JP2004508728A5 - - Google Patents
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- Publication number
- JP2004508728A5 JP2004508728A5 JP2002525911A JP2002525911A JP2004508728A5 JP 2004508728 A5 JP2004508728 A5 JP 2004508728A5 JP 2002525911 A JP2002525911 A JP 2002525911A JP 2002525911 A JP2002525911 A JP 2002525911A JP 2004508728 A5 JP2004508728 A5 JP 2004508728A5
- Authority
- JP
- Japan
- Prior art keywords
- chuck
- electrostatic chuck
- porous
- region
- electrostatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 description 8
- 239000000919 ceramic Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 4
- -1 Si 3 N 4 Inorganic materials 0.000 description 3
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 3
- 229910010413 TiO 2 Inorganic materials 0.000 description 2
- ZCCIPPOKBCJFDN-UHFFFAOYSA-N calcium nitrate Chemical compound [Ca+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ZCCIPPOKBCJFDN-UHFFFAOYSA-N 0.000 description 2
- 239000013529 heat transfer fluid Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/655,324 US6606234B1 (en) | 2000-09-05 | 2000-09-05 | Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow |
| US09/655,324 | 2000-09-05 | ||
| PCT/US2001/024135 WO2002021590A2 (en) | 2000-09-05 | 2001-08-01 | Electrostatic chuck with porous regions |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004508728A JP2004508728A (ja) | 2004-03-18 |
| JP2004508728A5 true JP2004508728A5 (enExample) | 2008-09-18 |
| JP4959905B2 JP4959905B2 (ja) | 2012-06-27 |
Family
ID=24628428
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002525911A Expired - Lifetime JP4959905B2 (ja) | 2000-09-05 | 2001-08-01 | 多孔領域を有する静電チャック |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6606234B1 (enExample) |
| EP (1) | EP1316110B1 (enExample) |
| JP (1) | JP4959905B2 (enExample) |
| KR (1) | KR100557695B1 (enExample) |
| AT (1) | ATE417358T1 (enExample) |
| AU (1) | AU2001277237A1 (enExample) |
| DE (1) | DE60136940D1 (enExample) |
| TW (1) | TW526521B (enExample) |
| WO (1) | WO2002021590A2 (enExample) |
Families Citing this family (64)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7988999B2 (en) * | 2000-12-07 | 2011-08-02 | Nycomed Gmbh | Pharmaceutical preparation in the form of a paste comprising an acid-labile active ingredient |
| TWI234417B (en) * | 2001-07-10 | 2005-06-11 | Tokyo Electron Ltd | Plasma procesor and plasma processing method |
| US6490145B1 (en) * | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
| TW561515B (en) * | 2001-11-30 | 2003-11-11 | Tokyo Electron Ltd | Processing device, and gas discharge suppressing member |
| US20030219986A1 (en) * | 2002-05-22 | 2003-11-27 | Applied Materials, Inc. | Substrate carrier for processing substrates |
| KR100457833B1 (ko) * | 2002-05-24 | 2004-11-18 | 주성엔지니어링(주) | 플라즈마 식각 장치 |
| JP4095842B2 (ja) * | 2002-06-26 | 2008-06-04 | 日本特殊陶業株式会社 | 静電チャック |
| JP2004306191A (ja) * | 2003-04-07 | 2004-11-04 | Seiko Epson Corp | テーブル装置、成膜装置、光学素子、半導体素子及び電子機器 |
| DE102004060625A1 (de) * | 2004-12-16 | 2006-06-29 | Siltronic Ag | Beschichtete Halbleiterscheibe und Verfahren und Vorrichtung zur Herstellung der Halbleiterscheibe |
| US7235139B2 (en) * | 2003-10-28 | 2007-06-26 | Veeco Instruments Inc. | Wafer carrier for growing GaN wafers |
| US7245357B2 (en) * | 2003-12-15 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| US7220497B2 (en) * | 2003-12-18 | 2007-05-22 | Lam Research Corporation | Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components |
| US20060023395A1 (en) * | 2004-07-30 | 2006-02-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for temperature control of semiconductor wafers |
| US7544251B2 (en) * | 2004-10-07 | 2009-06-09 | Applied Materials, Inc. | Method and apparatus for controlling temperature of a substrate |
| JP4350695B2 (ja) * | 2004-12-01 | 2009-10-21 | 株式会社フューチャービジョン | 処理装置 |
| US7731798B2 (en) * | 2004-12-01 | 2010-06-08 | Ultratech, Inc. | Heated chuck for laser thermal processing |
