JP2004160977A - 物品用バリヤ層及び膨張性熱プラズマによるバリヤ層の形成方法 - Google Patents

物品用バリヤ層及び膨張性熱プラズマによるバリヤ層の形成方法 Download PDF

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JP2004160977A
JP2004160977A JP2003144218A JP2003144218A JP2004160977A JP 2004160977 A JP2004160977 A JP 2004160977A JP 2003144218 A JP2003144218 A JP 2003144218A JP 2003144218 A JP2003144218 A JP 2003144218A JP 2004160977 A JP2004160977 A JP 2004160977A
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substrate
barrier layer
article
metal
combinations
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JP2003144218A
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Japanese (ja)
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JP2004160977A5 (enExample
Inventor
Marc Schaepkens
マーク・スハープケンス
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General Electric Co
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General Electric Co
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Publication of JP2004160977A publication Critical patent/JP2004160977A/ja
Publication of JP2004160977A5 publication Critical patent/JP2004160977A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • C23C16/34—Nitrides
    • C23C16/345—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/513—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using plasma jets
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12044—OLED
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T50/00—Aeronautics or air transport
    • Y02T50/60—Efficient propulsion technologies, e.g. for aircraft
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/913—Material designed to be responsive to temperature, light, moisture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/266—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension of base or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31507—Of polycarbonate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31855—Of addition polymer from unsaturated monomers

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Organic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Inorganic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
  • Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
  • Chemical Vapour Deposition (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
JP2003144218A 2002-05-23 2003-05-22 物品用バリヤ層及び膨張性熱プラズマによるバリヤ層の形成方法 Pending JP2004160977A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/063,917 US6743524B2 (en) 2002-05-23 2002-05-23 Barrier layer for an article and method of making said barrier layer by expanding thermal plasma

Publications (2)

Publication Number Publication Date
JP2004160977A true JP2004160977A (ja) 2004-06-10
JP2004160977A5 JP2004160977A5 (enExample) 2006-07-06

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JP2003144218A Pending JP2004160977A (ja) 2002-05-23 2003-05-22 物品用バリヤ層及び膨張性熱プラズマによるバリヤ層の形成方法

Country Status (3)

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US (3) US6743524B2 (enExample)
EP (1) EP1365458A1 (enExample)
JP (1) JP2004160977A (enExample)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006239883A (ja) * 2005-02-28 2006-09-14 Fuji Photo Film Co Ltd 水蒸気バリアフィルム
JP2008504114A (ja) * 2004-06-25 2008-02-14 アプライド　マテリアルズ　インコーポレイテッド カプセル化膜の遮水性能の改善
JP2008532852A (ja) * 2005-03-18 2008-08-21 エクスアテック、エル．エル．シー． 発光性プラスチックの窓ガラス
JP2008546211A (ja) * 2005-06-10 2008-12-18 ゼネラル・エレクトリック・カンパニイ 気密封止パッケージ及びその製造方法
JP2010511975A (ja) * 2006-11-30 2010-04-15 コーニング インコーポレイテッド 薄膜バリアを有する可撓基板
JP2010215967A (ja) * 2009-03-17 2010-09-30 Fujifilm Corp ガスバリア膜の製造方法、太陽電池用ガスバリアフィルム、および、ディスプレイ用ガスバリアフィルム
JP2012215825A (ja) * 2011-03-25 2012-11-08 Fujifilm Corp 熱線遮蔽材および貼合せ構造体
JP2014525647A (ja) * 2011-08-10 2014-09-29 ゼネラル・エレクトリック・カンパニイ エネルギー遮断層を有する有機発光ダイオードパッケージ
US8901015B2 (en) 2012-02-15 2014-12-02 Applied Materials, Inc. Method for depositing an inorganic encapsulating film
US9893242B2 (en) 2015-09-30 2018-02-13 Nichia Corporation Light emitting device

Families Citing this family (93)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8664030B2 (en) 1999-03-30 2014-03-04 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US20090111206A1 (en) 1999-03-30 2009-04-30 Daniel Luch Collector grid, electrode structures and interrconnect structures for photovoltaic arrays and methods of manufacture
US8222513B2 (en) 2006-04-13 2012-07-17 Daniel Luch Collector grid, electrode structures and interconnect structures for photovoltaic arrays and methods of manufacture
US8138413B2 (en) 2006-04-13 2012-03-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8076568B2 (en) * 2006-04-13 2011-12-13 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US7507903B2 (en) * 1999-03-30 2009-03-24 Daniel Luch Substrate and collector grid structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US20100330748A1 (en) 1999-10-25 2010-12-30 Xi Chu Method of encapsulating an environmentally sensitive device
US6623861B2 (en) 2001-04-16 2003-09-23 Battelle Memorial Institute Multilayer plastic substrates
US6866901B2 (en) 1999-10-25 2005-03-15 Vitex Systems, Inc. Method for edge sealing barrier films
US7198832B2 (en) * 1999-10-25 2007-04-03 Vitex Systems, Inc. Method for edge sealing barrier films
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US7898053B2 (en) 2000-02-04 2011-03-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US7898054B2 (en) 2000-02-04 2011-03-01 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
US8198696B2 (en) 2000-02-04 2012-06-12 Daniel Luch Substrate structures for integrated series connected photovoltaic arrays and process of manufacture of such arrays
FR2827396B1 (fr) * 2001-07-12 2003-11-14 Saint Gobain Dispositif electrocommandable a proprietes optiques et/ou energetiques variables
US8900366B2 (en) 2002-04-15 2014-12-02 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US8808457B2 (en) * 2002-04-15 2014-08-19 Samsung Display Co., Ltd. Apparatus for depositing a multilayer coating on discrete sheets
US20040229051A1 (en) * 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US7086918B2 (en) * 2002-12-11 2006-08-08 Applied Materials, Inc. Low temperature process for passivation applications
US6890656B2 (en) * 2002-12-20 2005-05-10 General Electric Company High rate deposition of titanium dioxide
US7648925B2 (en) 2003-04-11 2010-01-19 Vitex Systems, Inc. Multilayer barrier stacks and methods of making multilayer barrier stacks
US7510913B2 (en) 2003-04-11 2009-03-31 Vitex Systems, Inc. Method of making an encapsulated plasma sensitive device
US7002292B2 (en) * 2003-07-22 2006-02-21 E. I. Du Pont De Nemours And Company Organic electronic device
DE102004001603B4 (de) * 2004-01-09 2009-03-05 Schott Ag Behälter mit Innendekor
US20050202263A1 (en) * 2004-03-09 2005-09-15 Jonathan Sargent Barrier layer to prevent the loss of additives in an underlying layer
US7106488B2 (en) * 2004-03-23 2006-09-12 Air Products And Chemicals, Inc. Hybrid process for depositing electrochromic coating
JP2005285659A (ja) * 2004-03-30 2005-10-13 Toyota Industries Corp 有機ｅｌ装置及びその製造方法
US7695805B2 (en) * 2004-11-30 2010-04-13 Tdk Corporation Transparent conductor
DE102005025083B4 (de) * 2005-05-30 2007-05-24 Infineon Technologies Ag Thermoplast-Duroplast-Verbund und Verfahren zum Verbinden eines thermoplastischen Materials mit einem duroplastischen Material
US20070020451A1 (en) * 2005-07-20 2007-01-25 3M Innovative Properties Company Moisture barrier coatings
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US7829147B2 (en) 2005-08-18 2010-11-09 Corning Incorporated Hermetically sealing a device without a heat treating step and the resulting hermetically sealed device
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
US7767498B2 (en) 2005-08-25 2010-08-03 Vitex Systems, Inc. Encapsulated devices and method of making
FR2893427B1 (fr) * 2005-11-16 2008-01-04 Saint Gobain Systeme electrochimique sur plastique
US8729385B2 (en) 2006-04-13 2014-05-20 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9006563B2 (en) 2006-04-13 2015-04-14 Solannex, Inc. Collector grid and interconnect structures for photovoltaic arrays and modules
US8884155B2 (en) 2006-04-13 2014-11-11 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US8822810B2 (en) 2006-04-13 2014-09-02 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9865758B2 (en) 2006-04-13 2018-01-09 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
US9236512B2 (en) 2006-04-13 2016-01-12 Daniel Luch Collector grid and interconnect structures for photovoltaic arrays and modules
GB0607746D0 (en) * 2006-04-20 2006-05-31 Pilkington Plc Glazing
GB0607743D0 (en) * 2006-04-20 2006-05-31 Pilkington Plc Laminated glazing
US20080006819A1 (en) * 2006-06-19 2008-01-10 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
US20080138538A1 (en) * 2006-12-06 2008-06-12 General Electric Company Barrier layer, composite article comprising the same, electroactive device, and method
EP2111562B1 (en) 2007-01-22 2018-09-19 E Ink Corporation Multi-layer sheet for use in electro-optic displays
US8241713B2 (en) * 2007-02-21 2012-08-14 3M Innovative Properties Company Moisture barrier coatings for organic light emitting diode devices
CN101668714A (zh) * 2007-04-09 2010-03-10 Lg化学株式会社 多层光致变色板和由其制得的光致变色玻璃
EP2171534B1 (en) * 2007-06-22 2015-12-02 The Regents of the University of Colorado Protective coatings for organic electronic devices made using atomic layer deposition and molecular layer deposition techniques
US20090200553A1 (en) * 2007-11-30 2009-08-13 Applied Materials, Inc High temperature thin film transistor on soda lime glass
EP2232575A4 (en) * 2007-12-14 2012-07-11 Miasole BEFORE THE ENVIRONMENT PROTECTED PHOTOVOLTAIC ARRANGEMENTS
US8497015B2 (en) * 2008-03-11 2013-07-30 Ppg Industries Ohio, Inc. Reflective article
US20100043863A1 (en) * 2008-03-20 2010-02-25 Miasole Interconnect assembly
US20110197947A1 (en) 2008-03-20 2011-08-18 Miasole Wire network for interconnecting photovoltaic cells
US8912429B2 (en) * 2008-03-20 2014-12-16 Hanergy Holding Group Ltd. Interconnect assembly
US20090283140A1 (en) * 2008-05-19 2009-11-19 James Freitag Method of making contact to a solar cell employing a group ibiiiavia compound absorber layer
US8207012B2 (en) * 2008-04-28 2012-06-26 Solopower, Inc. Method and apparatus for achieving low resistance contact to a metal based thin film solar cell
ITMI20081374A1 (it) * 2008-07-25 2010-01-26 Getters Spa Assorbitore composito di h2o per dispositivi medicali sigillati
JP5374980B2 (ja) * 2008-09-10 2013-12-25 ソニー株式会社 固体撮像装置
US20100122730A1 (en) * 2008-11-17 2010-05-20 Corneille Jason S Power-loss-inhibiting current-collector
KR20100071650A (ko) * 2008-12-19 2010-06-29 삼성전자주식회사 가스차단성박막, 이를 포함하는 전자소자 및 이의 제조방법
US9337446B2 (en) 2008-12-22 2016-05-10 Samsung Display Co., Ltd. Encapsulated RGB OLEDs having enhanced optical output
US9184410B2 (en) 2008-12-22 2015-11-10 Samsung Display Co., Ltd. Encapsulated white OLEDs having enhanced optical output
CN101783395A (zh) * 2009-01-20 2010-07-21 京东方科技集团股份有限公司 有机电致发光器件及其制造方法
US9007674B2 (en) * 2011-09-30 2015-04-14 View, Inc. Defect-mitigation layers in electrochromic devices
TWI391886B (zh) * 2009-06-12 2013-04-01 Au Optronics Corp 可撓性觸控顯示裝置
CN103597119B (zh) 2009-07-08 2017-03-08 艾克斯特朗欧洲公司 用于等离子体处理的装置和方法
US8362356B2 (en) * 2009-08-13 2013-01-29 Gtat Corporation Intermetal stack for use in a photovoltaic device
MX2012002156A (es) * 2009-08-24 2012-04-02 First Solar Inc Oxido conductor transparente impurificado.
US8590338B2 (en) 2009-12-31 2013-11-26 Samsung Mobile Display Co., Ltd. Evaporator with internal restriction
TWI514608B (zh) 2010-01-14 2015-12-21 Dow Global Technologies Llc 具曝露式導電柵格之防溼光伏打裝置
WO2011100085A2 (en) * 2010-02-09 2011-08-18 Dow Global Technologies Inc. Moisture resistant photovoltaic devices with improved adhesion of barrier film
US9061344B1 (en) 2010-05-26 2015-06-23 Apollo Precision (Fujian) Limited Apparatuses and methods for fabricating wire current collectors and interconnects for solar cells
US8766240B2 (en) 2010-09-21 2014-07-01 Universal Display Corporation Permeation barrier for encapsulation of devices and substrates
US10026859B2 (en) 2010-10-04 2018-07-17 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Small gauge wire solar cell interconnect
