AU2000278611A1 - Hard disk drive suspension with integral flexible circuit - Google Patents

Hard disk drive suspension with integral flexible circuit

Info

Publication number
AU2000278611A1
AU2000278611A1 AU2000278611A AU7861100A AU2000278611A1 AU 2000278611 A1 AU2000278611 A1 AU 2000278611A1 AU 2000278611 A AU2000278611 A AU 2000278611A AU 7861100 A AU7861100 A AU 7861100A AU 2000278611 A1 AU2000278611 A1 AU 2000278611A1
Authority
AU
Australia
Prior art keywords
hard disk
disk drive
flexible circuit
drive suspension
integral flexible
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2000278611A
Other languages
English (en)
Inventor
Christopher G. Dunn
Nathan P. Kreutter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2000278611A1 publication Critical patent/AU2000278611A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H05K1/0281—Reinforcement details thereof
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/484—Integrated arm assemblies, e.g. formed by material deposition or by etching from single piece of metal or by lamination of materials forming a single arm/suspension/head unit
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
    • G11B5/4806—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed specially adapted for disk drive assemblies, e.g. assembly prior to operation, hard or flexible disk drives
    • G11B5/4826—Mounting, aligning or attachment of the transducer head relative to the arm assembly, e.g. slider holding members, gimbals, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0352—Differences between the conductors of different layers of a multilayer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supporting Of Heads In Record-Carrier Devices (AREA)
  • Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
  • Structure Of Printed Boards (AREA)
AU2000278611A 2000-05-09 2000-10-05 Hard disk drive suspension with integral flexible circuit Abandoned AU2000278611A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/567,783 US6480359B1 (en) 2000-05-09 2000-05-09 Hard disk drive suspension with integral flexible circuit
US09567783 2000-05-09
PCT/US2000/027495 WO2001086641A1 (en) 2000-05-09 2000-10-05 Hard disk drive suspension with integral flexible circuit

Publications (1)

Publication Number Publication Date
AU2000278611A1 true AU2000278611A1 (en) 2001-11-20

Family

ID=24268622

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2000278611A Abandoned AU2000278611A1 (en) 2000-05-09 2000-10-05 Hard disk drive suspension with integral flexible circuit

Country Status (4)

Country Link
US (2) US6480359B1 (enExample)
JP (1) JP2004501511A (enExample)
AU (1) AU2000278611A1 (enExample)
WO (1) WO2001086641A1 (enExample)

