WO2006104228A1 - 芳香族ポリイミドフィルムおよびその製造方法 - Google Patents
芳香族ポリイミドフィルムおよびその製造方法 Download PDFInfo
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- WO2006104228A1 WO2006104228A1 PCT/JP2006/306983 JP2006306983W WO2006104228A1 WO 2006104228 A1 WO2006104228 A1 WO 2006104228A1 JP 2006306983 W JP2006306983 W JP 2006306983W WO 2006104228 A1 WO2006104228 A1 WO 2006104228A1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
- B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
- B29C55/10—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
- B29C55/12—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
- B29C55/16—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial simultaneously
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/24—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of indefinite length
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
- B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
- B29C55/10—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial
- B29C55/12—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial
- B29C55/14—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets multiaxial biaxial successively
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
- C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
- B29K2079/08—PI, i.e. polyimides or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
Definitions
- the present invention relates to an aromatic polyimide film having a specific elastic modulus and thermal expansion coefficient and a method for producing the same. More specifically, the present invention relates to an aromatic polyimide film used as a support for an electric wiring board in which a metal foil or a metal thin film typified by copper foil is laminated, and a method for producing the same. Background art
- Aromatic polyimide film has excellent heat resistance and mechanical properties, and is used as a substrate material for flexible printed circuit boards (FPC) for electronic devices such as cameras, personal computers, and liquid crystal displays. Widely used.
- FPC flexible printed circuit boards
- a method of laminating copper foil using an adhesive such as an epoxy resin is employed.
- films with thinner thickness and superior dimensional stability are required.
- it is required to be stable against temperature changes during solder reflow because it is used by being bonded to copper foil.
- the difference in thermal expansion coefficient from copper has become a problem in reducing the warpage of the substrate during and after the process, and improvement of the aromatic polyimide structure is proposed. Has been. ,
- an aromatic polyimide film for example, an in-plane anisotropy index is 20 or less, an average in-plane coefficient of thermal expansion (CTE) is at least 10% smaller than an unstretched film, isotropic and An aromatic polyimide film that has been biaxially oriented so that the plane orientation coefficient is 0.11 or more has been proposed (Patent Document 1).
- Patent ⁇ tribute 1
- the inventor examined the relationship between the draw ratio and the in-plane thermal expansion coefficient of the aromatic polyimide film. As a result, the inventors have found that an aromatic polyimide film having a low in-plane thermal expansion coefficient and excellent dimensional stability can be obtained by stretching a gel film at an unprecedented high magnification, thereby completing the present invention.
- the present inventor also examined the stretchability of the gel film.
- the imidization index of the gel film is set within a predetermined range, the stretch ratio in the running direction and the width direction can be freely set, and even if the elastic modulus is the same as that of the conventional aromatic polyimide film, it is in-plane.
- the present invention has been completed by finding that a film having a low thermal expansion coefficient can be obtained. It was also found that even better results were obtained when the degree of swelling of the gel film was within a predetermined range.
- the present invention provides the following formula (I)
- CTE MD is the in-plane thermal expansion coefficient in the running direction (ppm 'K—
- CTE TD is the in-plane thermal expansion coefficient in the width direction (p pm' K
- M i MD is the elastic modulus (GP a) in the running direction
- M i TD is an aromatic polyimide film satisfying the following, which represents the elastic modulus (GPa) in the width direction.
- the present invention also provides an aromatic tetracarboxylic acid (component A) containing 70 mol% or more of pyromellitic anhydride and an aromatic diamine (component B) containing 70 mol% or more of 4,4′-diaminodiphenyl ether. Is reacted in an organic solvent in the range of 0.95 ⁇ A component / B component (molar ratio) ⁇ 1.05, and 70 mol of pyromellitic acid and 4,4,1-diaminodiphenyl ether-derived repeating units are added.
- the aromatic polyimide film of the present invention has the following formula (I)
- the aromatic polyimide can be produced by reacting an aromatic tetracarboxylic acid component mainly composed of pyromellitic acid and an aromatic diamine component mainly composed of 4,4′-diaminodiphenyl ether.
- the repeating unit represented by the formula (I) is a repeating unit derived from pyromellitic acid and 4,4′-diaminodiphenyl ether.
- the repeating unit other than formula (I) is 30 mol% or less, preferably 0 to 10 mol%, more preferably 0 to 5 mol%.
- aromatic tetracarboxylic acid components constituting the repeating unit other than the formula (I) include 1, 2, 3, 4-benzenetetracarboxylic acid, 2, 3, 5, 6-pyridine carboxylic acid. 2, 3, 4, 5-thiophenetetracarboxylic acid, 2,
- aromatic tetracarboxylic acid components 3, 3 ′, 4, 4′—benzophenone tetracarboxylic acid and 3, 3 ′, 4, 4′—biphenyl tetracarboxylic acid are preferable.
