SG152053A1 - Moldable poly(arylene ether) thermosetting compositions, methods, and articles - Google Patents
Moldable poly(arylene ether) thermosetting compositions, methods, and articlesInfo
- Publication number
- SG152053A1 SG152053A1 SG200601218-1A SG2006012181A SG152053A1 SG 152053 A1 SG152053 A1 SG 152053A1 SG 2006012181 A SG2006012181 A SG 2006012181A SG 152053 A1 SG152053 A1 SG 152053A1
- Authority
- SG
- Singapore
- Prior art keywords
- arylene ether
- poly
- articles
- methods
- moldable
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/02—Polyalkylene oxides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Moldable Poly(arylene ether) Thermosetting Compositions, Methods, And Articles A moldable thermosetting composition comprises a poly(arylene ether), a thermosetting resin, a toughening agent, and an amine cure agent. The compositions may be conveniently prepared without solvents, and the poly(arylene ether) may be provided in the form of an easily dissolved solid concentrate with the thermosetting resin.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/681,941 US7022777B2 (en) | 2001-06-28 | 2001-06-28 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
Publications (1)
Publication Number | Publication Date |
---|---|
SG152053A1 true SG152053A1 (en) | 2009-05-29 |
Family
ID=24737500
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG200601218-1A SG152053A1 (en) | 2001-06-28 | 2002-05-01 | Moldable poly(arylene ether) thermosetting compositions, methods, and articles |
Country Status (9)
Country | Link |
---|---|
US (3) | US7022777B2 (en) |
EP (1) | EP1409588A2 (en) |
JP (1) | JP2004531634A (en) |
KR (1) | KR100678434B1 (en) |
CN (1) | CN100432150C (en) |
AU (1) | AU2002305349A1 (en) |
IN (1) | IN2003DE01973A (en) |
SG (1) | SG152053A1 (en) |
WO (1) | WO2003002667A2 (en) |
Families Citing this family (56)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20030215588A1 (en) * | 2002-04-09 | 2003-11-20 | Yeager Gary William | Thermoset composition, method, and article |
WO2003087223A1 (en) * | 2002-04-09 | 2003-10-23 | General Electric Company (A New York Corporation) | Thermoset composition, method and article |
AU2003266671A1 (en) * | 2002-09-30 | 2004-04-19 | Hitachi Chemical Co., Ltd. | Resin composition for printed wiring board, and vanish, prepreg and metal-clad laminate using same |
KR100523594B1 (en) * | 2002-10-24 | 2005-10-24 | 주식회사 엘지화학 | Epoxy/thermoplastic blend composition |
KR100588301B1 (en) * | 2002-10-24 | 2006-06-09 | 주식회사 엘지화학 | Epoxy/thermoplastic blend composition |
US7250477B2 (en) * | 2002-12-20 | 2007-07-31 | General Electric Company | Thermoset composite composition, method, and article |
FR2854900B1 (en) * | 2003-05-16 | 2007-07-27 | Nexans | COMPOSITION FOR ADHERENT LAYER, ELECTRICAL CONDUCTOR COATED WITH SUCH A ADHERENT LAYER AND METHOD OF MANUFACTURING SUCH AN ELECTRICAL CONDUCTOR |
US6887574B2 (en) * | 2003-06-06 | 2005-05-03 | Dow Global Technologies Inc. | Curable flame retardant epoxy compositions |
US7157509B2 (en) | 2003-06-27 | 2007-01-02 | Henkel Corporation | Curable compositions |
US20050042961A1 (en) * | 2003-08-18 | 2005-02-24 | Henkel Loctite Corporation | Curable compositions for advanced processes, and products made therefrom |
US20050080185A1 (en) * | 2003-10-10 | 2005-04-14 | Mhetar Vijay R. | Poly(arylene ether) composition and method of making |
US7101933B2 (en) * | 2003-12-10 | 2006-09-05 | Uniplus Electronics Co., Ltd. | Process for producing high speed transmitting dielectric material |
DE602005012578D1 (en) * | 2004-04-02 | 2009-03-19 | Dow Global Technologies Inc | HEAT-RESISTANT RESINS MIXED WITH AMPHIPHILEM BLOCK COPOLYMER |
US8129456B2 (en) * | 2004-09-28 | 2012-03-06 | Isola Usa Corp. | Flame retardant compositions with a phosphorated compound |
US7687556B2 (en) * | 2004-09-28 | 2010-03-30 | Isola Usa Corp. | Flame retardant compositions |
US20060074151A1 (en) * | 2004-09-28 | 2006-04-06 | Polyclad Laminates, Inc. | Low expansion dielectric compositions |
US7649060B2 (en) * | 2005-12-02 | 2010-01-19 | Henkel Corporation | Curable compositions |
