JP2004501511A - 一体のフレキシブル回路を有するハードディスクドライブサスペンション - Google Patents
一体のフレキシブル回路を有するハードディスクドライブサスペンション Download PDFInfo
- Publication number
- JP2004501511A JP2004501511A JP2001583508A JP2001583508A JP2004501511A JP 2004501511 A JP2004501511 A JP 2004501511A JP 2001583508 A JP2001583508 A JP 2001583508A JP 2001583508 A JP2001583508 A JP 2001583508A JP 2004501511 A JP2004501511 A JP 2004501511A
- Authority
- JP
- Japan
- Prior art keywords
- reference voltage
- support member
- thickness
- layer
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000725 suspension Substances 0.000 title claims abstract description 83
- 239000004020 conductor Substances 0.000 claims abstract description 35
- 229920000642 polymer Polymers 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 42
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 239000000956 alloy Substances 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 6
- 229920005570 flexible polymer Polymers 0.000 claims description 5
- 239000004642 Polyimide Substances 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000011574 phosphorus Substances 0.000 claims description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 3
- 229910052718 tin Inorganic materials 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 229920000728 polyester Polymers 0.000 claims description 2
- 239000002861 polymer material Substances 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 93
- 238000000034 method Methods 0.000 description 48
- 229920002120 photoresistant polymer Polymers 0.000 description 39
- 238000007747 plating Methods 0.000 description 30
- 230000008569 process Effects 0.000 description 28
- 238000004519 manufacturing process Methods 0.000 description 23
- 230000000712 assembly Effects 0.000 description 18
- 238000000429 assembly Methods 0.000 description 18
- 239000000758 substrate Substances 0.000 description 17
- 239000011241 protective layer Substances 0.000 description 11
- 238000013461 design Methods 0.000 description 10
- 239000010935 stainless steel Substances 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 10
- 238000007772 electroless plating Methods 0.000 description 8
- 238000005530 etching Methods 0.000 description 8
- 230000033001 locomotion Effects 0.000 description 8
- 239000000243 solution Substances 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000012545 processing Methods 0.000 description 5
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000009713 electroplating Methods 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 description 3
- 238000003486 chemical etching Methods 0.000 description 3
- 239000003638 chemical reducing agent Substances 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- 229910000521 B alloy Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000011135 tin Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229920002160 Celluloid Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910001096 P alloy Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910000365 copper sulfate Inorganic materials 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000006722 reduction reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
- G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0352—Differences between the conductors of different layers of a multilayer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/567,783 US6480359B1 (en) | 2000-05-09 | 2000-05-09 | Hard disk drive suspension with integral flexible circuit |
| PCT/US2000/027495 WO2001086641A1 (en) | 2000-05-09 | 2000-10-05 | Hard disk drive suspension with integral flexible circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004501511A true JP2004501511A (ja) | 2004-01-15 |
| JP2004501511A5 JP2004501511A5 (enExample) | 2007-11-22 |
Family
ID=24268622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001583508A Withdrawn JP2004501511A (ja) | 2000-05-09 | 2000-10-05 | 一体のフレキシブル回路を有するハードディスクドライブサスペンション |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6480359B1 (enExample) |
| JP (1) | JP2004501511A (enExample) |
| AU (1) | AU2000278611A1 (enExample) |
| WO (1) | WO2001086641A1 (enExample) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006278734A (ja) * | 2005-03-29 | 2006-10-12 | Nitto Denko Corp | 配線回路基板 |
| WO2006112406A1 (ja) * | 2005-04-18 | 2006-10-26 | Mitsui Chemicals, Inc. | 金属積層体及びその製造方法と用途 |
| JP2007019261A (ja) * | 2005-07-07 | 2007-01-25 | Nitto Denko Corp | 配線回路基板 |
| JP2008103745A (ja) * | 2007-11-12 | 2008-05-01 | Nitto Denko Corp | 配線回路基板の製造方法 |
| JP2008109147A (ja) * | 2007-11-12 | 2008-05-08 | Nitto Denko Corp | 配線回路基板 |
| JPWO2006109507A1 (ja) * | 2005-03-31 | 2008-10-23 | 新日鐵化学株式会社 | Ｈｄｄサスペンション用積層体及びその製造方法 |
| JP2008282995A (ja) * | 2007-05-10 | 2008-11-20 | Nitto Denko Corp | 配線回路基板 |
| US8266794B2 (en) | 2006-08-30 | 2012-09-18 | Nitto Denko Corporation | Method of producing a wired circuit board |