- aromatic diamine components constituting the repeating unit other than formula (I) include, for example, 1,3-phenylene diamine, 1,4-diaminonaphthalene, 1,5-diaminonaphthalene, 1, 8 —Diaminonaphthalene, 2, 6-Diaminonaphthalene, 2, 7-Diaminonaphthalene, 2, 6-Diaminoanthracene, 2,7-Diaminoanthracene, 1,8-Diaminoanthracene, 2 , 4-Diaminotoluene, 2,5-Diamino (m-xylene), 2,5-Diaminopyridine, 2,6-Diaminopyridine, 3,5-Diaminopyridine, 2,4-Diaminotoluenebenzine, 3, 3'-diaminobiphenyl, 3, 3'-dichroic benzidine, 3, 3 'monodimethylpentidine, 3, 3'-dimethoxybenzidine, 2, 2',-diaminobenzophenone, 4,
- Preferred other aromatic diamine components are 1,3_phenylenediamine, 3,4, diaminodiphenyl ether and 1,3-bis (3-aminophenoxy) benzene.
- 3,4′-diaminodiphenyl ether is particularly preferred for realizing low moisture absorption and low elasticity.
- the film of the present invention satisfies the following formulas (1) and (2).
- CTE MD is the in-plane thermal expansion coefficient in the running direction (ppm ⁇ K-
- CTE TD is the in-plane thermal expansion coefficient in the width direction (ppm 'K- 1 )
- M i MD is the elastic modulus in the running direction.
- M i TD represents the elastic modulus (GP a) in the width direction.
- Equations (1) and (2) indicate that the in-plane thermal expansion coefficient of the film is below a specific numerical range defined by the elastic modulus.
- the film of the present invention is a film having a small in-plane thermal expansion coefficient even when the modulus of elasticity is comparable when compared with a conventional aromatic polyimide film.
- the film of the present invention preferably satisfies the following formulas (la) and (2 a).
- the film of the present invention more preferably satisfies the following formulas (l b) and (2 b).
- the lower limit of CTE the lower one is preferable in order to match the thermal expansion coefficient with various metal materials and realize dimensional stability, but it is the extent shown by the following formulas (1 z) and (2 z) .
- the elastic modulus M i (GP a) can be measured by a conventionally known film tensile test.
- the in-plane thermal expansion coefficient (p pm 'K- ⁇ is measured by a conventionally known thermomechanical analysis.
- the CTE MD and CTE TD of the film of the present invention are preferably about the same as the thermal expansion coefficient of copper (18 p pm ⁇ K- 1 ). That is, the CTE MD and CTE TD of the film of the present invention are both preferably 15 to 25 ppm ⁇ K—, more preferably 16 to 23 ppm ′ K 1 . By setting the range of 0 1 to 15 in this range, there is an advantage that warpage due to a difference in thermal expansion caused by heating is unlikely to occur when bonded to copper.
- I CTE MD —CTE TD I is preferably 0 to 7 p pm ⁇ K 1 .
- the M i MD and M i TD of the film of the present invention are preferably both 0.5-7 GPa, more preferably:! ⁇ 5GP a.
- the relationship between the refractive index (n) and the in-plane thermal expansion coefficient (CTE) preferably satisfies the following formulas (3) and (4).
- CTE MD is the in-plane thermal expansion coefficient in the running direction (ppm * ⁇ —
- CTE TD is the width In-plane thermal expansion coefficient (ppm 'K-
- n MD represents the refractive index in the running direction
- n TD represents the refractive index in the width direction.
- Refractive index n can be measured with a conventionally known Abbe refractometer.
- the film of the present invention more preferably satisfies the following formulas (3 a) and (4 a).
- both n MD and n TD are preferably 1.700 to 1.800, more preferably 1.720 to 1.780.
- the film of the present invention has an arithmetic average of in-plane thermal expansion coefficient (CTE) in the running direction and the width direction, that is, (CTE MD + CTE TD ) 2 is preferably 5 to 25 ppm ⁇ K 1 , more preferably 8 ⁇ 23 p pm ⁇ K— More preferably, 12 to 22 ppm ⁇ K— 1 .
- CTE MD + CTE TD in-plane thermal expansion coefficient
- the film of the present invention has a plane orientation coefficient of preferably 0.125 to 0.15, more preferably 0.126 to 0.145, and still more preferably 0.1286 to 0.141.
- the plane orientation coefficient can be obtained from the difference between the average refractive index in the running direction and the width direction of the film and the refractive index in the thickness direction.
- the difference ( ⁇ ) between the maximum refractive index n Max and the minimum refractive index ⁇ Min in the film plane is preferably 0.05 or less.
- Maximum refractive index (n Ma x) or minimum refractive index (n Mi n) is normally or running direction of the film corresponds to one of the vertical direction of that, the direction running showing maximum refractive index (n Max) Direction, the direction showing the minimum refractive index (n Min ) is the width direction. Further, if the width direction direction showing a maximum refractive index (n Max), the direction indicated minimum refractive index (n Mi n) is the running Direction. The smaller ⁇ is, the smaller the anisotropy is in the in-plane physical properties of the film.