| WO2006088448A1 (en) * | 2005-02-16 | 2006-08-24 | Veeco Instruments Inc. | Wafer carrier for growing gan wafers |
| US20090016941A1 (en) * | 2006-01-11 | 2009-01-15 | Ngk Insulators Ltd. | Electrode Device For Plasma Discharge |
| US20080009417A1 (en) * | 2006-07-05 | 2008-01-10 | General Electric Company | Coating composition, article, and associated method |
| WO2008082978A2 (en) * | 2006-12-26 | 2008-07-10 | Saint-Gobain Ceramics & Plastics, Inc. | Electrostatic chuck and method of forming |
| US7848076B2 (en) * | 2007-07-31 | 2010-12-07 | Applied Materials, Inc. | Method and apparatus for providing an electrostatic chuck with reduced plasma penetration and arcing |
| US9202736B2 (en) * | 2007-07-31 | 2015-12-01 | Applied Materials, Inc. | Method for refurbishing an electrostatic chuck with reduced plasma penetration and arcing |
| US8108981B2 (en) * | 2007-07-31 | 2012-02-07 | Applied Materials, Inc. | Method of making an electrostatic chuck with reduced plasma penetration and arcing |
| JP2008172255A (ja) * | 2008-01-25 | 2008-07-24 | Ngk Spark Plug Co Ltd | 静電チャック |
| US8681472B2 (en) * | 2008-06-20 | 2014-03-25 | Varian Semiconductor Equipment Associates, Inc. | Platen ground pin for connecting substrate to ground |
| US8218284B2 (en) * | 2008-07-24 | 2012-07-10 | Hermes-Microvision, Inc. | Apparatus for increasing electric conductivity to a semiconductor wafer substrate when exposure to electron beam |
| US8094428B2 (en) * | 2008-10-27 | 2012-01-10 | Hermes-Microvision, Inc. | Wafer grounding methodology |
| US20100107974A1 (en) * | 2008-11-06 | 2010-05-06 | Asm America, Inc. | Substrate holder with varying density |
| US9218997B2 (en) * | 2008-11-06 | 2015-12-22 | Applied Materials, Inc. | Electrostatic chuck having reduced arcing |
| US20100177454A1 (en) * | 2009-01-09 | 2010-07-15 | Component Re-Engineering Company, Inc. | Electrostatic chuck with dielectric inserts |
| US20110024049A1 (en) | 2009-07-30 | 2011-02-03 | c/o Lam Research Corporation | Light-up prevention in electrostatic chucks |
| US9338871B2 (en) * | 2010-01-29 | 2016-05-10 | Applied Materials, Inc. | Feedforward temperature control for plasma processing apparatus |
| US8916793B2 (en) * | 2010-06-08 | 2014-12-23 | Applied Materials, Inc. | Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow |
| US8880227B2 (en) | 2010-05-27 | 2014-11-04 | Applied Materials, Inc. | Component temperature control by coolant flow control and heater duty cycle control |
| US8608852B2 (en) | 2010-06-11 | 2013-12-17 | Applied Materials, Inc. | Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies |
| US9728429B2 (en) | 2010-07-27 | 2017-08-08 | Lam Research Corporation | Parasitic plasma prevention in plasma processing chambers |
| US8906164B2 (en) | 2010-08-05 | 2014-12-09 | Lam Research Corporation | Methods for stabilizing contact surfaces of electrostatic chucks |
| JP5458050B2 (ja) | 2011-03-30 | 2014-04-02 | 日本碍子株式会社 | 静電チャックの製法 |
| US10274270B2 (en) | 2011-10-27 | 2019-04-30 | Applied Materials, Inc. | Dual zone common catch heat exchanger/chiller |
| JP5956379B2 (ja) * | 2012-04-27 | 2016-07-27 | 日本碍子株式会社 | 半導体製造装置用部材 |
| KR102032744B1 (ko) | 2012-09-05 | 2019-11-11 | 삼성디스플레이 주식회사 | 기판 고정장치 및 이의 제조방법 |
| CN104748574A (zh) * | 2013-12-27 | 2015-07-01 | 北京思能达节能电气股份有限公司 | 一种用于监测自焙电极焙烧状态的系统和方法 |
| US9976211B2 (en) * | 2014-04-25 | 2018-05-22 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| CN107004626B (zh) * | 2014-11-20 | 2019-02-05 | 住友大阪水泥股份有限公司 | 静电卡盘装置 |
| WO2016135565A1 (en) | 2015-02-23 | 2016-09-01 | M Cubed Technologies, Inc. | Film electrode for electrostatic chuck |
| JP6722518B2 (ja) | 2016-06-09 | 2020-07-15 | 新光電気工業株式会社 | 焼結体及びその製造方法と静電チャック |
| JP6854600B2 (ja) * | 2016-07-15 | 2021-04-07 | 東京エレクトロン株式会社 | プラズマエッチング方法、プラズマエッチング装置、および基板載置台 |
| US20180025931A1 (en) * | 2016-07-22 | 2018-01-25 | Applied Materials, Inc. | Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing |
| US10975469B2 (en) * | 2017-03-17 | 2021-04-13 | Applied Materials, Inc. | Plasma resistant coating of porous body by atomic layer deposition |
| JP2019029384A (ja) * | 2017-07-25 | 2019-02-21 | 新光電気工業株式会社 | セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置 |
| WO2019065233A1 (ja) * | 2017-09-29 | 2019-04-04 | 住友大阪セメント株式会社 | 静電チャック装置 |
| KR102039802B1 (ko) * | 2017-12-19 | 2019-11-26 | 한국세라믹기술원 | 정전척용 세라믹 본체 |
| US10411380B1 (en) | 2018-05-24 | 2019-09-10 | Microsoft Technology Licensing, Llc | Connectors with liquid metal and gas permeable plugs |
| US11456161B2 (en) * | 2018-06-04 | 2022-09-27 | Applied Materials, Inc. | Substrate support pedestal |
| CN111668148B (zh) * | 2019-03-05 | 2024-09-03 | Toto株式会社 | 静电吸盘及处理装置 |
| JP7345379B2 (ja) * | 2019-12-06 | 2023-09-15 | 株式会社ディスコ | ゲッタリング性評価装置 |
| JP7634644B2 (ja) * | 2021-02-17 | 2025-02-21 | アプライド マテリアルズ インコーポレイテッド | 多孔性プラグ結合 |
| US11794296B2 (en) * | 2022-02-03 | 2023-10-24 | Applied Materials, Inc. | Electrostatic chuck with porous plug |
| CN119404302A (zh) | 2022-07-07 | 2025-02-07 | 日本特殊陶业株式会社 | 保持装置 |
| CN119968703A (zh) * | 2022-09-30 | 2025-05-09 | 应用材料公司 | 用于氩气输送的大直径多孔栓塞及两阶段软性夹持方法 |
| US20240158308A1 (en) * | 2022-11-11 | 2024-05-16 | Applied Materials, Inc. | Monolithic substrate support having porous features and methods of forming the same |
| KR20250126049A (ko) * | 2022-12-21 | 2025-08-22 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 장치 및 정전 척 |
| KR102795089B1 (ko) * | 2022-12-28 | 2025-04-15 | 세메스 주식회사 | 서셉터 및 그 제조방법 |
| KR20250068704A (ko) | 2023-04-19 | 2025-05-16 | 니혼도꾸슈도교 가부시키가이샤 | 유지 장치 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62155517A (ja) * | 1985-12-27 | 1987-07-10 | Canon Inc | パターン描画装置及び方法 |
| US5542559A (en) | 1993-02-16 | 1996-08-06 | Tokyo Electron Kabushiki Kaisha | Plasma treatment apparatus |
| US5792562A (en) | 1995-01-12 | 1998-08-11 | Applied Materials, Inc. | Electrostatic chuck with polymeric impregnation and method of making |
| JPH0917770A (ja) * | 1995-06-28 | 1997-01-17 | Sony Corp | プラズマ処理方法およびこれに用いるプラズマ装置 |
| JP3457477B2 (ja) | 1995-09-06 | 2003-10-20 | 日本碍子株式会社 | 静電チャック |
| US6399143B1 (en) | 1996-04-09 | 2002-06-04 | Delsys Pharmaceutical Corporation | Method for clamping and electrostatically coating a substrate |
| JPH09289201A (ja) * | 1996-04-23 | 1997-11-04 | Tokyo Electron Ltd | プラズマ処理装置 |
| US6022807A (en) * | 1996-04-24 | 2000-02-08 | Micro Processing Technology, Inc. | Method for fabricating an integrated circuit |
| US5720818A (en) * | 1996-04-26 | 1998-02-24 | Applied Materials, Inc. | Conduits for flow of heat transfer fluid to the surface of an electrostatic chuck |
| US5835334A (en) | 1996-09-30 | 1998-11-10 | Lam Research | Variable high temperature chuck for high density plasma chemical vapor deposition |
| US6004752A (en) * | 1997-07-29 | 1999-12-21 | Sarnoff Corporation | Solid support with attached molecules |
| US6045753A (en) * | 1997-07-29 | 2000-04-04 | Sarnoff Corporation | Deposited reagents for chemical processes |
| JPH11260899A (ja) * | 1998-03-10 | 1999-09-24 | Nippon Steel Corp | 静電チャック |
| JP2001308075A (ja) * | 2000-04-26 | 2001-11-02 | Toshiba Ceramics Co Ltd | ウェーハ支持体 |
-
2000
- 2000-09-05 US US09/655,324 patent/US6606234B1/en not_active Expired - Lifetime
-
2001
- 2001-08-01 WO PCT/US2001/024135 patent/WO2002021590A2/en not_active Ceased
- 2001-08-01 EP EP01955029A patent/EP1316110B1/en not_active Expired - Lifetime
- 2001-08-01 DE DE60136940T patent/DE60136940D1/de not_active Expired - Fee Related
- 2001-08-01 AU AU2001277237A patent/AU2001277237A1/en not_active Abandoned
- 2001-08-01 AT AT01955029T patent/ATE417358T1/de not_active IP Right Cessation
- 2001-08-01 KR KR1020037003208A patent/KR100557695B1/ko not_active Expired - Lifetime
- 2001-08-01 JP JP2002525911A patent/JP4959905B2/ja not_active Expired - Lifetime
- 2001-08-07 TW TW090119231A patent/TW526521B/zh not_active IP Right Cessation
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