| US8367937B2 (en) | 2008-09-03 | 2013-02-05 | Nitto Denko Corporation | Printed circuit board with a signal line pair and method of manufacturing the same |
| JP2017195221A (ja) * | 2016-04-18 | 2017-10-26 | 日東電工株式会社 | 配線回路基板およびその製造方法 |
| KR20190098001A (ko) * | 2018-02-13 | 2019-08-21 | 칩본드 테크놀러지 코포레이션 | 칩온필름 구조 및 그 플렉시블 기판 |
Families Citing this family (56)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6480359B1 (en) * | 2000-05-09 | 2002-11-12 | 3M Innovative Properties Company | Hard disk drive suspension with integral flexible circuit |
| JP3766585B2 (ja) * | 2000-09-04 | 2006-04-12 | アルプス電気株式会社 | 磁気ヘッド装置の製造方法 |
| JP3663345B2 (ja) * | 2000-09-04 | 2005-06-22 | アルプス電気株式会社 | 磁気ヘッド装置 |
| JP3738679B2 (ja) * | 2000-09-12 | 2006-01-25 | Ｔｄｋ株式会社 | ヘッドジンバルアセンブリ |
| JP3988420B2 (ja) * | 2001-09-19 | 2007-10-10 | Ｔｄｋ株式会社 | 薄膜磁気ヘッド用配線部材、ヘッドジンバルアセンブリ、ヘッドジンバルアセンブリの検査方法及びヘッドジンバルアセンブリの製造方法 |
| US6940697B2 (en) * | 2001-12-05 | 2005-09-06 | Samsung Electronics Co., Ltd. | Interconnection scheme for head arms of disk drive actuator |
| JP3929319B2 (ja) * | 2002-02-01 | 2007-06-13 | 富士通株式会社 | サスペンション及び磁気記録読出装置 |
| US7130157B2 (en) * | 2002-08-14 | 2006-10-31 | Seagate Technology Llc | Head suspension having a displacement limiter |
| CN100476981C (zh) * | 2003-03-17 | 2009-04-08 | 新科实业有限公司 | 制造硬盘驱动器悬架挠性梁的系统与方法 |
| JP4222882B2 (ja) * | 2003-06-03 | 2009-02-12 | 日東電工株式会社 | 配線回路基板 |
| JP2005011387A (ja) * | 2003-06-16 | 2005-01-13 | Hitachi Global Storage Technologies Inc | 磁気ディスク装置 |
| US7004441B1 (en) * | 2003-07-24 | 2006-02-28 | Rutland Michael D | Clippable plastic note |
| US7006331B1 (en) * | 2003-09-30 | 2006-02-28 | Western Digital Technologies, Inc. | Head gimbal assembly including a trace suspension assembly backing layer with a conductive layer formed upon a gimbal having a lower oxidation rate |
| US6903891B1 (en) * | 2003-11-24 | 2005-06-07 | Seagate Technology Llc | Photoconductive optical write driver for magnetic recording |
| JP2007537562A (ja) * | 2004-05-14 | 2007-12-20 | ハッチンソン テクノロジー インコーポレーティッド | サスペンションアセンブリ用貴金属導電性リードの作製方法 |
| US20060158784A1 (en) * | 2005-01-18 | 2006-07-20 | Arya Satya P | Method and apparatus for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension |
| US7523549B1 (en) * | 2005-04-15 | 2009-04-28 | Magnecomp Corporation | Dimensionally stabilized flexible circuit fabrication method and product |
| US7379271B1 (en) * | 2005-05-16 | 2008-05-27 | Magnecomp Corporation | Multilayer gimbal suspension element manufacture with co-etchable layers |
| JP4619214B2 (ja) * | 2005-07-04 | 2011-01-26 | 日東電工株式会社 | 配線回路基板 |
| CN100546432C (zh) | 2005-10-25 | 2009-09-30 | 比亚迪股份有限公司 | 一种挠性印刷线路板的制造方法 |
| JP4615427B2 (ja) * | 2005-12-01 | 2011-01-19 | 日東電工株式会社 | 配線回路基板 |
| JP4588622B2 (ja) * | 2005-12-08 | 2010-12-01 | 日東電工株式会社 | 配線回路基板の製造方法 |
| US7518830B1 (en) * | 2006-04-19 | 2009-04-14 | Hutchinson Technology Incorporated | Dual sided electrical traces for disk drive suspension flexures |
| JP2008034639A (ja) * | 2006-07-28 | 2008-02-14 | Nitto Denko Corp | 配線回路基板 |
| US7710687B1 (en) | 2006-09-13 | 2010-05-04 | Hutchinson Technology Incorporated | High conductivity ground planes for integrated lead suspensions |
| US7929252B1 (en) * | 2006-10-10 | 2011-04-19 | Hutchinson Technology Incorporated | Multi-layer ground plane structures for integrated lead suspensions |
| US7832082B1 (en) | 2006-10-10 | 2010-11-16 | Hutchinson Technology Incorporated | Method for manufacturing an integrated lead suspension component |
| US7903376B2 (en) * | 2007-04-16 | 2011-03-08 | Hitachi Global Storage Technologies Netherlands, B.V. | Integrated lead suspension for vibration damping in magnetic storage device |
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| US20090274834A1 (en) * | 2008-05-01 | 2009-11-05 | Xerox Corporation | Bimetallic nanoparticles for conductive ink applications |
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- 2000-10-05 JP JP2001583508A patent/JP2004501511A/ja not_active Withdrawn
- 2000-10-05 AU AU2000278611A patent/AU2000278611A1/en not_active Abandoned
- 2000-10-05 WO PCT/US2000/027495 patent/WO2001086641A1/en not_active Ceased
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2002
- 2002-09-27 US US10/259,005 patent/US6735052B2/en not_active Expired - Fee Related
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| KR20190098001A (ko) * | 2018-02-13 | 2019-08-21 | 칩본드 테크놀러지 코포레이션 | 칩온필름 구조 및 그 플렉시블 기판 |
| KR102027393B1 (ko) * | 2018-02-13 | 2019-10-01 | 칩본드 테크놀러지 코포레이션 | 칩온필름 구조 및 그 플렉시블 기판 |
| US10580729B2 (en) | 2018-02-13 | 2020-03-03 | Chipbond Technology Corporation | Chip on film package and flexible substrate thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| US20030053258A1 (en) | 2003-03-20 |
| AU2000278611A1 (en) | 2001-11-20 |
| WO2001086641A1 (en) | 2001-11-15 |
| US6735052B2 (en) | 2004-05-11 |
| US6480359B1 (en) | 2002-11-12 |
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