- the coefficient of thermal expansion of the film depends on the direction of the film. This is preferable in order to prevent differences in physical properties.
- An is 0 when there is no anisotropy and is preferably smaller, preferably 0. 03 or less, more preferably 0.02 or less, and still more preferably 0.015 or less.
- the average thickness of the film of the present invention is preferably 0.5 to 20 m, more preferably 1 to 15 m, still more preferably 1.5 to 12 / xm, and particularly preferably 2 to 8 ⁇ m.
- the average thickness can be obtained from an average value obtained by cutting the film into 16 cm squares and measuring 9 points evenly.
- the aromatic polyimide film of the present invention can be produced by steps (1) to (5).
- Step (1) consists of aromatic tetracarboxylic acid (component A) containing 70 mol% or more of pyromellitic anhydride and aromatic diamine (component B) containing 70 mol% or more of 4,4'-diaminodiphenyl ether.
- aromatic tetracarboxylic acid component A
- aromatic diamine component B
- the organic solvent in a molar ratio of 0.995 ⁇ (A) / (B) ⁇ 1.05, repeating units derived from pyromellitic acid and 4,4'-diaminodiphenyl ether Is a step of obtaining a polyamic acid dope containing 70 mol% or more.
- the A component aromatic tetracarboxylic acid is as described in the section of the aromatic polyimide film.
- Component A consists of pyromellitic anhydride alone or a combination of pyromellitic anhydride and other aromatic tetracarboxylic acids.
- the content of pyromellitic anhydride in the component A is 70 mol% or more, preferably 80 to 100 mol%, more preferably 90 to: L00 mol%.
- the aromatic diamine of component B is as described in the section of the aromatic polyimide film.
- the component B consists of 4,4′-diaminodiphenyl ether alone or a combination of 4,4′-diaminodiphenyl ether and other aromatic diamines.
- the 4,4′-diaminodiphenyl ether content in the component B is 70 mol% or more, preferably 80 to 100 mol%, more preferably 90 to 100 mol%.
- the molar ratio of component A to component B satisfies 0.995 ⁇ A component ZB component ⁇ 1.05 It is necessary to When the value of component A / component B is less than 0.95 or higher than 1.05, the reactivity of the aromatic polyamic acid polymerization reaction becomes insufficient, and it is long to obtain an aromatic polyamic acid with sufficient viscosity. It may take time, or an aromatic polyamic acid composition solution with sufficient viscosity may not be obtained.
- the value of component A and component ZB is preferably from 0.97 to L.03, more preferably from 0.99 to L01.
- the organic solvent used in the reaction is aprotic such as N-methyl-2-pyrrolidone (hereinafter sometimes referred to as NMP), N, N-dimethylacetamide, N, N-dimethylformamide, dimethylimidazolidinone, etc.
- NMP N-methyl-2-pyrrolidone
- a polar solvent is preferred.
- the order or method of addition of the A and B components there are no particular restrictions on the order or method of addition of the A and B components.
- the component B is first dissolved in an organic solvent and then polymerized by adding the component A at a desired reaction temperature.
- the component A may be added in a specified amount in one stage, or may be added in several divided portions. In particular, when it is difficult to control the reaction temperature by reaction heat, it is preferable to divide the reaction temperature into multiple times.
- the polymerization temperature is preferably ⁇ 20 to 90 ° C., more preferably ⁇ 10 to 80 t: and further preferably 0 to 70 ° C.
- the reaction time is approximately 1 to 10 hours, depending on the polymerization temperature.
- the polyamic acid obtained in step (1) comprises 70 mol% or more, preferably 80 to 100 mol%, more preferably 90 to 100 mol% of a repeating unit derived from pyromellitic acid and 4,4′-diaminodiphenyl ether. Including.
- the concentration of polyamic acid in the resulting dope is preferably 0.1 to 40% by weight, more preferably 0.5 to 30% by weight, and even more preferably 1 to 20% by weight. It is. If the polyamic acid concentration in the dope is too low, a dope with sufficient viscosity cannot be obtained for film formation. If it is too high, on the contrary, the viscosity becomes high and the film is inferior in film forming property. It is also possible to adjust the concentration of the dope that is finally obtained by diluting with organic agglomeration during and after polymerization or after completion of polymerization. Moreover, you may seal the terminal of the polyamic acid in the dope obtained.
- an agent for example, as an end-capping agent
- an acid anhydride component for example, anhydrous hydrofuric acid and its substituted product, hexahydrohydrofuranic anhydride and its substituted product, anhydrous
- succinic acid, substituted products thereof, and amine components include aniline and substituted products thereof.
- phthalic anhydride and its substitutes, and Z or aniline and its substitutes can be mentioned as particularly preferred examples.
- the addition timing of the end-capping agent is not particularly limited, and it may be added at the time of charging the raw material, during the polymerization, or at the end of the polymerization in the polymerization step.
