AU2003244182A8 - Curable composition, cured article obtained therefrom, and polyimide resin for use in the same - Google Patents

Curable composition, cured article obtained therefrom, and polyimide resin for use in the same

Info

Publication number
AU2003244182A8
AU2003244182A8 AU2003244182A AU2003244182A AU2003244182A8 AU 2003244182 A8 AU2003244182 A8 AU 2003244182A8 AU 2003244182 A AU2003244182 A AU 2003244182A AU 2003244182 A AU2003244182 A AU 2003244182A AU 2003244182 A8 AU2003244182 A8 AU 2003244182A8
Authority
AU
Australia
Prior art keywords
same
curable composition
polyimide resin
obtained therefrom
article obtained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003244182A
Other versions
AU2003244182A1 (en
Inventor
Masaki Sasaki
Tadatomi Nishikubo
Hiroto Kudo
Shohei Makita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanagawa University
Taiyo Holdings Co Ltd
Original Assignee
Taiyo Ink Mfg Co Ltd
Kanagawa University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Ink Mfg Co Ltd, Kanagawa University filed Critical Taiyo Ink Mfg Co Ltd
Publication of AU2003244182A1 publication Critical patent/AU2003244182A1/en
Publication of AU2003244182A8 publication Critical patent/AU2003244182A8/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1025—Preparatory processes from tetracarboxylic acids or derivatives and diamines polymerised by radiations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Materials For Photolithography (AREA)
AU2003244182A 2002-06-26 2003-06-24 Curable composition, cured article obtained therefrom, and polyimide resin for use in the same Abandoned AU2003244182A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002185647 2002-06-26
JP2002185642 2002-06-26
JP2002-185642 2002-06-26
JP2002-185647 2002-06-26
PCT/JP2003/007994 WO2004003057A1 (en) 2002-06-26 2003-06-24 Curable composition, cured article obtained therefrom, and polyimide resin for use in the same

Publications (2)

Publication Number Publication Date
AU2003244182A1 AU2003244182A1 (en) 2004-01-19
AU2003244182A8 true AU2003244182A8 (en) 2004-01-19

Family

ID=30002281

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003244182A Abandoned AU2003244182A1 (en) 2002-06-26 2003-06-24 Curable composition, cured article obtained therefrom, and polyimide resin for use in the same

Country Status (4)

Country Link
JP (1) JP4480573B2 (en)
AU (1) AU2003244182A1 (en)
TW (1) TWI286564B (en)
WO (1) WO2004003057A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5119781B2 (en) * 2006-07-25 2013-01-16 宇部興産株式会社 Multi-branched polyimide for promoting electroless plating, metal-coated multi-branched polyimide, and production method thereof
WO2008114797A1 (en) * 2007-03-19 2008-09-25 Ibiden Co., Ltd. Positive type photosensitive polyimide precursor composition
JP4650582B2 (en) * 2009-05-14 2011-03-16 東洋紡績株式会社 Resin having hyperbranch structure and resist agent using the same
JP4650581B2 (en) * 2009-05-14 2011-03-16 東洋紡績株式会社 Resin having hyperbranch structure and resist agent using the same
JP5210249B2 (en) * 2009-06-23 2013-06-12 日東電工株式会社 Polyimide compound and process for producing the same, and optical film and optical waveguide obtained from the compound
JP2011048921A (en) * 2009-08-25 2011-03-10 Sanyo Electric Co Ltd Lithium secondary battery, and method of manufacturing the same
JP6462983B2 (en) * 2014-01-28 2019-01-30 太陽インキ製造株式会社 Photosensitive thermosetting resin composition and flexible printed wiring board
KR102380068B1 (en) * 2016-10-05 2022-03-31 도레이 카부시키가이샤 Resin composition, cured film, semiconductor device, and manufacturing method thereof
CN116948520A (en) * 2020-09-08 2023-10-27 深圳市志邦科技有限公司 Heat-resistant high-adhesion polyimide coating and preparation method thereof and preparation method of coating

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4216256B1 (en) * 1963-04-12 1967-09-04
JPH11343414A (en) * 1998-05-29 1999-12-14 Jsr Corp Thermosetting resin composition and its cured product
JP3546303B2 (en) * 1999-07-26 2004-07-28 財団法人理工学振興会 Polyimide resin
JP2002080597A (en) * 2000-09-05 2002-03-19 Rikogaku Shinkokai Method for producing polyimide resin
JP2002221793A (en) * 2001-01-29 2002-08-09 Jsr Corp Positive type photosensitive polyimide composition and polyimide film

Also Published As

Publication number Publication date
AU2003244182A1 (en) 2004-01-19
TW200401007A (en) 2004-01-16
JP4480573B2 (en) 2010-06-16
WO2004003057A1 (en) 2004-01-08
TWI286564B (en) 2007-09-11
JPWO2004003057A1 (en) 2005-10-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase
TH Corrigenda

Free format text: IN VOL 18, NO 9, PAGE(S) 2395 UNDER THE HEADING APPLICATIONS OPI - NAME INDEX UNDER THE NAME KANAGAWA UNIVERSITY, APPLICATION NO. 2003244182, UNDER INID (71) CORRECT THE NAME TO READ KANAGAWA UNIVERSITY; TAIYO INK MANUFACTURING CO., LTD.