CN102560490A (zh) * 2010-12-28 2012-07-11 鸿富锦精密工业（深圳）有限公司 铝及铝合金表面防腐处理方法及其制品
US8765232B2 (en) 2011-01-10 2014-07-01 Plasmasi, Inc. Apparatus and method for dielectric deposition
US8951824B1 (en) 2011-04-08 2015-02-10 Apollo Precision (Fujian) Limited Adhesives for attaching wire network to photovoltaic cells
US9299956B2 (en) 2012-06-13 2016-03-29 Aixtron, Inc. Method for deposition of high-performance coatings and encapsulated electronic devices
US10526708B2 (en) 2012-06-19 2020-01-07 Aixtron Se Methods for forming thin protective and optical layers on substrates
US20140048013A1 (en) * 2012-08-17 2014-02-20 Intermolecular, Inc. SEED LAYER FOR ZnO AND DOPED-ZnO THIN FILM NUCLEATION AND METHODS OF SEED LAYER DEPOSITION
CN104051357B (zh) 2013-03-15 2017-04-12 财团法人工业技术研究院 环境敏感电子装置以及其封装方法
EP3008514B1 (en) 2013-06-12 2023-08-02 View, Inc. Pretreatment of transparent conductive oxide (tco) thin films for improved electrical contact
US9513380B2 (en) 2014-07-25 2016-12-06 General Electric Company X-ray detectors supported on a substrate having a surrounding metal barrier
US10712454B2 (en) 2014-07-25 2020-07-14 General Electric Company X-ray detectors supported on a substrate having a metal barrier
DE102015102870A1 (de) * 2015-02-27 2016-09-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Reflektorelement und Verfahren zu dessen Herstellung
WO2017184430A1 (en) 2016-04-19 2017-10-26 Sage Electrochromics, Inc. Electrochromic device including a transparent conductive oxide layer and a bus bar and a process of forming the same
JP6907032B2 (ja) * 2017-06-06 2021-07-21 株式会社ジャパンディスプレイ 表示装置及びその製造方法
EP3682295B1 (en) 2017-09-12 2023-09-06 Sage Electrochromics, Inc. Non-light-emitting variable transmission device and a method of forming the same
CN111512222B (zh) 2017-11-20 2024-01-30 Sage电致变色显示有限公司 非发光可变透射设备及其制造工艺
US11362293B2 (en) * 2018-05-31 2022-06-14 Massachusetts Institute Of Technology Interlayers and associated systems, devices, and methods
US11028805B2 (en) 2019-01-09 2021-06-08 Saudi Arabian Oil Company System and method for on-board catalytic upgrading of hydrocarbon fuels
KR102506156B1 (ko) * 2020-11-13 2023-03-06 한국광기술원 구멍을 포함하는 태양전지 모듈 및 그를 제조하는 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4709991A (en) * 1983-04-26 1987-12-01 Seiko Epson Kabushiki Kaisha Liquid crystal display with barrier layer to reduce permeability
NL8701530A (nl) 1987-06-30 1989-01-16 Stichting Fund Ond Material Werkwijze voor het behandelen van oppervlakken van substraten met behulp van een plasma en reactor voor het uitvoeren van die werkwijze.
CA2044053C (en) 1990-06-08 2001-11-27 Roger W. Phillips Barrier film having high colorless transparency and method
MX9303141A (es) * 1992-05-28 1994-04-29 Polar Materials Inc Metodos y aparatos para depositar recubrimientos de barrera.
JPH0796977A (ja) * 1993-06-08 1995-04-11 Ajinomoto Co Inc 易酸化性物品二重包装物
FR2712310B1 (fr) 1993-11-09 1995-12-22 Pechiney Recherche Revêtement transparent à propriété barrière pour film plastique d'emballage flexible.
JP3017912B2 (ja) * 1993-12-13 2000-03-13 シャープ株式会社 液晶表示装置用電極基板及び液晶表示装置
JPH10154824A (ja) * 1996-11-21 1998-06-09 Nippon Oil Co Ltd 光電変換装置
JP3290375B2 (ja) * 1997-05-12 2002-06-10 松下電器産業株式会社 有機電界発光素子
US6110544A (en) 1997-06-26 2000-08-29 General Electric Company Protective coating by high rate arc plasma deposition
EP1014399B1 (en) * 1998-12-22 2006-05-17 Matsushita Electric Industrial Co., Ltd. Flexible thin film capacitor and method for producing the same
US6355125B1 (en) * 1999-03-26 2002-03-12 Agfa-Gevaert Method for making an electric or electronic module comprising a glass laminate
US6413645B1 (en) 2000-04-20 2002-07-02 Battelle Memorial Institute Ultrabarrier substrates
US6468708B1 (en) * 2000-04-20 2002-10-22 Eastman Kodak Company Self-contained humidity stabilized imaging media comprising microencapsulated color formers
JP4595276B2 (ja) * 2000-12-25 2010-12-08 東洋製罐株式会社 マイクロ波プラズマ処理方法及び装置
AU2003211169A1 (en) * 2003-02-20 2004-09-17 General Electric Company Apparatus and method for depositing large area coatings on planar surfaces

