JP2009544011A5 - - Google Patents

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Publication number
JP2009544011A5
JP2009544011A5 JP2009519593A JP2009519593A JP2009544011A5 JP 2009544011 A5 JP2009544011 A5 JP 2009544011A5 JP 2009519593 A JP2009519593 A JP 2009519593A JP 2009519593 A JP2009519593 A JP 2009519593A JP 2009544011 A5 JP2009544011 A5 JP 2009544011A5
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JP
Japan
Prior art keywords
substrate
shield
detector
photodiode
bonded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2009519593A
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English (en)
Japanese (ja)
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JP2009544011A (ja
JP5082064B2 (ja
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Publication date
Priority claimed from US11/456,662 external-priority patent/US7504637B2/en
Application filed filed Critical
Publication of JP2009544011A publication Critical patent/JP2009544011A/ja
Publication of JP2009544011A5 publication Critical patent/JP2009544011A5/ja
Application granted granted Critical
Publication of JP5082064B2 publication Critical patent/JP5082064B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009519593A 2006-07-11 2007-07-03 ２コンポーネント検出器、ｘ線照射検出器、フォトダイオード検出器アレイの回路ダイを遮蔽する方法 Expired - Fee Related JP5082064B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/456,662 2006-07-11
US11/456,662 US7504637B2 (en) 2006-07-11 2006-07-11 Two component photodiode detector
PCT/US2007/072780 WO2008082689A1 (en) 2006-07-11 2007-07-03 Two component photodiode detector

Publications (3)

Publication Number Publication Date
JP2009544011A JP2009544011A (ja) 2009-12-10
JP2009544011A5 true JP2009544011A5 (enExample) 2010-04-15
JP5082064B2 JP5082064B2 (ja) 2012-11-28

Family

ID=38948316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009519593A Expired - Fee Related JP5082064B2 (ja) 2006-07-11 2007-07-03 ２コンポーネント検出器、ｘ線照射検出器、フォトダイオード検出器アレイの回路ダイを遮蔽する方法

Country Status (5)

Country Link
US (1) US7504637B2 (enExample)
EP (1) EP2041605B1 (enExample)
JP (1) JP5082064B2 (enExample)
IL (1) IL196436A (enExample)
WO (1) WO2008082689A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7535033B2 (en) * 2004-09-14 2009-05-19 Banpil Photonics, Inc. Multicolor photodiode array and method of manufacturing
JP2007258199A (ja) * 2006-03-20 2007-10-04 Nec Electronics Corp 撮像素子
KR101441630B1 (ko) * 2008-02-12 2014-09-23 삼성디스플레이 주식회사 엑스레이 검출기 및 이의 제조방법
JP2012509492A (ja) * 2008-11-18 2012-04-19 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ スペクトルイメージング検出器
DE102010011582B4 (de) * 2010-03-16 2011-12-01 Siemens Aktiengesellschaft Detektormodul für einen Strahlendetektor und Strahlendetektor
CN103339527B (zh) 2011-02-03 2016-06-22 皇家飞利浦有限公司 单能量或多能量垂直辐射敏感探测器
US8829454B2 (en) 2012-02-27 2014-09-09 Analog Devices, Inc. Compact sensor module
US9116022B2 (en) 2012-12-07 2015-08-25 Analog Devices, Inc. Compact sensor module
US20140348290A1 (en) * 2013-05-23 2014-11-27 General Electric Company Apparatus and Method for Low Capacitance Packaging for Direct Conversion X-Ray or Gamma Ray Detector
DE102014211602B4 (de) * 2014-06-17 2018-10-25 Siemens Healthcare Gmbh Detektormodul für einen Röntgendetektor
US10488532B2 (en) * 2014-10-20 2019-11-26 Analogic Corporation Detector unit for detector array of radiation imaging modality
DE102014222690B4 (de) * 2014-11-06 2024-10-02 Siemens Healthineers Ag Detektormodul für einen Röntgendetektor
WO2016113647A1 (en) * 2015-01-15 2016-07-21 Koninklijke Philips N.V. Imaging detector module assembly
JP6559977B2 (ja) * 2015-03-05 2019-08-14 キヤノンメディカルシステムズ株式会社 検出器パック、ｘ線ｃｔ装置
US9835733B2 (en) * 2015-04-30 2017-12-05 Zhengrong Ying Apparatus for detecting X-rays
US10074624B2 (en) 2015-08-07 2018-09-11 Analog Devices, Inc. Bond pads with differently sized openings
US11156727B2 (en) * 2015-10-02 2021-10-26 Varian Medical Systems, Inc. High DQE imaging device
US11056455B2 (en) 2017-08-01 2021-07-06 Analog Devices, Inc. Negative fillet for mounting an integrated device die to a carrier
WO2020118102A1 (en) 2018-12-06 2020-06-11 Analog Devices, Inc. Shielded integrated device packages
CN113228272B (zh) 2018-12-06 2025-02-28 美国亚德诺半导体公司 具有无源器件组件的集成器件封装
US11664340B2 (en) 2020-07-13 2023-05-30 Analog Devices, Inc. Negative fillet for mounting an integrated device die to a carrier
WO2022101313A1 (en) 2020-11-13 2022-05-19 Ams-Osram Ag Module assembly for detection of x-ray radiation
US20230400421A1 (en) * 2020-11-25 2023-12-14 Hamamatsu Photonics K.K. Imaging unit and imaging system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3957803B2 (ja) * 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
JP4532782B2 (ja) * 2000-07-04 2010-08-25 キヤノン株式会社 放射線撮像装置及びシステム
JP2003084066A (ja) * 2001-04-11 2003-03-19 Nippon Kessho Kogaku Kk 放射線検出器用部品、放射線検出器および放射線検出装置
US6510195B1 (en) * 2001-07-18 2003-01-21 Koninklijke Philips Electronics, N.V. Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same
JP4364514B2 (ja) * 2003-01-08 2009-11-18 浜松ホトニクス株式会社 配線基板、及びそれを用いた放射線検出器
JP4133429B2 (ja) * 2003-02-24 2008-08-13 浜松ホトニクス株式会社 半導体装置
JP4421209B2 (ja) * 2003-04-11 2010-02-24 浜松ホトニクス株式会社 放射線検出器

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