Families Citing this family (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6480359B1 (en) * 2000-05-09 2002-11-12 3M Innovative Properties Company Hard disk drive suspension with integral flexible circuit
JP3766585B2 (ja) * 2000-09-04 2006-04-12 アルプス電気株式会社 磁気ヘッド装置の製造方法
JP3663345B2 (ja) * 2000-09-04 2005-06-22 アルプス電気株式会社 磁気ヘッド装置
JP3738679B2 (ja) * 2000-09-12 2006-01-25 Ｔｄｋ株式会社 ヘッドジンバルアセンブリ
JP3988420B2 (ja) * 2001-09-19 2007-10-10 Ｔｄｋ株式会社 薄膜磁気ヘッド用配線部材、ヘッドジンバルアセンブリ、ヘッドジンバルアセンブリの検査方法及びヘッドジンバルアセンブリの製造方法
US6940697B2 (en) * 2001-12-05 2005-09-06 Samsung Electronics Co., Ltd. Interconnection scheme for head arms of disk drive actuator
JP3929319B2 (ja) * 2002-02-01 2007-06-13 富士通株式会社 サスペンション及び磁気記録読出装置
US7130157B2 (en) * 2002-08-14 2006-10-31 Seagate Technology Llc Head suspension having a displacement limiter
CN100476981C (zh) * 2003-03-17 2009-04-08 新科实业有限公司 制造硬盘驱动器悬架挠性梁的系统与方法
JP4222882B2 (ja) * 2003-06-03 2009-02-12 日東電工株式会社 配線回路基板
JP2005011387A (ja) * 2003-06-16 2005-01-13 Hitachi Global Storage Technologies Inc 磁気ディスク装置
US7004441B1 (en) * 2003-07-24 2006-02-28 Rutland Michael D Clippable plastic note
US7006331B1 (en) * 2003-09-30 2006-02-28 Western Digital Technologies, Inc. Head gimbal assembly including a trace suspension assembly backing layer with a conductive layer formed upon a gimbal having a lower oxidation rate
US6903891B1 (en) * 2003-11-24 2005-06-07 Seagate Technology Llc Photoconductive optical write driver for magnetic recording
JP2007537562A (ja) * 2004-05-14 2007-12-20 ハッチンソン テクノロジー インコーポレーティッド サスペンションアセンブリ用貴金属導電性リードの作製方法
US20060158784A1 (en) * 2005-01-18 2006-07-20 Arya Satya P Method and apparatus for extending a cover layer formation with respect to a solder pad portion on an electrical lead suspension
JP4611075B2 (ja) * 2005-03-29 2011-01-12 日東電工株式会社 配線回路基板
TWI290093B (en) * 2005-03-31 2007-11-21 Nippon Steel Chemical Co Laminate for HDD suspension and process for producing the same
US7523549B1 (en) * 2005-04-15 2009-04-28 Magnecomp Corporation Dimensionally stabilized flexible circuit fabrication method and product
US20090035541A1 (en) * 2005-04-18 2009-02-05 Mitsui Chemicals, Inc. Metal laminate, method for manufacturing same and use thereof
US7379271B1 (en) * 2005-05-16 2008-05-27 Magnecomp Corporation Multilayer gimbal suspension element manufacture with co-etchable layers
JP4619214B2 (ja) * 2005-07-04 2011-01-26 日東電工株式会社 配線回路基板
JP4640802B2 (ja) * 2005-07-07 2011-03-02 日東電工株式会社 回路付サスペンション基板
CN100546432C (zh) 2005-10-25 2009-09-30 比亚迪股份有限公司 一种挠性印刷线路板的制造方法
JP4615427B2 (ja) * 2005-12-01 2011-01-19 日東電工株式会社 配線回路基板
JP4588622B2 (ja) * 2005-12-08 2010-12-01 日東電工株式会社 配線回路基板の製造方法
US7518830B1 (en) * 2006-04-19 2009-04-14 Hutchinson Technology Incorporated Dual sided electrical traces for disk drive suspension flexures
JP2008034639A (ja) * 2006-07-28 2008-02-14 Nitto Denko Corp 配線回路基板
JP4865453B2 (ja) * 2006-08-30 2012-02-01 日東電工株式会社 配線回路基板およびその製造方法
US7710687B1 (en) 2006-09-13 2010-05-04 Hutchinson Technology Incorporated High conductivity ground planes for integrated lead suspensions
US7929252B1 (en) * 2006-10-10 2011-04-19 Hutchinson Technology Incorporated Multi-layer ground plane structures for integrated lead suspensions
US7832082B1 (en) 2006-10-10 2010-11-16 Hutchinson Technology Incorporated Method for manufacturing an integrated lead suspension component
US7903376B2 (en) * 2007-04-16 2011-03-08 Hitachi Global Storage Technologies Netherlands, B.V. Integrated lead suspension for vibration damping in magnetic storage device
JP2008282995A (ja) * 2007-05-10 2008-11-20 Nitto Denko Corp 配線回路基板
JP4640853B2 (ja) * 2007-11-12 2011-03-02 日東電工株式会社 配線回路基板
JP4640852B2 (ja) * 2007-11-12 2011-03-02 日東電工株式会社 配線回路基板の製造方法
US8169746B1 (en) 2008-04-08 2012-05-01 Hutchinson Technology Incorporated Integrated lead suspension with multiple trace configurations
US20090274834A1 (en) * 2008-05-01 2009-11-05 Xerox Corporation Bimetallic nanoparticles for conductive ink applications