US8029889B1 (en) | 2004-12-03 | 2011-10-04 | Henkel Corporation | Prepregs, towpregs and preforms |
US7666938B2 (en) * | 2004-12-03 | 2010-02-23 | Henkel Corporation | Nanoparticle silica filled benzoxazine compositions |
US7411508B2 (en) * | 2005-06-17 | 2008-08-12 | Perkinemer Las, Inc. | Methods and systems for locating and identifying labware using radio-frequency identification tags |
US7429800B2 (en) * | 2005-06-30 | 2008-09-30 | Sabic Innovative Plastics Ip B.V. | Molding composition and method, and molded article |
US7378455B2 (en) | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
US20070049690A1 (en) * | 2005-08-29 | 2007-03-01 | Pravin Borade | Impact modified poly(arylene ether)/polyester blends and method |
US20080071036A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Cured poly(arylene ether) composition, method, and article |
US20080071035A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Curable poly(arylene ether) composition and method |
US20080076885A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
US20080076884A1 (en) * | 2006-09-21 | 2008-03-27 | Gary William Yeager | Poly(arylene ether) composition and method |
CN101578332B (en) * | 2006-11-13 | 2014-04-16 | 汉高公司 | Benzoxazine compositions with core shell rubbers |
WO2008066855A1 (en) * | 2006-11-29 | 2008-06-05 | Henkel Corporation | Method of preparing benzoxazines |
US7537827B1 (en) | 2006-12-13 | 2009-05-26 | Henkel Corporation | Prepreg laminates |
US20090030141A1 (en) * | 2007-07-23 | 2009-01-29 | Kim Gene Balfour | Poly(arylene ether) composition, method, and article |
DE102008023076A1 (en) * | 2008-05-09 | 2009-11-12 | Henkel Ag & Co. Kgaa | Polymerizable composition |
BRPI0915938A2 (en) | 2008-07-22 | 2018-10-30 | Basf Se | mixing, process for preparing the mixture, use of the mixture, structural adhesive, and cured epoxy resin |
ES2379691T3 (en) | 2008-07-22 | 2012-04-30 | Basf Se | Preparations containing epoxy resin and mixtures of amines with guanidine derivatives |
DK2307360T3 (en) * | 2008-07-22 | 2012-04-10 | Basf Se | Process for the preparation of mold bodies by mixtures of amines and guanidine derivatives |
CN103534289B (en) * | 2011-05-13 | 2016-08-17 | 亨斯迈先进材料美国有限责任公司 | There is the epoxy resin of high thermal stability and toughness |
CA2835199A1 (en) * | 2011-05-17 | 2012-11-22 | Huntsman Advanced Materials Americas Llc | Halogen free thermoset resin system for low dielectric loss at high frequency applications |
US8859672B2 (en) * | 2011-06-27 | 2014-10-14 | Sabic Global Technologies B.V. | Poly(arylene ether)-poly(hydroxy ether) block copolymer and method of making |
EP2812390B1 (en) * | 2012-02-10 | 2016-04-06 | 3M Innovative Properties Company | Anticorrosion coatings |
US8552105B2 (en) | 2012-03-08 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Compatibilized composition, method for the formation thereof, and article comprising same |
US8686079B2 (en) | 2012-04-13 | 2014-04-01 | Sabic Innovative Plastics Ip B.V. | Compatibilized composition, method for the formation thereof, and article comprising same |
US9611385B2 (en) | 2012-06-29 | 2017-04-04 | Sabic Global Technologies B.V. | Ultrafine poly(phenylene ether) particles and compositions derived therefrom |
CN103819870B (en) * | 2012-11-16 | 2016-06-15 | 株式会社田村制作所 | Resin molding, metal forming, copper-clad plate and the multilayer laminated boards substrate on compositions of thermosetting resin, B rank |
US8865823B2 (en) | 2013-02-01 | 2014-10-21 | Sabic Global Technologies B.V. | Triblock copolymer, method for its formation, and compatibilized compositions comprising it |
US20150028247A1 (en) | 2013-07-23 | 2015-01-29 | Sabic Innovative Plastics Ip B.V. | Rigid foam and associated article and method |
US9296916B2 (en) | 2013-08-09 | 2016-03-29 | Sabic Global Technologies B.V. | Poly(phenylene ether)/epoxy homogeneous solid and powder coating composition incorporating same |
US9447227B2 (en) | 2013-10-03 | 2016-09-20 | Sabic Global Technologies B.V. | Flexible polyurethane foam and associated method and article |
CN103740033A (en) * | 2014-01-20 | 2014-04-23 | 苏州新区华士达工程塑胶有限公司 | Improved SBS (Styrene Butadiene Styrene) formula |
