 4
- 239000011354 acetal resin Substances 0.000 claims 4
- 125000000732 arylene group Chemical class 0.000 claims 4
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 claims 4
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 claims 4
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical group C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims 4
- 239000012141 concentrate Substances 0.000 claims 4
- 239000004643 cyanate ester Substances 0.000 claims 4
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 4
- 229920000768 polyamine Polymers 0.000 claims 4
- 229920001225 polyester resin Polymers 0.000 claims 4
- 239000004645 polyester resin Substances 0.000 claims 4
- 229920001721 polyimide Polymers 0.000 claims 4
- 239000009719 polyimide resin Substances 0.000 claims 4
- 229920006324 polyoxymethylene Polymers 0.000 claims 4
- 239000007787 solid Substances 0.000 claims 4
- 239000002904 solvent Substances 0.000 claims 4
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 4
- 239000004952 Polyamide Substances 0.000 claims 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical group C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims 3
- 150000002357 guanidines Chemical class 0.000 claims 3
- 229910052736 halogen Inorganic materials 0.000 claims 3
- 150000002367 halogens Chemical class 0.000 claims 3
- 150000002460 imidazoles Chemical class 0.000 claims 3
- 238000004519 manufacturing process Methods 0.000 claims 3
- 239000004014 plasticizer Substances 0.000 claims 3
- 229920002647 polyamide Polymers 0.000 claims 3
- 239000011342 resin composition Substances 0.000 claims 3
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000004103 aminoalkyl group Chemical group 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 229920001400 block copolymer Polymers 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 125000001188 haloalkyl group Chemical group 0.000 claims 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 2
- 125000004430 oxygen atom Chemical group O* 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims 2
- BGGGMYCMZTXZBY-UHFFFAOYSA-N (3-hydroxyphenyl) phosphono hydrogen phosphate Chemical group OC1=CC=CC(OP(O)(=O)OP(O)(O)=O)=C1 BGGGMYCMZTXZBY-UHFFFAOYSA-N 0.000 claims 1
- 239000004215 Carbon black (E152) Substances 0.000 claims 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims 1
- LAUIXFSZFKWUCT-UHFFFAOYSA-N [4-[2-(4-phosphonooxyphenyl)propan-2-yl]phenyl] dihydrogen phosphate Chemical compound C=1C=C(OP(O)(O)=O)C=CC=1C(C)(C)C1=CC=C(OP(O)(O)=O)C=C1 LAUIXFSZFKWUCT-UHFFFAOYSA-N 0.000 claims 1
- 150000001241 acetals Chemical class 0.000 claims 1
- KAKZBPTYRLMSJV-UHFFFAOYSA-N butadiene group Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 239000012456 homogeneous solution Substances 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- CMPQUABWPXYYSH-UHFFFAOYSA-N phenyl phosphate Chemical compound OP(O)(=O)OC1=CC=CC=C1 CMPQUABWPXYYSH-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/681,941 US7022777B2 (en) | 2001-06-28 | 2001-06-28 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
| PCT/US2002/013996 WO2003002667A2 (en) | 2001-06-28 | 2002-05-01 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004531634A JP2004531634A (ja) | 2004-10-14 |
| JP2004531634A5 true JP2004531634A5 (enExample) | 2005-12-22 |
Family
ID=24737500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003509034A Pending JP2004531634A (ja) | 2001-06-28 | 2002-05-01 | 成形用ポリ（アリーレンエーテル）熱硬化性組成物、方法及び物品 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US7022777B2 (enExample) |
| EP (1) | EP1409588A2 (enExample) |
| JP (1) | JP2004531634A (enExample) |
| KR (1) | KR100678434B1 (enExample) |
| CN (1) | CN100432150C (enExample) |
| AU (1) | AU2002305349A1 (enExample) |
| IN (1) | IN2003DE01973A (enExample) |
| SG (1) | SG152053A1 (enExample) |
| WO (1) | WO2003002667A2 (enExample) |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030215588A1 (en) * | 2002-04-09 | 2003-11-20 | Yeager Gary William | Thermoset composition, method, and article |