- the addition amount may be an amount necessary for substantially stopping the polymerization and stabilizing the viscosity of the dope, and a suitable addition amount can be determined by a simple experiment.
- the reduced viscosity of the polyamic acid obtained as described above is preferably 1.5 to 30 d 1 / g, more preferably 2 to 25 dl Z g, and still more preferably 2.5 to 20 d 1 Z. g.
- the reduced viscosity is less than 1.5 d 1 Zg, the viscosity is insufficient and the moldability is poor.
- it is higher than 30 d 1 / g the viscosity is too high and the moldability is poor.
- a specific method for measuring the reduced viscosity will be described in detail in the description of Examples.
- Step (2) is a step of casting the dope obtained in step (1) on a support to obtain a cast film.
- the die can be cast on a support such as a casting drum, a metal belt, or a cast film such as polyester or polypropylene, using a die, an appliqué, or a coat.
- Step (2) is preferably performed in a low-humidity atmosphere. It is preferably carried out in an inert gas atmosphere such as nitrogen or argon or in dry air, and among these, dry air is most preferred from the viewpoint of industrial production costs. .
- Step (2) consists of adding an imidizing agent to the dope (2-i), casting the dope on a support to obtain a cast film (2-ii), and heating the cast film to prepare It preferably consists of a gelling step (2_iii).
- dehydrating agents include aliphatic acid anhydrides such as acetic anhydride It is done.
- ring closure catalyst include organic amine compounds.
- Organic amine compounds include tertiary aliphatic amines such as trimethylamine, triethylamine pyridine, triptylamamine, diisopropylethylamine, triethylenediamine, N, N-dimethylaniline, 1,8-bis.
- Pyridine derivatives such as aromatic amines such as naphthalenes, pyridine and 4- (N, N-dimethyl) aminoviridine, picoline and its derivatives.
- aromatic amines such as naphthalenes
- pyridine and 4- (N, N-dimethyl) aminoviridine are preferable.
- Pyridine and triethylenediamine are particularly preferred.
- the addition amount of the dehydrating agent is 0.1 to 15 mol, preferably 0.5 to 10 mol, and more preferably 1 to 8 mol with respect to 1 mol of the aromatic tetracarboxylic acid as a raw material.
- the addition amount of the ring-closing catalyst is 0.1 to 20 mol, preferably 0.5 to 15 mol, more preferably 1 to 10 mol, per 1 mol of the aromatic tetracarboxylic acid as a raw material.
- step (2-i) and step (2-ii) It is preferable to maintain the temperature of the cast film at 0 ° C. or lower.
- Step (2-i i) is the same as step (2) above.
- Step (2-i i i) is a step in which the cast film is heated to imidize part of the polyamic acid.
- the heating temperature may be a temperature at which the imidization reaction proceeds sufficiently.
- the heating temperature is preferably 30 to 130 ° C, more preferably 40 to 120 ° C. If the heating temperature is too low, the imidization reaction does not proceed sufficiently, and if it is 1 30 or more, side reactions tend to occur.
- the heating time is about 1 minute to 60 minutes.
- Step (3) is the step of casting the film containing 20 to 70 ° C containing an imidizing agent. This is a step of immersing in a coagulating liquid and imidizing polyamic acid to obtain a gel film.
- the imidizing agent As the imidizing agent, the same one as described in the above step (2-i) can be used. That is, the imidizing agent is preferably used in combination with a dehydrating agent and a ring closure catalyst.
- the dehydrating agent include aliphatic acid anhydrides such as acetic anhydride.
- the ring-closing catalyst include organic amine compounds such as pyridine and triethylenediamine.
- the concentration of the dehydrating agent in the coagulation liquid is preferably 1 to 70 V o 1%, more preferably 5 to 50 vol. %, More preferably 10 to 40 V o 1%.
- the concentration of the ring-closing catalyst is preferably 1 to 70 V o 1%, more preferably 5 to 50 V o 1%, still more preferably 10 to 40 vol%.
- the concentration of the dehydrating agent in the coagulation liquid is preferably 1 to 70 V o 1%, more preferably 5 to 50 V o 1%, more preferably 10 to 40 V o 1%.
- the concentration of the ring-closing catalyst is preferably 1 to 70 vol%, more preferably 5 to 50 V o 1%, more preferably 1
- the total amount of the dehydrating agent used for imidation is preferably 1 to 30 mol, more preferably 1 to 10 mol, relative to 1 mol of the aromatic tetracarboxylic acid as a raw material. More preferably, it is 4-8 mol.
- the amount of ring closure catalyst used is the same as the dehydrating agent. That is, the ring-closing catalyst is preferably 1 to 30 mol, more preferably 1 to 10 mol, and still more preferably 4 to 8 mol with respect to 1 mol of the starting aromatic tetracarboxylic acid.