WO2016081063A1 (en) * | 2014-11-19 | 2016-05-26 | Sabic Global Technologies B.V. | Particulate poly(phenylene ether)-containing varnish composition, composite and laminate prepared therefrom, and method of forming composite |
KR101890464B1 (en) | 2015-12-31 | 2018-09-28 | 롯데첨단소재(주) | Polyamide/polyphenylene ether resin composition and molded product for vehicle using the same |
CN110997809A (en) * | 2017-08-03 | 2020-04-10 | 三菱工程塑料株式会社 | Resin composition, molded article, and electric wire |
WO2019117574A1 (en) * | 2017-12-11 | 2019-06-20 | 주식회사 엘지화학 | Thermosetting resin composition for metal thin film coating and metal laminate using same |
KR102196881B1 (en) | 2017-12-11 | 2020-12-30 | 주식회사 엘지화학 | Thermosetting composition for coating metal thin film and metal film using the same |
TWI700330B (en) * | 2018-11-09 | 2020-08-01 | 台光電子材料股份有限公司 | Resin composition and articles made from it |
CN114989571B (en) * | 2022-03-28 | 2023-12-05 | 金发科技股份有限公司 | Polyester composite material and preparation method and application thereof |
Citations (6)
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US3850676A (en) * | 1966-10-11 | 1974-11-26 | R Madrid | Coated carrier particles for electrostatographic development |
US5213886A (en) * | 1989-02-17 | 1993-05-25 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
EP0537005B1 (en) * | 1991-10-09 | 1997-07-30 | General Electric Company | Process for making thermoset polyphenylene oxide/epoxy laminates |
US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
WO2001025358A1 (en) * | 1999-10-05 | 2001-04-12 | General Electric Company | Powder coating compositions |
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-
2001
- 2001-06-28 US US09/681,941 patent/US7022777B2/en not_active Expired - Fee Related
-
2002
- 2002-05-01 CN CNB02812880XA patent/CN100432150C/en not_active Expired - Fee Related
- 2002-05-01 JP JP2003509034A patent/JP2004531634A/en active Pending
- 2002-05-01 KR KR1020037016451A patent/KR100678434B1/en not_active IP Right Cessation
- 2002-05-01 WO PCT/US2002/013996 patent/WO2003002667A2/en active Application Filing
- 2002-05-01 SG SG200601218-1A patent/SG152053A1/en unknown
- 2002-05-01 AU AU2002305349A patent/AU2002305349A1/en not_active Abandoned
- 2002-05-01 EP EP02734163A patent/EP1409588A2/en not_active Withdrawn
-
2003
- 2003-11-20 IN IN1973DE2003 patent/IN2003DE01973A/en unknown
-
2006
- 2006-02-10 US US11/351,941 patent/US20060135706A1/en not_active Abandoned
-
2007
- 2007-08-23 US US11/844,095 patent/US7393895B2/en not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3850676A (en) * | 1966-10-11 | 1974-11-26 | R Madrid | Coated carrier particles for electrostatographic development |
US5213886A (en) * | 1989-02-17 | 1993-05-25 | General Electric Company | Curable dielectric polyphenylene ether-polyepoxide compositions |
EP0537005B1 (en) * | 1991-10-09 | 1997-07-30 | General Electric Company | Process for making thermoset polyphenylene oxide/epoxy laminates |
US5308565A (en) * | 1993-02-05 | 1994-05-03 | General Electric Company | Method of preparing modified polyphenylene oxide resin systems for electrical laminates having improved solderability and solvent resistance |
US5834565A (en) * | 1996-11-12 | 1998-11-10 | General Electric Company | Curable polyphenylene ether-thermosetting resin composition and process |
WO2001025358A1 (en) * | 1999-10-05 | 2001-04-12 | General Electric Company | Powder coating compositions |
Also Published As
Publication number | Publication date |
---|---|
US20030018131A1 (en) | 2003-01-23 |
KR100678434B1 (en) | 2007-02-05 |
US7022777B2 (en) | 2006-04-04 |
WO2003002667A3 (en) | 2003-11-27 |
JP2004531634A (en) | 2004-10-14 |
WO2003002667A2 (en) | 2003-01-09 |
US20060135706A1 (en) | 2006-06-22 |
EP1409588A2 (en) | 2004-04-21 |
US7393895B2 (en) | 2008-07-01 |
AU2002305349A1 (en) | 2003-03-03 |
CN1639261A (en) | 2005-07-13 |
IN2003DE01973A (en) | 2005-12-16 |
CN100432150C (en) | 2008-11-12 |
KR20040015268A (en) | 2004-02-18 |
US20070287801A1 (en) | 2007-12-13 |
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