AU2003244182A1 - Curable composition, cured article obtained therefrom, and polyimide resin for use in the same - Google Patents
Curable composition, cured article obtained therefrom, and polyimide resin for use in the sameInfo
- Publication number
- AU2003244182A1 AU2003244182A1 AU2003244182A AU2003244182A AU2003244182A1 AU 2003244182 A1 AU2003244182 A1 AU 2003244182A1 AU 2003244182 A AU2003244182 A AU 2003244182A AU 2003244182 A AU2003244182 A AU 2003244182A AU 2003244182 A1 AU2003244182 A1 AU 2003244182A1
- Authority
- AU
- Australia
- Prior art keywords
- same
- curable composition
- polyimide resin
- obtained therefrom
- article obtained
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1003—Preparatory processes
- C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
- C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
- H05K3/4676—Single layer compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002185647 | 2002-06-26 | ||
JP2002185642 | 2002-06-26 | ||
JP2002-185642 | 2002-06-26 | ||
JP2002-185647 | 2002-06-26 | ||
PCT/JP2003/007994 WO2004003057A1 (en) | 2002-06-26 | 2003-06-24 | Curable composition, cured article obtained therefrom, and polyimide resin for use in the same |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2003244182A1 true AU2003244182A1 (en) | 2004-01-19 |
AU2003244182A8 AU2003244182A8 (en) | 2004-01-19 |
Family
ID=30002281
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003244182A Abandoned AU2003244182A1 (en) | 2002-06-26 | 2003-06-24 | Curable composition, cured article obtained therefrom, and polyimide resin for use in the same |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4480573B2 (en) |
AU (1) | AU2003244182A1 (en) |
TW (1) | TWI286564B (en) |
WO (1) | WO2004003057A1 (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5119781B2 (en) * | 2006-07-25 | 2013-01-16 | 宇部興産株式会社 | Multi-branched polyimide for promoting electroless plating, metal-coated multi-branched polyimide, and production method thereof |
WO2008114797A1 (en) * | 2007-03-19 | 2008-09-25 | Ibiden Co., Ltd. | Positive type photosensitive polyimide precursor composition |
JP4650582B2 (en) * | 2009-05-14 | 2011-03-16 | 東洋紡績株式会社 | Resin having hyperbranch structure and resist agent using the same |
JP4650581B2 (en) * | 2009-05-14 | 2011-03-16 | 東洋紡績株式会社 | Resin having hyperbranch structure and resist agent using the same |
JP5210249B2 (en) * | 2009-06-23 | 2013-06-12 | 日東電工株式会社 | Polyimide compound and process for producing the same, and optical film and optical waveguide obtained from the compound |
JP2011048921A (en) * | 2009-08-25 | 2011-03-10 | Sanyo Electric Co Ltd | Lithium secondary battery, and method of manufacturing the same |
JP6462983B2 (en) * | 2014-01-28 | 2019-01-30 | 太陽インキ製造株式会社 | Photosensitive thermosetting resin composition and flexible printed wiring board |
KR102380068B1 (en) * | 2016-10-05 | 2022-03-31 | 도레이 카부시키가이샤 | Resin composition, cured film, semiconductor device, and manufacturing method thereof |
CN116948520A (en) * | 2020-09-08 | 2023-10-27 | 深圳市志邦科技有限公司 | Heat-resistant high-adhesion polyimide coating and preparation method thereof and preparation method of coating |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4216256B1 (en) * | 1963-04-12 | 1967-09-04 | ||
JPH11343414A (en) * | 1998-05-29 | 1999-12-14 | Jsr Corp | Thermosetting resin composition and its cured product |
JP3546303B2 (en) * | 1999-07-26 | 2004-07-28 | 財団法人理工学振興会 | Polyimide resin |
JP2002080597A (en) * | 2000-09-05 | 2002-03-19 | Rikogaku Shinkokai | Method for producing polyimide resin |
JP2002221793A (en) * | 2001-01-29 | 2002-08-09 | Jsr Corp | Positive type photosensitive polyimide composition and polyimide film |
-
2003
- 2003-06-24 WO PCT/JP2003/007994 patent/WO2004003057A1/en active Application Filing
- 2003-06-24 AU AU2003244182A patent/AU2003244182A1/en not_active Abandoned
- 2003-06-24 JP JP2004517265A patent/JP4480573B2/en not_active Expired - Lifetime
- 2003-06-25 TW TW92117263A patent/TWI286564B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW200401007A (en) | 2004-01-16 |
AU2003244182A8 (en) | 2004-01-19 |
JP4480573B2 (en) | 2010-06-16 |
WO2004003057A1 (en) | 2004-01-08 |
TWI286564B (en) | 2007-09-11 |
JPWO2004003057A1 (en) | 2005-10-27 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase | ||
TH | Corrigenda |
Free format text: IN VOL 18, NO 9, PAGE(S) 2395 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME KANAGAWA UNIVERSITY, APPLICATION NO. 2003244182, UNDER INID (71) CORRECT THE NAME TO READ KANAGAWA UNIVERSITY; TAIYO INK MANUFACTURING CO., LTD. |