- the coagulation liquid can contain an organic solvent in addition to the ring closure catalyst and the dehydrating agent.
- Organic solvents such as N-methyl-2-pyrrolidone (NMP), N, N-dimethylacetamide, N, N-dimethylformamide, and dimethylimidazolidinone, non-reactive solvents such as xylene and toluene General.
- NMP N-methyl-2-pyrrolidone
- N N-dimethylacetamide
- N-dimethylformamide N-dimethylformamide
- dimethylimidazolidinone non-reactive solvents
- non-reactive solvents such as xylene and toluene General.
- the gel swelling ability is different to adjust the coagulation property, swelling degree and drying speed.
- a solvent may be added. In this case, the amount added is approximately 30 V o 1%.
- the additive solvent is limited to those that are non-reactive with the dehydrating agent and the ring closure catalyst.
- the immersion method is not particularly limited, but it is preferable to immerse in a state where the coagulation liquid is circulated.
- the immersion time is preferably 10 seconds or more, more preferably 1 minute or more, and further preferably 3 minutes or more.
- the upper limit is not particularly limited, but is about 3 hours.
- the coagulation liquid temperature is 20 to 70, preferably 30 to 60 ° C.
- the gel film may be again immersed in an organic solvent solution containing an imidizing agent.
- the gel film is preferably immersed in a state where it is peeled off from the support.
- an organic solvent at the time of polymerization or a mixture of an organic solvent at the time of polymerization and another organic solvent is preferable.
- examples of other organic solvents include hydrocarbon solvents such as toluene and xylene, and halogen solvents such as methylene chloride and dichloroethane.
- Organic solvents used for cleaning include aprotic organic polar organic solvents such as NMP, N, N-dimethylacetamide, N, N-dimethylformamide, dimethylimidazolidinone, aromatic hydrocarbons such as toluene, isopropyl alcohol, etc. Aliphatic alcohols, benzyl alcohol, ester organic solvents, ketone organic solvents, and the like.
- the gel film obtained using a dialkyl carpositimide there are many isoimide groups in the gel film, and in order to obtain a stretch orientation effect efficiently in step (4), it is preferable to wash with toluene or the like. . In addition, it is important to wash the gel film in order to remove the dialkylurea produced by imidization.
- the gel film in the case of a gel film obtained using an aliphatic acid anhydride and an organic amine, the gel film has a relatively large number of imide groups. Is preferred.
- the gel film may be washed while the gel film remains on the support, but may be separated from the support, or may be after stretching. In addition, cleaning may be performed several times at each time.
- the gel film obtained in step (3) is a homogeneous and highly swollen film excellent in stretchability, and can be highly oriented by stretching in step (4).
- the imidization index represented by the following formula (ii) of the obtained gel film is preferably 0.6 to 1.2, more preferably 0.7 to 1.2. Imidize.
- Imidized index Ab (1379) ZAb (15 . 2) (ii) where, Ab (1379), the absorption intensity of the infrared spectrometer 1379 cm- 1 imido bond derived peak was measured using a gel film, Ab (1502) is the absorption intensity of the peak derived from the benzene ring at 1502 cm- 1 .
- the gel film may be immersed again in a coagulation liquid containing a ring closure catalyst and a dehydrating agent as described above.
- the degree of swelling of the gel film subjected to biaxial stretching is preferably 200 to 1,000,000%, more preferably 250 to 9,000%, and even more preferably 300 to 8,00%. If the degree of swelling is low, sufficient stretchability may not be obtained. On the other hand, if the degree of swelling is too high, sufficient self-supporting property may not be obtained, and it may be difficult to use in the stretching process.
- the production method of the present invention by setting the imidization index of the gel film to a predetermined value, in the next step (4), the degree of freedom in selecting the stretching magnification in the running direction and the width direction is improved. As a result, a highly oriented film with a low in-plane thermal expansion coefficient can be obtained.
- the swelling degree of the gel film is set to a predetermined value, so that in the next step (4), the stretching can be smoothly performed.
- a film having a low in-plane thermal expansion coefficient can be obtained.
- Step (4) is a step for obtaining a biaxially stretched gel film by stretching the gel film by 1 to 4 times or more in the running direction and the width direction, respectively.
- the running direction (MD) is the winding direction when the film is stretched and is also called the machine direction.
- the width direction (TD) is the direction perpendicular to the direction of travel and is also called the transverse direction.
- the draw ratio in the running direction and the width direction is 1.4 times or more, preferably 1.6 times or more, more preferably 1.9 times or more, and further preferably 2.5 times or more.
- the stretch ratio in the running direction and the width direction may be the same or different. By stretching by 1.4 times or more, an aromatic polyimide film satisfying the relationship represented by the formulas (1) and (2) can be produced. A higher draw ratio is preferable for obtaining an aromatic polyimide film satisfying the formulas (1) and (2).
- the upper limit of the draw ratio is preferably 10 times, more preferably 7 times, still more preferably 5 times, and particularly preferably 3 times.