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008504114A (ja) * 2004-06-25 2008-02-14 アプライド　マテリアルズ　インコーポレイテッド カプセル化膜の遮水性能の改善
JP2006239883A (ja) * 2005-02-28 2006-09-14 Fuji Photo Film Co Ltd 水蒸気バリアフィルム
US9315148B2 (en) 2005-03-18 2016-04-19 Exatec Llc Light emissive plastic glazing
JP2008532852A (ja) * 2005-03-18 2008-08-21 エクスアテック、エル．エル．シー． 発光性プラスチックの窓ガラス
US9871199B2 (en) 2005-03-18 2018-01-16 Sabic Global Technologies B.V. Light emissive plastic glazing having a multilayered configuration for illuminating passenger compartment
JP2008546211A (ja) * 2005-06-10 2008-12-18 ゼネラル・エレクトリック・カンパニイ 気密封止パッケージ及びその製造方法
JP2010511975A (ja) * 2006-11-30 2010-04-15 コーニング インコーポレイテッド 薄膜バリアを有する可撓基板
JP2010215967A (ja) * 2009-03-17 2010-09-30 Fujifilm Corp ガスバリア膜の製造方法、太陽電池用ガスバリアフィルム、および、ディスプレイ用ガスバリアフィルム
US8455059B2 (en) 2009-03-17 2013-06-04 Fujifilm Corporation Method of producing gas barrier layer, gas barrier film for solar batteries and gas barrier film for displays
JP2012215825A (ja) * 2011-03-25 2012-11-08 Fujifilm Corp 熱線遮蔽材および貼合せ構造体
JP2014525647A (ja) * 2011-08-10 2014-09-29 ゼネラル・エレクトリック・カンパニイ エネルギー遮断層を有する有機発光ダイオードパッケージ
US8901015B2 (en) 2012-02-15 2014-12-02 Applied Materials, Inc. Method for depositing an inorganic encapsulating film
US9893242B2 (en) 2015-09-30 2018-02-13 Nichia Corporation Light emitting device

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