IL196436A - Two-component photodiode detector - Google Patents

Two-component photodiode detector

Info

Publication number
IL196436A
IL196436A IL196436A IL19643609A IL196436A IL 196436 A IL196436 A IL 196436A IL 196436 A IL196436 A IL 196436A IL 19643609 A IL19643609 A IL 19643609A IL 196436 A IL196436 A IL 196436A
Authority
IL
Israel
Prior art keywords
photodiode detector
component photodiode
component
detector
photodiode
Prior art date
Application number
IL196436A
Other languages
English (en)
Hebrew (he)
Other versions
IL196436A0 (en
Inventor
Sean Thorne
Original Assignee
Aeroflex Colorado Springs Inc
Sean Thorne
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aeroflex Colorado Springs Inc, Sean Thorne filed Critical Aeroflex Colorado Springs Inc
Publication of IL196436A0 publication Critical patent/IL196436A0/en
Publication of IL196436A publication Critical patent/IL196436A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01T—MEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00—Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16—Measuring radiation intensity
    • G01T1/20—Measuring radiation intensity with scintillation detectors
    • G01T1/2018—Scintillation-photodiode combinations
    • G01T1/20188—Auxiliary details, e.g. casings or cooling
    • G01T1/2019—Shielding against direct hits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1895—X-ray, gamma-ray or corpuscular radiation imagers of the hybrid type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/189—X-ray, gamma-ray or corpuscular radiation imagers
    • H10F39/1898—Indirect radiation image sensors, e.g. using luminescent members
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Molecular Biology (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Measurement Of Radiation (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Light Receiving Elements (AREA)
  • Apparatus For Radiation Diagnosis (AREA)
IL196436A 2006-07-11 2009-01-11 Two-component photodiode detector IL196436A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/456,662 US7504637B2 (en) 2006-07-11 2006-07-11 Two component photodiode detector
PCT/US2007/072780 WO2008082689A1 (en) 2006-07-11 2007-07-03 Two component photodiode detector

Publications (2)

Publication Number Publication Date
IL196436A0 IL196436A0 (en) 2009-09-22
IL196436A true IL196436A (en) 2013-05-30

Family

ID=38948316

Family Applications (1)

Application Number Title Priority Date Filing Date
IL196436A IL196436A (en) 2006-07-11 2009-01-11 Two-component photodiode detector

Country Status (5)

Country Link
US (1) US7504637B2 (enExample)
EP (1) EP2041605B1 (enExample)
JP (1) JP5082064B2 (enExample)
IL (1) IL196436A (enExample)
WO (1) WO2008082689A1 (enExample)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7535033B2 (en) * 2004-09-14 2009-05-19 Banpil Photonics, Inc. Multicolor photodiode array and method of manufacturing
JP2007258199A (ja) * 2006-03-20 2007-10-04 Nec Electronics Corp 撮像素子
KR101441630B1 (ko) * 2008-02-12 2014-09-23 삼성디스플레이 주식회사 엑스레이 검출기 및 이의 제조방법
WO2010058309A2 (en) * 2008-11-18 2010-05-27 Koninklijke Philips Electronics N.V. Spectral imaging detector
DE102010011582B4 (de) * 2010-03-16 2011-12-01 Siemens Aktiengesellschaft Detektormodul für einen Strahlendetektor und Strahlendetektor
US9140808B2 (en) 2011-02-03 2015-09-22 Koninklijke Philips N.V. Single or multi-energy vertical radiation sensitive detectors
US8829454B2 (en) 2012-02-27 2014-09-09 Analog Devices, Inc. Compact sensor module
US9116022B2 (en) 2012-12-07 2015-08-25 Analog Devices, Inc. Compact sensor module
US20140348290A1 (en) * 2013-05-23 2014-11-27 General Electric Company Apparatus and Method for Low Capacitance Packaging for Direct Conversion X-Ray or Gamma Ray Detector
DE102014211602B4 (de) * 2014-06-17 2018-10-25 Siemens Healthcare Gmbh Detektormodul für einen Röntgendetektor
US10488532B2 (en) * 2014-10-20 2019-11-26 Analogic Corporation Detector unit for detector array of radiation imaging modality
DE102014222690B4 (de) * 2014-11-06 2024-10-02 Siemens Healthineers Ag Detektormodul für einen Röntgendetektor
WO2016113647A1 (en) * 2015-01-15 2016-07-21 Koninklijke Philips N.V. Imaging detector module assembly
JP6559977B2 (ja) * 2015-03-05 2019-08-14 キヤノンメディカルシステムズ株式会社 検出器パック、ｘ線ｃｔ装置
US9835733B2 (en) * 2015-04-30 2017-12-05 Zhengrong Ying Apparatus for detecting X-rays
US10074624B2 (en) 2015-08-07 2018-09-11 Analog Devices, Inc. Bond pads with differently sized openings
US11156727B2 (en) * 2015-10-02 2021-10-26 Varian Medical Systems, Inc. High DQE imaging device
US11056455B2 (en) 2017-08-01 2021-07-06 Analog Devices, Inc. Negative fillet for mounting an integrated device die to a carrier
WO2020118102A1 (en) 2018-12-06 2020-06-11 Analog Devices, Inc. Shielded integrated device packages
JP2022510692A (ja) 2018-12-06 2022-01-27 アナログ ディヴァイスィズ インク パッシブデバイスアセンブリを備えた集積デバイスパッケージ
US11664340B2 (en) 2020-07-13 2023-05-30 Analog Devices, Inc. Negative fillet for mounting an integrated device die to a carrier
DE112021005396T5 (de) * 2020-11-13 2023-09-07 Ams-Osram Ag Modulanordnung zur erfassung von röntgenstrahlung
US20230400421A1 (en) * 2020-11-25 2023-12-14 Hamamatsu Photonics K.K. Imaging unit and imaging system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3957803B2 (ja) * 1996-02-22 2007-08-15 キヤノン株式会社 光電変換装置
JP4532782B2 (ja) * 2000-07-04 2010-08-25 キヤノン株式会社 放射線撮像装置及びシステム
JP2003084066A (ja) * 2001-04-11 2003-03-19 Nippon Kessho Kogaku Kk 放射線検出器用部品、放射線検出器および放射線検出装置
US6510195B1 (en) * 2001-07-18 2003-01-21 Koninklijke Philips Electronics, N.V. Solid state x-radiation detector modules and mosaics thereof, and an imaging method and apparatus employing the same
JP4133429B2 (ja) * 2003-02-24 2008-08-13 浜松ホトニクス株式会社 半導体装置
JP4364514B2 (ja) * 2003-01-08 2009-11-18 浜松ホトニクス株式会社 配線基板、及びそれを用いた放射線検出器
JP4421209B2 (ja) * 2003-04-11 2010-02-24 浜松ホトニクス株式会社 放射線検出器

Also Published As

Publication number Publication date
WO2008082689A8 (en) 2009-02-26
EP2041605A4 (en) 2012-01-18
JP5082064B2 (ja) 2012-11-28
US7504637B2 (en) 2009-03-17
EP2041605B1 (en) 2014-04-30
EP2041605A1 (en) 2009-04-01
WO2008082689A1 (en) 2008-07-10
US20080011959A1 (en) 2008-01-17
JP2009544011A (ja) 2009-12-10
IL196436A0 (en) 2009-09-22

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