- the stretching temperature is not particularly limited, but is preferably 10 to 100 ° C, more preferably 1 to 90, more preferably 0 to 80. Stretching may be performed using any of the sequential stretching method and the simultaneous biaxial stretching method, and may be performed in any atmosphere of a solvent, air, or an inert atmosphere. Particularly preferably, it can be mentioned as a preferable example performed in air.
- Step (5) is a step of drying and heat-treating the biaxially stretched gel film. Drying can be performed by flowing dry air over the film surface with a hot air dryer or the like. The temperature of the dry air is preferably 25 ° C. to 2700 ° C. at which the organic solvent evaporates.
- the heat treatment can be performed by hot air heating, vacuum heating, infrared heating, microwave heating, heating by contact using a hot plate or a hot roll. In this case, imidization can be advanced by raising the temperature stepwise.
- the heat treatment is preferably performed on a biaxially stretched gel film under constant length or tension.
- the heat treatment temperature is preferably 2500 to 5500 ° (:, more preferably 30000 to 500 ° C, and further preferably 3300 to 4800 ° C. Gradually in multiple stages.
- the aromatic polyimide film can be obtained while suppressing the relaxation of orientation by heat treatment, and the imidation rate is insufficient with heat treatment below 25 Q ° C. Thus, the film is inferior in thermal stability, particularly in dimensional stability. 5 Aromatic polyimide may undergo thermal degradation when processed at temperatures higher than 50 ° C.
- various additives can be blended as required within a range that does not impair the physical properties of the film.
- additives include glass fiber, metal fiber, aramid fiber, ceramic fiber, titanic acid power whisker, titanate barium whisker, carbon fiber, fibrous reinforcement such as carbon nanotubes, talc, calcium carbonate, my strength, clay, Titanium oxide, aluminum oxide, glass fine particles, glass flakes, milled fibers, metal flakes, fillers such as metal powders, thermal stabilizers or oxidation stabilizers typified by phosphates and phosphites, light Stabilizers, UV absorbers, lubricants, pigments, flame retardants, plasticizers, crystal nucleating agents, and the like.
- the addition amount is not particularly limited, but a range that does not deteriorate the physical properties, for example, 20% by weight or less, is preferable.
- conventionally known surface modification treatment such as sand blast treatment, plasma treatment, corona treatment, silane coupling material treatment, etc. has been performed as necessary. It doesn't matter.
- the reduced viscosity of polyamic acid was calculated from the results of measurement at a temperature of 0 ° C. with a polyamic acid concentration of 0.05 gZdL using a 1% by weight lithium chloride ZNP solution as a solution.
- the degree of swelling was calculated from the weight (Ww) in the swollen state and the weight (Wd) in the dry state according to the following formula (i).
- the imidation index was determined by measuring the film by multiple reflection method using a Fourier transform infrared spectrometer (Nicolet Magna 750), and the absorption intensity (Ab (1379) ) of the peak derived from the imide bond at 1379 cm- 1 (Ab (1379) ) and 1502 cm — It was calculated from the absorption intensity (Ab (1502) ) of the benzene ring-derived peak of 1 by the following formula (ii).
- the in-plane coefficient of thermal expansion (CTE) is 13 mm (L.) x 4 mm, and the TA instrument TMA2940 Thermomechanical Analyzer is used in the range of 50 to 250 ° C at a heating rate of 10 ° C / min.
- the sample length was measured between 100 ° C and 200 ° C by raising and lowering the temperature, and calculated from the following formula (iii).
- the average CTE was calculated from the average value of CT E (p pm-K- 1 ) in the MD and TD directions expressed by the following equation (iv).
- the refractive index was measured with an ATAGO multiwavelength Abbe refractometer at a wavelength of 589 nm.
- the plane orientation coefficient of the aromatic polyimide film was calculated by the following formula (V).
- the film was cut into 16 cm squares, and the average value was obtained by measuring 9 locations evenly.
- the measuring instrument used was L I TEMAT I C VL-50 (manufactured by Mitutoyo Corporation). ,
- the obtained film was cast onto a PET film as a support to a thickness of 500 using a doctor blade to obtain a cast film.
- the cast film was imidized together with PET film by immersion in a 30 ° C dehydration coagulation bath consisting of 1,050 ml of acetic anhydride, 450 ml of pyridine and DMAc 1, 50 Om 1 for 8 minutes. Thereafter, the film was peeled off from the PET film, and immersed in DMAc at room temperature for 20 minutes for washing to obtain a gel film.
- the resulting gel film had an imidized index of 0.8 and a degree of swelling of 350%.
- both ends of the gel film were grasped and simultaneously biaxially stretched at a speed of 2.48 times and 1 OmmZ seconds in the running direction (MD) and width direction (TD), respectively, at room temperature.
- the stretched gel film was fixed to a frame, and dried by flowing hot air at 260 ° C for 20 minutes in a hot air dryer. Then, the temperature was raised in a multistage manner from 300 to 450 ° C. over 10 minutes using a hot air circulating oven to obtain a film.