| EP1497372B1 (en) * | 2002-04-09 | 2007-01-17 | General Electric Company | Thermoset composition, method and article |
| JP4639806B2 (ja) * | 2002-09-30 | 2011-02-23 | 日立化成工業株式会社 | 印刷配線板用樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板 |
| KR100523594B1 (ko) * | 2002-10-24 | 2005-10-24 | 주식회사 엘지화학 | 에폭시/열가소성 수지 블렌드 조성물 |
| KR100588301B1 (ko) * | 2002-10-24 | 2006-06-09 | 주식회사 엘지화학 | 에폭시/열가소성 수지 블렌드 조성물 |
| US7250477B2 (en) * | 2002-12-20 | 2007-07-31 | General Electric Company | Thermoset composite composition, method, and article |
| FR2854900B1 (fr) * | 2003-05-16 | 2007-07-27 | Nexans | Composition pour couche adherente, conducteur electrique revetu d'une telle couche adherente et procede de fabrication d'un tel conducteur electrique |
| US6887574B2 (en) * | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
| US7157509B2 (en) | 2003-06-27 | 2007-01-02 | Henkel Corporation | Curable compositions |
| US20050042961A1 (en) * | 2003-08-18 | 2005-02-24 | Henkel Loctite Corporation | Curable compositions for advanced processes, and products made therefrom |
| US20050080185A1 (en) * | 2003-10-10 | 2005-04-14 | Mhetar Vijay R. | Poly(arylene ether) composition and method of making |
| US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
| CA2558819A1 (en) * | 2004-04-02 | 2005-10-20 | Dow Global Technologies Inc. | Amphiphilic block copolymer-toughened thermoset resins |
| US8129456B2 (en) * | 2004-09-28 | 2012-03-06 | Isola Usa Corp. | Flame retardant compositions with a phosphorated compound |
| US20060074151A1 (en) * | 2004-09-28 | 2006-04-06 | Polyclad Laminates, Inc. | Low expansion dielectric compositions |
| US7687556B2 (en) * | 2004-09-28 | 2010-03-30 | Isola Usa Corp. | Flame retardant compositions |
| US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
| US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
| US7666938B2 (en) * | 2004-12-03 | 2010-02-23 | Henkel Corporation | Nanoparticle silica filled benzoxazine compositions |
| US7411508B2 (en) * | 2005-06-17 | 2008-08-12 | Perkinemer Las, Inc. | Methods and systems for locating and identifying labware using radio-frequency identification tags |
| US7378455B2 (en) | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
| US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
| US7429800B2 (en) * | 2005-06-30 | 2008-09-30 | Sabic Innovative Plastics Ip B.V. | Molding composition and method, and molded article |
| US20070049690A1 (en) * | 2005-08-29 | 2007-03-01 | Pravin Borade | Impact modified poly(arylene ether)/polyester blends and method |
| US20080071035A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Curable poly(arylene ether) composition and method |
| US20080071036A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Cured poly(arylene ether) composition, method, and article |
| US20080076885A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
| US20080076884A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
| JP5409373B2 (ja) * | 2006-11-13 | 2014-02-05 | ヘンケル コーポレイション | コア−シェルゴムを有するベンゾキサジン組成物 |
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| US20090030141A1 (en) * | 2007-07-23 | 2009-01-29 | Kim Gene Balfour | Poly(arylene ether) composition, method, and article |
| DE102008023076A1 (de) * | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerisierbare Zusammensetzung |
| US9328058B2 (en) * | 2008-07-22 | 2016-05-03 | Basf Se | Mixtures of amines with guanidine derivatives |
| DK2307359T3 (da) | 2008-07-22 | 2012-05-07 | Basf Se | Blandinger indeholdende epoxyharpiks og blandinger af aminer og guanidin-derivater |
| PT2307360E (pt) * | 2008-07-22 | 2012-01-11 | Basf Se | Processo para a produção de corpos moldados com misturas de aminas com derivados de guanidina |
| ES2612236T3 (es) * | 2011-05-13 | 2017-05-12 | Huntsman Advanced Materials Americas Llc | Resinas epoxídicas con alta estabilidad y tenacidad |
| SG195000A1 (en) * | 2011-05-17 | 2013-12-30 | Huntsman Adv Mat Americas Inc | Halogen free thermoset resin system for low dielectric loss at high frequency applications |
| US8859672B2 (en) | 2011-06-27 | 2014-10-14 | Sabic Global Technologies B.V. | Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making |
