ATE417358T1 - Elektrostatischer scheibenhalter mit porösen bereichen - Google Patents

Elektrostatischer scheibenhalter mit porösen bereichen

Info

Publication number
ATE417358T1
ATE417358T1 AT01955029T AT01955029T ATE417358T1 AT E417358 T1 ATE417358 T1 AT E417358T1 AT 01955029 T AT01955029 T AT 01955029T AT 01955029 T AT01955029 T AT 01955029T AT E417358 T1 ATE417358 T1 AT E417358T1
Authority
AT
Austria
Prior art keywords
porous region
disc holder
electrostatic chuck
porous areas
chuck
Prior art date
Application number
AT01955029T
Other languages
German (de)
English (en)
Inventor
Ramesh Divakar
Original Assignee
Saint Gobain Ceramics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Saint Gobain Ceramics filed Critical Saint Gobain Ceramics
Application granted granted Critical
Publication of ATE417358T1 publication Critical patent/ATE417358T1/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Porous Artificial Stone Or Porous Ceramic Products (AREA)
  • Chemical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Holding Or Fastening Of Disk On Rotational Shaft (AREA)
AT01955029T 2000-09-05 2001-08-01 Elektrostatischer scheibenhalter mit porösen bereichen ATE417358T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/655,324 US6606234B1 (en) 2000-09-05 2000-09-05 Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow

Publications (1)

Publication Number Publication Date
ATE417358T1 true ATE417358T1 (de) 2008-12-15

Family

ID=24628428

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01955029T ATE417358T1 (de) 2000-09-05 2001-08-01 Elektrostatischer scheibenhalter mit porösen bereichen

Country Status (9)

Country Link
US (1) US6606234B1 (enExample)
EP (1) EP1316110B1 (enExample)
JP (1) JP4959905B2 (enExample)
KR (1) KR100557695B1 (enExample)
AT (1) ATE417358T1 (enExample)
AU (1) AU2001277237A1 (enExample)
DE (1) DE60136940D1 (enExample)
TW (1) TW526521B (enExample)
WO (1) WO2002021590A2 (enExample)

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US9338871B2 (en) * 2010-01-29 2016-05-10 Applied Materials, Inc. Feedforward temperature control for plasma processing apparatus
US8916793B2 (en) * 2010-06-08 2014-12-23 Applied Materials, Inc. Temperature control in plasma processing apparatus using pulsed heat transfer fluid flow
US8880227B2 (en) 2010-05-27 2014-11-04 Applied Materials, Inc. Component temperature control by coolant flow control and heater duty cycle control
US8608852B2 (en) 2010-06-11 2013-12-17 Applied Materials, Inc. Temperature controlled plasma processing chamber component with zone dependent thermal efficiencies
US9728429B2 (en) 2010-07-27 2017-08-08 Lam Research Corporation Parasitic plasma prevention in plasma processing chambers
US8906164B2 (en) 2010-08-05 2014-12-09 Lam Research Corporation Methods for stabilizing contact surfaces of electrostatic chucks
JP5458050B2 (ja) 2011-03-30 2014-04-02 日本碍子株式会社 静電チャックの製法
US10274270B2 (en) 2011-10-27 2019-04-30 Applied Materials, Inc. Dual zone common catch heat exchanger/chiller
JP5956379B2 (ja) * 2012-04-27 2016-07-27 日本碍子株式会社 半導体製造装置用部材
KR102032744B1 (ko) 2012-09-05 2019-11-11 삼성디스플레이 주식회사 기판 고정장치 및 이의 제조방법
CN104748574A (zh) * 2013-12-27 2015-07-01 北京思能达节能电气股份有限公司 一种用于监测自焙电极焙烧状态的系统和方法
US9976211B2 (en) * 2014-04-25 2018-05-22 Applied Materials, Inc. Plasma erosion resistant thin film coating for high temperature application
CN107004626B (zh) * 2014-11-20 2019-02-05 住友大阪水泥股份有限公司 静电卡盘装置
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JP6854600B2 (ja) * 2016-07-15 2021-04-07 東京エレクトロン株式会社 プラズマエッチング方法、プラズマエッチング装置、および基板載置台
US20180025931A1 (en) * 2016-07-22 2018-01-25 Applied Materials, Inc. Processed wafer as top plate of a workpiece carrier in semiconductor and mechanical processing
US10975469B2 (en) * 2017-03-17 2021-04-13 Applied Materials, Inc. Plasma resistant coating of porous body by atomic layer deposition
JP2019029384A (ja) * 2017-07-25 2019-02-21 新光電気工業株式会社 セラミックス混合物、多孔質体及びその製造方法、静電チャック及びその製造方法、基板固定装置
WO2019065233A1 (ja) * 2017-09-29 2019-04-04 住友大阪セメント株式会社 静電チャック装置
KR102039802B1 (ko) * 2017-12-19 2019-11-26 한국세라믹기술원 정전척용 세라믹 본체
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CN111668148B (zh) * 2019-03-05 2024-09-03 Toto株式会社 静电吸盘及处理装置
JP7345379B2 (ja) * 2019-12-06 2023-09-15 株式会社ディスコ ゲッタリング性評価装置
JP7634644B2 (ja) * 2021-02-17 2025-02-21 アプライド マテリアルズ インコーポレイテッド 多孔性プラグ結合
US11794296B2 (en) * 2022-02-03 2023-10-24 Applied Materials, Inc. Electrostatic chuck with porous plug
CN119404302A (zh) 2022-07-07 2025-02-07 日本特殊陶业株式会社 保持装置
CN119968703A (zh) * 2022-09-30 2025-05-09 应用材料公司 用于氩气输送的大直径多孔栓塞及两阶段软性夹持方法
US20240158308A1 (en) * 2022-11-11 2024-05-16 Applied Materials, Inc. Monolithic substrate support having porous features and methods of forming the same
KR20250126049A (ko) * 2022-12-21 2025-08-22 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 정전 척
KR102795089B1 (ko) * 2022-12-28 2025-04-15 세메스 주식회사 서셉터 및 그 제조방법
KR20250068704A (ko) 2023-04-19 2025-05-16 니혼도꾸슈도교 가부시키가이샤 유지 장치

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Also Published As

Publication number Publication date
JP2004508728A (ja) 2004-03-18
JP4959905B2 (ja) 2012-06-27
EP1316110B1 (en) 2008-12-10
DE60136940D1 (de) 2009-01-22
WO2002021590A2 (en) 2002-03-14
AU2001277237A1 (en) 2002-03-22
KR20030031177A (ko) 2003-04-18
WO2002021590A3 (en) 2002-08-01
TW526521B (en) 2003-04-01
KR100557695B1 (ko) 2006-03-07
EP1316110A2 (en) 2003-06-04
US6606234B1 (en) 2003-08-12

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Legal Events

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RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties