JP2004219318A - 放射線検出器 - Google Patents

放射線検出器 Download PDF

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Publication number
JP2004219318A
JP2004219318A JP2003008507A JP2003008507A JP2004219318A JP 2004219318 A JP2004219318 A JP 2004219318A JP 2003008507 A JP2003008507 A JP 2003008507A JP 2003008507 A JP2003008507 A JP 2003008507A JP 2004219318 A JP2004219318 A JP 2004219318A
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JP
Japan
Prior art keywords
core layer
chip
radiation
metal core
radiation detector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003008507A
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English (en)
Japanese (ja)
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JP2004219318A5 (enExample
Inventor
Yoshihisa Kotooka
義久 琴岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Priority to JP2003008507A priority Critical patent/JP2004219318A/ja
Publication of JP2004219318A publication Critical patent/JP2004219318A/ja
Publication of JP2004219318A5 publication Critical patent/JP2004219318A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Light Receiving Elements (AREA)
  • Measurement Of Radiation (AREA)
JP2003008507A 2003-01-16 2003-01-16 放射線検出器 Pending JP2004219318A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003008507A JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003008507A JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Publications (2)

Publication Number Publication Date
JP2004219318A true JP2004219318A (ja) 2004-08-05
JP2004219318A5 JP2004219318A5 (enExample) 2005-11-24

Family

ID=32898277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003008507A Pending JP2004219318A (ja) 2003-01-16 2003-01-16 放射線検出器

Country Status (1)

Country Link
JP (1) JP2004219318A (enExample)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007155562A (ja) * 2005-12-07 2007-06-21 Acrorad Co Ltd 放射線画像検出モジュールおよび放射線画像検出装置
WO2008007613A1 (fr) * 2006-07-11 2008-01-17 Hamamatsu Photonics K.K. Tableau de connexions et dispositif d'imagerie à semi-conducteurs
JP2008073522A (ja) * 2006-09-18 2008-04-03 General Electric Co <Ge> インタフェイス・アセンブリ、及びセンサ・アレイにデータ取得システムを一体形成する方法
JP2009076726A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009074964A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009112667A (ja) * 2007-11-09 2009-05-28 Fujifilm Corp 放射線画像撮影装置
JP2009268900A (ja) * 2008-04-30 2009-11-19 General Electric Co <Ge> 計算機式断層写真法検出器装置
US7626155B2 (en) 2004-10-26 2009-12-01 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
WO2010038877A1 (ja) * 2008-10-03 2010-04-08 株式会社 東芝 放射線検出装置及び放射線撮影装置
JP2013175540A (ja) * 2012-02-24 2013-09-05 Nikon Corp 固体撮像装置および固体撮像装置の製造方法
JP2015503096A (ja) * 2011-11-29 2015-01-29 コーニンクレッカ フィリップス エヌ ヴェ Ｘ線吸収封止部を含むシンチレータパックおよびかかるシンチレータパックを有するｘ線検出器アレイ
WO2016174939A1 (ja) * 2015-04-27 2016-11-03 ソニー株式会社 放射線検出装置、撮像装置、および撮像システム
CN111522052A (zh) * 2020-05-13 2020-08-11 奕瑞新材料科技（太仓）有限公司 一种x光探测器结构及其工作方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136298A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd プリント回路基板の製造方法
JPH0367471U (enExample) * 1989-11-02 1991-07-01
JPH07209430A (ja) * 1993-12-06 1995-08-11 Minnesota Mining & Mfg Co <3M> 放射線固体検出パネル
JPH11220656A (ja) * 1998-01-30 1999-08-10 Canon Inc 二次元撮像装置の実装構造
JPH11345956A (ja) * 1998-03-16 1999-12-14 Canon Inc 撮像装置
JP2001099942A (ja) * 1999-09-29 2001-04-13 Toshiba Corp Ｘ線平面検出装置
JP2001215281A (ja) * 2000-02-02 2001-08-10 Toshiba Corp Ｘ線ｃｔ用二次元検出器
JP2001318155A (ja) * 2000-02-28 2001-11-16 Toshiba Corp 放射線検出器、およびｘ線ｃｔ装置
JP2002034968A (ja) * 2000-07-25 2002-02-05 Toshiba Corp Ｘ線ｃｔ装置
JP2002116261A (ja) * 2000-07-04 2002-04-19 Canon Inc 放射線撮像装置及びシステム
JP2002214352A (ja) * 2001-01-19 2002-07-31 Canon Inc 放射線画像撮影装置
JP2002359476A (ja) * 2001-02-28 2002-12-13 Siemens Ag プリント板装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03136298A (ja) * 1989-10-20 1991-06-11 Fujitsu Ltd プリント回路基板の製造方法
JPH0367471U (enExample) * 1989-11-02 1991-07-01
JPH07209430A (ja) * 1993-12-06 1995-08-11 Minnesota Mining & Mfg Co <3M> 放射線固体検出パネル
JPH11220656A (ja) * 1998-01-30 1999-08-10 Canon Inc 二次元撮像装置の実装構造
JPH11345956A (ja) * 1998-03-16 1999-12-14 Canon Inc 撮像装置
JP2001099942A (ja) * 1999-09-29 2001-04-13 Toshiba Corp Ｘ線平面検出装置
JP2001215281A (ja) * 2000-02-02 2001-08-10 Toshiba Corp Ｘ線ｃｔ用二次元検出器
JP2001318155A (ja) * 2000-02-28 2001-11-16 Toshiba Corp 放射線検出器、およびｘ線ｃｔ装置
JP2002116261A (ja) * 2000-07-04 2002-04-19 Canon Inc 放射線撮像装置及びシステム
JP2002034968A (ja) * 2000-07-25 2002-02-05 Toshiba Corp Ｘ線ｃｔ装置
JP2002214352A (ja) * 2001-01-19 2002-07-31 Canon Inc 放射線画像撮影装置
JP2002359476A (ja) * 2001-02-28 2002-12-13 Siemens Ag プリント板装置

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101122344B1 (ko) * 2004-10-26 2012-03-27 소니 주식회사 반도체 이미지 센서 모듈, 반도체 이미지 센서 모듈의 제조방법, 카메라 및 카메라의 제조 방법
US10930694B2 (en) 2004-10-26 2021-02-23 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
US7626155B2 (en) 2004-10-26 2009-12-01 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
US10319772B2 (en) 2004-10-26 2019-06-11 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
US9269736B2 (en) 2004-10-26 2016-02-23 Sony Corporation Semiconductor image sensor module, method for manufacturing the same as well as camera and method for manufacturing the same
JP2007155562A (ja) * 2005-12-07 2007-06-21 Acrorad Co Ltd 放射線画像検出モジュールおよび放射線画像検出装置
WO2008007613A1 (fr) * 2006-07-11 2008-01-17 Hamamatsu Photonics K.K. Tableau de connexions et dispositif d'imagerie à semi-conducteurs
JP2008073522A (ja) * 2006-09-18 2008-04-03 General Electric Co <Ge> インタフェイス・アセンブリ、及びセンサ・アレイにデータ取得システムを一体形成する方法
JP2009076726A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009074964A (ja) * 2007-09-21 2009-04-09 Kyocera Corp Ｘ線検出素子搭載用配線基板およびｘ線検出装置
JP2009112667A (ja) * 2007-11-09 2009-05-28 Fujifilm Corp 放射線画像撮影装置
JP2009268900A (ja) * 2008-04-30 2009-11-19 General Electric Co <Ge> 計算機式断層写真法検出器装置
US8366319B2 (en) 2008-10-03 2013-02-05 Kabushiki Kaisha Toshiba Radiation detection apparatus and radiographic apparatus
JPWO2010038877A1 (ja) * 2008-10-03 2012-03-01 株式会社東芝 放射線検出装置及び放射線撮影装置
WO2010038877A1 (ja) * 2008-10-03 2010-04-08 株式会社 東芝 放射線検出装置及び放射線撮影装置
JP2015503096A (ja) * 2011-11-29 2015-01-29 コーニンクレッカ フィリップス エヌ ヴェ Ｘ線吸収封止部を含むシンチレータパックおよびかかるシンチレータパックを有するｘ線検出器アレイ
JP2013175540A (ja) * 2012-02-24 2013-09-05 Nikon Corp 固体撮像装置および固体撮像装置の製造方法
WO2016174939A1 (ja) * 2015-04-27 2016-11-03 ソニー株式会社 放射線検出装置、撮像装置、および撮像システム
CN111522052A (zh) * 2020-05-13 2020-08-11 奕瑞新材料科技（太仓）有限公司 一种x光探测器结构及其工作方法
CN111522052B (zh) * 2020-05-13 2022-03-25 奕瑞新材料科技（太仓）有限公司 一种x光探测器结构及其工作方法

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