JP5091810B2 (ja) * 2008-09-03 2012-12-05 日東電工株式会社 配線回路基板およびその製造方法
JP5142951B2 (ja) * 2008-11-10 2013-02-13 日東電工株式会社 配線回路基板およびその製造方法
US8045297B2 (en) * 2008-11-25 2011-10-25 Hitachi Global Storage Technologies, Netherlands B.V. Flex cable and method for lowering flex cable impedance
US8542465B2 (en) 2010-03-17 2013-09-24 Western Digital Technologies, Inc. Suspension assembly having a microactuator electrically connected to a gold coating on a stainless steel surface
US8885299B1 (en) 2010-05-24 2014-11-11 Hutchinson Technology Incorporated Low resistance ground joints for dual stage actuation disk drive suspensions
US8665567B2 (en) 2010-06-30 2014-03-04 Western Digital Technologies, Inc. Suspension assembly having a microactuator grounded to a flexure
JP5583539B2 (ja) * 2010-10-01 2014-09-03 日本発條株式会社 フレキシャの配線構造
JP5762119B2 (ja) * 2011-05-06 2015-08-12 日東電工株式会社 回路付きサスペンション基板およびその製造方法
JP5938223B2 (ja) * 2012-02-10 2016-06-22 日東電工株式会社 配線回路基板およびその製造方法
WO2013138619A1 (en) 2012-03-16 2013-09-19 Hutchinson Technology Incorporated Mid-loadbeam dual stage actuated (dsa) disk drive head suspension
CN104205216A (zh) 2012-03-22 2014-12-10 哈特奇桑科技公司 用于磁盘驱动器磁头悬架挠性件的接地特征
US8861141B2 (en) 2012-08-31 2014-10-14 Hutchinson Technology Incorporated Damped dual stage actuation disk drive suspensions
WO2014043498A2 (en) 2012-09-14 2014-03-20 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions
JP6356682B2 (ja) 2012-10-10 2018-07-11 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 二段作動構造を有するサスペンション
US8941951B2 (en) 2012-11-28 2015-01-27 Hutchinson Technology Incorporated Head suspension flexure with integrated strain sensor and sputtered traces
US8891206B2 (en) 2012-12-17 2014-11-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffener
US8896969B1 (en) 2013-05-23 2014-11-25 Hutchinson Technology Incorporated Two-motor co-located gimbal-based dual stage actuation disk drive suspensions with motor stiffeners
US8717712B1 (en) 2013-07-15 2014-05-06 Hutchinson Technology Incorporated Disk drive suspension assembly having a partially flangeless load point dimple
US8792214B1 (en) 2013-07-23 2014-07-29 Hutchinson Technology Incorporated Electrical contacts to motors in dual stage actuated suspensions
US8675314B1 (en) 2013-08-21 2014-03-18 Hutchinson Technology Incorporated Co-located gimbal-based dual stage actuation disk drive suspensions with offset motors
US8896970B1 (en) 2013-12-31 2014-11-25 Hutchinson Technology Incorporated Balanced co-located gimbal-based dual stage actuation disk drive suspensions
US8867173B1 (en) 2014-01-03 2014-10-21 Hutchinson Technology Incorporated Balanced multi-trace transmission in a hard disk drive flexure
US9070392B1 (en) 2014-12-16 2015-06-30 Hutchinson Technology Incorporated Piezoelectric disk drive suspension motors having plated stiffeners
US9318136B1 (en) 2014-12-22 2016-04-19 Hutchinson Technology Incorporated Multilayer disk drive motors having out-of-plane bending
US9296188B1 (en) 2015-02-17 2016-03-29 Hutchinson Technology Incorporated Partial curing of a microactuator mounting adhesive in a disk drive suspension
JP6689294B2 (ja) 2015-06-30 2020-04-28 ハッチンソン テクノロジー インコーポレイテッドＨｕｔｃｈｉｎｓｏｎ Ｔｅｃｈｎｏｌｏｇｙ Ｉｎｃｏｒｐｏｒａｔｅｄ 金誘電体接合部の信頼性を向上させたディスクドライブヘッドサスペンション構造
JP6688667B2 (ja) * 2016-04-18 2020-04-28 日東電工株式会社 配線回路基板およびその製造方法
US9646638B1 (en) 2016-05-12 2017-05-09 Hutchinson Technology Incorporated Co-located gimbal-based DSA disk drive suspension with traces routed around slider pad
TWI646637B (zh) 2018-02-13 2019-01-01 頎邦科技股份有限公司 薄膜覆晶封裝結構及其可撓性基板

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US6480359B1 (en) * 2000-05-09 2002-11-12 3M Innovative Properties Company Hard disk drive suspension with integral flexible circuit

Also Published As

Publication number Publication date
US20030053258A1 (en) 2003-03-20
JP2004501511A (ja) 2004-01-15
WO2001086641A1 (en) 2001-11-15
US6735052B2 (en) 2004-05-11
US6480359B1 (en) 2002-11-12

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