JP2004115799A5 - - Google Patents

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Publication number
JP2004115799A5
JP2004115799A5 JP2003330655A JP2003330655A JP2004115799A5 JP 2004115799 A5 JP2004115799 A5 JP 2004115799A5 JP 2003330655 A JP2003330655 A JP 2003330655A JP 2003330655 A JP2003330655 A JP 2003330655A JP 2004115799 A5 JP2004115799 A5 JP 2004115799A5
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JP
Japan
Prior art keywords
crankshaft
aromatic
monomer
diamine
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003330655A
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English (en)
Japanese (ja)
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JP2004115799A (ja
Filing date
Publication date
Priority claimed from US10/251,134 external-priority patent/US6956098B2/en
Application filed filed Critical
Publication of JP2004115799A publication Critical patent/JP2004115799A/ja
Publication of JP2004115799A5 publication Critical patent/JP2004115799A5/ja
Pending legal-status Critical Current

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JP2003330655A 2002-09-20 2003-09-22 エレクトロニクス用途向け誘電性基体として有用な高弾性率ポリイミド組成物およびそれと関連する方法 Pending JP2004115799A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/251,134 US6956098B2 (en) 2002-09-20 2002-09-20 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2004115799A JP2004115799A (ja) 2004-04-15
JP2004115799A5 true JP2004115799A5 (enExample) 2006-10-26

Family

ID=31946459

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003330655A Pending JP2004115799A (ja) 2002-09-20 2003-09-22 エレクトロニクス用途向け誘電性基体として有用な高弾性率ポリイミド組成物およびそれと関連する方法

Country Status (5)

Country Link
US (1) US6956098B2 (enExample)
EP (1) EP1400552B1 (enExample)
JP (1) JP2004115799A (enExample)
DE (1) DE60324998D1 (enExample)
TW (1) TWI258485B (enExample)

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US20090011231A1 (en) 2004-10-05 2009-01-08 Hisayasu Kaneshiro Adhesive Sheet and Copper-Clad Laminate
JP4548828B2 (ja) * 2004-10-29 2010-09-22 Ｄｏｗａホールディングス株式会社 金属被覆基板の製造方法
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JP2006278664A (ja) * 2005-03-29 2006-10-12 Toyobo Co Ltd 薄膜コンデンサ用誘電体積層フィルムおよびその製法
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KR101107847B1 (ko) * 2006-12-12 2012-01-31 이 아이 듀폰 디 네모아 앤드 캄파니 결정질 봉지재
US8309627B2 (en) 2007-09-07 2012-11-13 Nexolve Corporation Polymeric coating for the protection of objects
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US9877673B2 (en) * 2010-12-10 2018-01-30 Clinitech, Llc Transdermal sampling and analysis device
JP6600943B2 (ja) * 2012-12-21 2019-11-06 日立化成デュポンマイクロシステムズ株式会社 ポリイミド前駆体、該ポリイミド前駆体を含む感光性樹脂組成物、それを用いたパターン硬化膜の製造方法及び半導体装置
US10898116B2 (en) 2013-03-15 2021-01-26 Cambridge Medical Technologies LLC Methods of manufacture to optimize performance of transdermal sampling and analysis device
CN105705334B (zh) * 2013-11-01 2018-03-20 杜邦-东丽株式会社 石墨层压体
CN105015099B (zh) * 2014-04-30 2017-06-06 台虹科技股份有限公司 聚酰亚胺/金属复合积层板及其制备方法
US9694569B2 (en) 2014-06-24 2017-07-04 Taiflex Scientific Co., Ltd. Polyimide metal laminated plate and method of making the same
US10511100B2 (en) * 2016-02-02 2019-12-17 Georgia Tech Research Corporation Inkjet printed flexible Van Atta array sensor
JP6928114B2 (ja) 2017-05-15 2021-09-01 アルファ・アセンブリー・ソリューションズ・インコーポレイテッドＡｌｐｈａ Ａｓｓｅｍｂｌｙ Ｓｏｌｕｔｉｏｎｓ Ｉｎｃ． 誘電体インク組成物
US11633129B2 (en) 2019-04-05 2023-04-25 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating redox cofactors
TW202513670A (zh) * 2019-06-14 2025-04-01 美商杜邦電子股份有限公司 聚合物膜及電子裝置
US11375931B2 (en) 2019-08-08 2022-07-05 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating an electrochemical bioassay
KR102396418B1 (ko) * 2019-11-29 2022-05-12 피아이첨단소재 주식회사 폴리이미드 필름, 이의 제조 방법, 및 이를 포함한 연성 금속박 적층판
CN119081110A (zh) * 2024-05-22 2024-12-06 哈尔滨理工大学 一种高温耐电晕聚酰亚胺基复合电介质及其制备方法

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