| JP6143798B2 (ja) * | 2012-02-10 | 2017-06-07 | スリーエム イノベイティブ プロパティズ カンパニー | 耐食コーティング |
| US8552105B2 (en) | 2012-03-08 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Compatibilized composition, method for the formation thereof, and article comprising same |
| US8686079B2 (en) | 2012-04-13 | 2014-04-01 | Sabic Innovative Plastics Ip B.V. | Compatibilized composition, method for the formation thereof, and article comprising same |
| US9611385B2 (en) | 2012-06-29 | 2017-04-04 | Sabic Global Technologies B.V. | Ultrafine poly(phenylene ether) particles and compositions derived therefrom |
| CN103819870B (zh) * | 2012-11-16 | 2016-06-15 | 株式会社田村制作所 | 热固性树脂组合物、b阶化的树脂膜、金属箔、覆铜板及多层积层基板 |
| US8865823B2 (en) | 2013-02-01 | 2014-10-21 | Sabic Global Technologies B.V. | Triblock copolymer, method for its formation, and compatibilized compositions comprising it |
| US20150028247A1 (en) | 2013-07-23 | 2015-01-29 | Sabic Innovative Plastics Ip B.V. | Rigid foam and associated article and method |
| US9296916B2 (en) * | 2013-08-09 | 2016-03-29 | Sabic Global Technologies B.V. | Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same |
| US9447227B2 (en) | 2013-10-03 | 2016-09-20 | Sabic Global Technologies B.V. | Flexible polyurethane foam and associated method and article |
| CN103740033A (zh) * | 2014-01-20 | 2014-04-23 | 苏州新区华士达工程塑胶有限公司 | 一种改良性sbs配方 |
| JP6742304B2 (ja) * | 2014-11-19 | 2020-08-19 | サビック グローバル テクノロジーズ ベスローテン フェンノートシャップ | 粒子状ポリ（フェニレンエーテル）含有ワニス組成物、複合材、それから調製したラミネート、および複合材の製造方法 |
| KR101890464B1 (ko) | 2015-12-31 | 2018-09-28 | 롯데첨단소재(주) | 폴리아미드/폴리페닐렌 에테르 수지 조성물 및 이로부터 제조된 자동차용 성형품 |
| CN110997809A (zh) * | 2017-08-03 | 2020-04-10 | 三菱工程塑料株式会社 | 树脂组合物、成型品及电线 |
| KR102196881B1 (ko) | 2017-12-11 | 2020-12-30 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체 |
| WO2019117574A1 (ko) * | 2017-12-11 | 2019-06-20 | 주식회사 엘지화학 | 금속 박막 코팅용 열경화성 수지 조성물 및 이를 이용한 금속 적층체 |
| TWI700330B (zh) * | 2018-11-09 | 2020-08-01 | 台光電子材料股份有限公司 | 樹脂組合物及由其製成之物品 |
| CN114989571B (zh) * | 2022-03-28 | 2023-12-05 | 金发科技股份有限公司 | 一种聚酯复合材料及其制备方法和应用 |
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| US6197898B1 (en) | 1997-11-18 | 2001-03-06 | General Electric Company | Melt-mixing thermoplastic and epoxy resin above Tg or Tm of thermoplastic with curing agent |
| US5922815A (en) * | 1997-12-15 | 1999-07-13 | General Electric Company | Process for producing blends of tackifying resins with low molecular weight polyphenylene ethers |
| US6518362B1 (en) * | 1998-02-18 | 2003-02-11 | 3M Innovative Properties Company | Melt blending polyphenylene ether, polystyrene and curable epoxy |
| US6194495B1 (en) | 1998-03-23 | 2001-02-27 | General Electric Company | Cyanate ester based thermoset compositions |
| US6096821A (en) * | 1999-04-02 | 2000-08-01 | General Electric Company | Polyphenylene ether resin concentrates |
| US6576718B1 (en) * | 1999-10-05 | 2003-06-10 | General Electric Company | Powder coating of thermosetting resin(s) and poly(phenylene ethers(s)) |
| US6906120B1 (en) | 2000-06-20 | 2005-06-14 | General Electric | Poly(arylene ether) adhesive compositions |
-
2001
- 2001-06-28 US US09/681,941 patent/US7022777B2/en not_active Expired - Fee Related
-
2002
- 2002-05-01 WO PCT/US2002/013996 patent/WO2003002667A2/en not_active Ceased
- 2002-05-01 AU AU2002305349A patent/AU2002305349A1/en not_active Abandoned
- 2002-05-01 SG SG200601218-1A patent/SG152053A1/en unknown
- 2002-05-01 JP JP2003509034A patent/JP2004531634A/ja active Pending
- 2002-05-01 CN CNB02812880XA patent/CN100432150C/zh not_active Expired - Fee Related
- 2002-05-01 EP EP02734163A patent/EP1409588A2/en not_active Withdrawn
- 2002-05-01 KR KR1020037016451A patent/KR100678434B1/ko not_active Expired - Fee Related
-
2003
- 2003-11-20 IN IN1973DE2003 patent/IN2003DE01973A/en unknown
-
2006
- 2006-02-10 US US11/351,941 patent/US20060135706A1/en not_active Abandoned
-
2007
- 2007-08-23 US US11/844,095 patent/US7393895B2/en not_active Expired - Fee Related
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