- the elastic modulus (M i), tensile strength, elongation at break, in-plane thermal expansion coefficient (CTE), average surface thermal expansion coefficient (average CTE), plane orientation coefficient, refractive index (n) of the obtained film are shown. Shown in 1. Average CTE is 19.4 p pm. K— 1 and the relationship between elastic modulus M i (GP a) and CTE (p pm-K " 1 ) is expressed by the following equations (1) and (2)
- the dope contained polyamic acid as a solute and DM Ac as an organic solvent, and the concentration of the polyamic acid was 18% by weight.
- the polyamic acid was composed of repeating units derived from 4,4'-diphenyldiamino ether and pyromellitic acid.
- a pyridine-added dope is fed through a pipe cooled to a temperature of 10 ° C at a temperature of 23.3 t m 1 Z with a gear pump, and installed in the middle of the pipe between the reaction vessel and the T-die.
- the reaction vessel side of the 48-stage ⁇ 6.5 mixer mixer was set to 0 stages and the T-die side was set to 48 stages.
- a dope at a temperature of 1 o ° c via a static mixer was cast on a PET film from a T-die with a lip opening of 400 im and a width of 32 Omm in a casting bath in a nitrogen atmosphere at 50 ° C. To obtain a gel film preliminarily formed by heating.
- the gel film was introduced into the dehydration coagulation bath together with the PET film in 0.2 minutes for imidization.
- the coagulation solution was prepared by mixing 1,050 m of acetic anhydride, 450 ml of pyridine, and 1,500 ml of DMAc. The temperature of the coagulation liquid was set to 60 ° C.
- the imidized gel film was dried with dry nitrogen having a moisture concentration of 40 ppm for 10 minutes. Dry nitrogen was allowed to flow in parallel to the gel film surface from the blow port located 7.5 cm away from the gel film surface toward the exhaust port on the opposite side of the blow port. Dry nitrogen was flowed at an average flow rate of 20 cmZ and the product of average flow rate and blowing distance was 150 cm 2 Zsec. Thereafter, the gel film was washed with a DMAc solution. The imidation index of the gel film was 0.82, and the degree of swelling was 268%.
- both ends of the gel film were fixed to a chuck and simultaneously biaxially stretched at a speed of 1 Omm / sec, 1.8 times in the running direction and 2.2 times in the width direction.
- the stretched gel film was fixed to a frame, and dried by flowing hot air at 260 ° C for 20 minutes in a hot air dryer. Next, the temperature was increased in a multistage manner from 300 to 450 ° C. using a forced air circulation oven over 10 minutes to obtain a film.
- Table 1 shows the elastic modulus (M i), tensile strength, elongation at break, in-plane thermal expansion coefficient (CTE), average in-plane thermal expansion coefficient (average CTE plane orientation coefficient, refractive index (n) of the obtained film. Shown in
- the average CTE is 20.3 ppm 'K— 1 and is the CTE in both the running direction and the width direction.
- M i and n are the following formulas (1) to (4)
- a film was obtained in the same manner as in Example 2 except that the draw ratio was 2.0 times in the running direction and 2.4 times in the width direction.
- the gel film before stretching had an imidization index of 0.82, and a swelling degree of 268%.
- the elastic modulus (M i), tensile strength, elongation at break, in-plane thermal expansion coefficient (CTE), average in-plane thermal expansion coefficient (average CTE), plane orientation coefficient, and refractive index (n) of the obtained film are shown. Shown in 1.
- the average CTE was 20. ⁇ ⁇ ' ⁇ 1 , and it was confirmed that CTE, M i, and n satisfy the equations (1) to (4) in both the running direction and width direction.
- the PET film conveyance speed was 0.3 m
- the gelation time was 6.7 minutes (the gel film had an imidization index of 0.71 and a swelling degree of 271%), and the draw ratio was run.
- a film was obtained in the same manner as in Example 2 except that the direction was 1.7 times and the width direction was 2.1 times.
- the elastic modulus (M i) tensile strength, elongation at break, in-plane thermal expansion coefficient (CTE), average in-plane thermal expansion coefficient (average CTE), surface orientation coefficient, refractive index (n) of the obtained film Table 1 shows.
- the average CTE was 13.3 ppm * K 1, and it was confirmed that CTE, Mi, and n satisfy the equations (1) to (4) in both the running direction and width direction.
- a film was obtained in the same manner as in Example 1 except that the draw ratio was 1.39 times in the running direction and 1.61 times in the width direction.
- the gel film before stretching had an imidization index of 0.82 and a swelling degree of 268%.
- the resulting film's inertia (M i), tensile strength, elongation at break, in-plane thermal expansion coefficient Table 1 shows (CTE), average in-plane thermal expansion coefficient (average CTE), plane orientation coefficient, and refractive index (n).
- the average CTE was 3 1 p pm ⁇ K– 1 , and CT E, M i and n did not satisfy Eqs. (1) to (4) in both the running and width directions.
- the film of the present invention is excellent in flexibility, has a small in-plane thermal expansion coefficient, and is excellent in dimensional stability.
- the film of the present invention is excellent in stability against temperature change.
- the film of the present invention has a thermal expansion coefficient comparable to that of copper, and has an advantage that warpage due to temperature change is unlikely to occur even when used in combination with copper foil.
- the film of the present invention is a support for an electrical wiring board in which a copper foil is laminated, for example, a flexible It can be used as a sibling circuit board, TAB (tape automated bonding) tape support, LOC (lead-on-chip) tape support.
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- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CA002603131A CA2603131A1 (en) | 2005-03-28 | 2006-03-27 | Aromatic polyimide film and process for the production thereof |
EP06730931A EP1867675A4 (en) | 2005-03-28 | 2006-03-27 | AROMATIC POLYIMIDE FILM AND PROCESS FOR PRODUCING THE SAME |
US11/887,510 US20100285292A1 (en) | 2005-03-28 | 2006-03-27 | Aromatic Polyimide Film and Process for the Production Thereof |
JP2007510578A JPWO2006104228A1 (ja) | 2005-03-28 | 2006-03-27 | 芳香族ポリイミドフィルムおよびその製造方法 |
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JP2005-091924 | 2005-03-28 | ||
JP2005091924 | 2005-03-28 | ||
JP2005-170857 | 2005-06-10 | ||
JP2005170857 | 2005-06-10 |
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PCT/JP2006/306983 WO2006104228A1 (ja) | 2005-03-28 | 2006-03-27 | 芳香族ポリイミドフィルムおよびその製造方法 |
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EP (1) | EP1867675A4 (ja) |
JP (1) | JPWO2006104228A1 (ja) |
KR (1) | KR20070114280A (ja) |
CA (1) | CA2603131A1 (ja) |
WO (1) | WO2006104228A1 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101842219A (zh) * | 2007-11-08 | 2010-09-22 | 尤尼吉可株式会社 | 聚酰胺系树脂膜的制造方法及由该方法得到的聚酰胺系树脂膜 |
JP2011243271A (ja) * | 2010-04-19 | 2011-12-01 | Dainippon Printing Co Ltd | 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ |
JP2014139331A (ja) * | 2014-05-07 | 2014-07-31 | Du Pont-Toray Co Ltd | ポリイミドフィルム |
CN115175816A (zh) * | 2020-03-23 | 2022-10-11 | 东洋纺株式会社 | 层叠体 |
WO2024053691A1 (ja) * | 2022-09-09 | 2024-03-14 | 東レ株式会社 | 多孔質膜及び複合膜 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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EP2022815B1 (en) * | 2006-05-19 | 2011-07-13 | Ube Industries, Ltd. | Method for producing polyimide film and polyamic acid solution composition |
JP5754692B2 (ja) * | 2012-03-13 | 2015-07-29 | 東レ・デュポン株式会社 | ポリイミドフィルムの製造方法 |
CN107406674A (zh) * | 2015-03-04 | 2017-11-28 | 日产化学工业株式会社 | 剥离层形成用组合物 |
KR102580684B1 (ko) | 2021-06-24 | 2023-09-19 | 전주대학교 산학협력단 | 폴리이미드 공중합체 및 이를 이용한 폴리이미드 필름 |
KR102596071B1 (ko) | 2022-01-20 | 2023-10-30 | 동우 화인켐 주식회사 | 폴리이미드 전구체 조성물, 이로부터 형성된 폴리이미드 필름, 및 이를 이용한 반도체 소자의 제조 방법 |
KR20240044188A (ko) | 2022-09-28 | 2024-04-04 | 에스케이이노베이션 주식회사 | 폴리이미드, 폴리이미드의 제조 방법 및 폴리이미드 단량체의 선정 방법 |
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- 2006-03-27 CA CA002603131A patent/CA2603131A1/en not_active Abandoned
- 2006-03-27 JP JP2007510578A patent/JPWO2006104228A1/ja active Pending
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JP2011243271A (ja) * | 2010-04-19 | 2011-12-01 | Dainippon Printing Co Ltd | 回路基板、サスペンション用基板、サスペンション、素子付サスペンションおよびハードディスクドライブ |
JP2014139331A (ja) * | 2014-05-07 | 2014-07-31 | Du Pont-Toray Co Ltd | ポリイミドフィルム |
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WO2024053691A1 (ja) * | 2022-09-09 | 2024-03-14 | 東レ株式会社 | 多孔質膜及び複合膜 |
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EP1867675A4 (en) | 2010-06-09 |
EP1867675A1 (en) | 2007-12-19 |
CA2603131A1 (en) | 2006-10-05 |
JPWO2006104228A1 (ja) | 2008-09-11 |
KR20070114280A (ko) | 2007-11-30 |
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