TWI258485B - High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto - Google Patents

High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto Download PDF

Info

Publication number
TWI258485B
TWI258485B TW92125087A TW92125087A TWI258485B TW I258485 B TWI258485 B TW I258485B TW 92125087 A TW92125087 A TW 92125087A TW 92125087 A TW92125087 A TW 92125087A TW I258485 B TWI258485 B TW I258485B
Authority
TW
Taiwan
Prior art keywords
substrate
crankshaft
aromatic
layer
dianhydride
Prior art date
Application number
TW92125087A
Other languages
English (en)
Chinese (zh)
Other versions
TW200416242A (en
Inventor
John Donald Summers
Richard Frederich Sutton Jr
Brian Carl Auman
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200416242A publication Critical patent/TW200416242A/zh
Application granted granted Critical
Publication of TWI258485B publication Critical patent/TWI258485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW92125087A 2002-09-20 2003-09-10 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto TWI258485B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/251,134 US6956098B2 (en) 2002-09-20 2002-09-20 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

Publications (2)

Publication Number Publication Date
TW200416242A TW200416242A (en) 2004-09-01
TWI258485B true TWI258485B (en) 2006-07-21

Family

ID=31946459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92125087A TWI258485B (en) 2002-09-20 2003-09-10 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

Country Status (5)

Country Link
US (1) US6956098B2 (enExample)
EP (1) EP1400552B1 (enExample)
JP (1) JP2004115799A (enExample)
DE (1) DE60324998D1 (enExample)
TW (1) TWI258485B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
US20060292383A1 (en) * 2003-11-26 2006-12-28 Shuichi Kohayashi Metal-coated substrate and manufacturing method of the same
JP2005195690A (ja) * 2003-12-26 2005-07-21 Toshiba Corp 金属含有樹脂粒子、樹脂粒子、及び電子回路の製造方法
CN100365158C (zh) * 2004-08-17 2008-01-30 同济大学 超薄自支撑聚酰亚胺滤光薄膜的物理气相沉积制备方法
US20090011231A1 (en) * 2004-10-05 2009-01-08 Hisayasu Kaneshiro Adhesive Sheet and Copper-Clad Laminate
JP4548828B2 (ja) * 2004-10-29 2010-09-22 Ｄｏｗａホールディングス株式会社 金属被覆基板の製造方法
CA2603131A1 (en) * 2005-03-28 2006-10-05 Teijin Limited Aromatic polyimide film and process for the production thereof
JP2006278664A (ja) * 2005-03-29 2006-10-12 Toyobo Co Ltd 薄膜コンデンサ用誘電体積層フィルムおよびその製法
KR100786185B1 (ko) 2005-12-07 2007-12-21 마이크로코즘 테크놀리지 씨오.,엘티디 폴리아믹산 조성물 및 이를 이용하여 제조된 적층체
JP2010512449A (ja) * 2006-12-12 2010-04-22 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 結晶性封入剤
US8309627B2 (en) 2007-09-07 2012-11-13 Nexolve Corporation Polymeric coating for the protection of objects
JP2009120796A (ja) * 2007-10-22 2009-06-04 Hitachi Chem Co Ltd 耐熱性ポリイミド樹脂及びこれを用いたシームレス管状体、塗膜、塗膜板及び耐熱性塗料
CN102112293B (zh) * 2008-06-02 2014-12-03 宇部兴产株式会社 宽度方向的线性膨胀系数比传送方向的线性膨胀系数小的芳族聚酰亚胺薄膜的制备方法
KR101142723B1 (ko) * 2009-07-31 2012-05-04 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
US9877673B2 (en) * 2010-12-10 2018-01-30 Clinitech, Llc Transdermal sampling and analysis device
KR102214856B1 (ko) * 2012-12-21 2021-02-09 에이치디 마이크로시스템즈 가부시키가이샤 폴리이미드 전구체, 그 폴리이미드 전구체를 포함하는 감광성 수지 조성물, 그것을 사용한 패턴 경화막의 제조 방법 및 반도체 장치
US10898116B2 (en) 2013-03-15 2021-01-26 Cambridge Medical Technologies LLC Methods of manufacture to optimize performance of transdermal sampling and analysis device
JP6517146B2 (ja) * 2013-11-01 2019-05-22 東レ・デュポン株式会社 グラファイト積層体
CN105015099B (zh) * 2014-04-30 2017-06-06 台虹科技股份有限公司 聚酰亚胺/金属复合积层板及其制备方法
US9694569B2 (en) 2014-06-24 2017-07-04 Taiflex Scientific Co., Ltd. Polyimide metal laminated plate and method of making the same
WO2017136242A1 (en) * 2016-02-02 2017-08-10 Georgia Tech Research Corporation Inkjet printed flexible van alta array sensor
US11193031B2 (en) 2017-05-15 2021-12-07 Alpha Assembly Solutions Inc. Dielectric ink composition
US11633129B2 (en) 2019-04-05 2023-04-25 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating redox cofactors
TW202513670A (zh) * 2019-06-14 2025-04-01 美商杜邦電子股份有限公司 聚合物膜及電子裝置
US11375931B2 (en) 2019-08-08 2022-07-05 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating an electrochemical bioassay
KR102396418B1 (ko) * 2019-11-29 2022-05-12 피아이첨단소재 주식회사 폴리이미드 필름, 이의 제조 방법, 및 이를 포함한 연성 금속박 적층판
CN119081110A (zh) * 2024-05-22 2024-12-06 哈尔滨理工大学 一种高温耐电晕聚酰亚胺基复合电介质及其制备方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451971A (en) * 1982-08-02 1984-06-05 Fairchild Camera And Instrument Corporation Lift-off wafer processing
JPS6012744A (ja) 1983-07-01 1985-01-23 Hitachi Ltd 半導体装置
JPS61111359A (ja) 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JPS61158025A (ja) 1984-12-28 1986-07-17 Canon Inc 磁気記録媒体
JPH0768347B2 (ja) 1985-09-25 1995-07-26 株式会社日立製作所 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法
JPH0745580B2 (ja) 1986-05-16 1995-05-17 宇部興産株式会社 芳香族ポリイミドフィルム
JP2847701B2 (ja) 1986-11-29 1999-01-20 鐘淵化学工業株式会社 熱的寸法安定性にすぐれたポリアミド酸及びそれからなるポリイミドの製造方法
JPH0762082B2 (ja) 1988-07-29 1995-07-05 宇部興産株式会社 記録媒体用ポリイミドフィルム及びその製法
JP2626827B2 (ja) 1990-03-15 1997-07-02 宇部興産株式会社 ポリイミド延伸成形体及びその製造法
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5272247A (en) * 1990-10-19 1993-12-21 Hitachi, Ltd. Polyimide precursor, cured product thereof, and processes for producing them
JP2676650B2 (ja) 1990-11-02 1997-11-17 宇部興産株式会社 研磨シートおよびその製法
US5196500A (en) 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
US5219977A (en) * 1990-12-17 1993-06-15 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing oxydipthalic dianhydride
US5260408A (en) * 1991-10-29 1993-11-09 E. I. Du Pont De Nemours And Company Low thermal expansion coefficient polyimides with improved elongation
US5460890A (en) * 1991-10-30 1995-10-24 E. I. Du Pont De Nemours And Company Biaxially stretched isotropic polyimide film having specific properties
US5356656A (en) 1993-03-26 1994-10-18 Industrial Technology Research Institute Method for manufacturing flexible amorphous silicon solar cell
KR0146671B1 (ko) 1994-02-25 1998-08-17 김충환 사이클로스포린-함유 분말 조성물
JP2722333B2 (ja) 1995-03-27 1998-03-04 宇部興産株式会社 粗面化ポリイミドフィルムの製造法
US5958600A (en) 1995-07-10 1999-09-28 Hitachi, Ltd. Circuit board and method of manufacturing the same
US5731088A (en) 1996-06-04 1998-03-24 E. I. Du Pont De Nemours And Company Multilayer polyimide-fluoropolymer insulation having superior cut-through resistance
US5952448A (en) 1996-12-31 1999-09-14 Korea Research Institute Of Chemical Technology Stable precursor of polyimide and a process for preparing the same
JP2982745B2 (ja) 1997-06-02 1999-11-29 宇部興産株式会社 ポリイミドフィルム
US6201945B1 (en) 1998-01-08 2001-03-13 Xerox Corporation Polyimide and doped metal oxide fuser components
KR100572646B1 (ko) * 1998-07-17 2006-04-24 제이에스알 가부시끼가이샤 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액
US6653433B2 (en) * 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad
US6596968B2 (en) 2000-08-28 2003-07-22 Ube Industries, Ltd. Method of producing through-hole in aromatic polyimide film
US6476177B2 (en) * 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6469126B1 (en) * 2000-12-21 2002-10-22 E. I. Du Pont De Nmeours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476182B1 (en) * 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes

Also Published As

Publication number Publication date
DE60324998D1 (de) 2009-01-15
TW200416242A (en) 2004-09-01
US20040058172A1 (en) 2004-03-25
US6956098B2 (en) 2005-10-18
EP1400552B1 (en) 2008-12-03
JP2004115799A (ja) 2004-04-15
EP1400552A1 (en) 2004-03-24

Similar Documents

Publication Publication Date Title
TW200416242A (en) High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US4792476A (en) Low thermal expansion resin material and composite shaped article
JP3003992B2 (ja) ブロック成分を有するテトラポリイミドフィルムの製造方法およびそれによって製造されたテトラポリイミドフィルムを基材として用いたテープ自動化接合用テープ
TW201906896A (zh) 可固化聚醯亞胺
TWI871330B (zh) 聚合物膜及電子裝置
JPS6160725A (ja) 電子装置用多層配線基板の製法
TWI302424B (en) Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
TW201006868A (en) Linear precursor of polyimide, linear polyimide and thermal cured material thereof, and processes for producing them
TWI243186B (en) Polyimide film, manufacturing method of same, and usage of same
JP4426774B2 (ja) 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
JP4691555B2 (ja) 反応性モノマー、及びそれを含む樹脂組成物
US20020022310A1 (en) Epoxy-polyimide composites suitable as encapsulants
JP4999318B2 (ja) ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
TW576846B (en) Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
TW200400217A (en) Novel polyimide copolymer
US6252033B1 (en) Method for the preparation of polyamic acid and polymide useful for adhesives
KR20080070924A (ko) 가교화된 폴리이미드 필름 및 이의 제조방법
CN115505124A (zh) 聚合物及其应用
JPS61287736A (ja) ポリイミド−金属箔複合フイルム
JP2603928B2 (ja) 新規なポリアミド酸組成物
JPH0555716A (ja) フレキシブル配線基板の製造方法
JP6765093B2 (ja) ポリイミド
JPH04298093A (ja) 保護塗膜被覆配線部材及びその製法
TW508360B (en) Method for the preparation of polyamic acid and polyimide useful for adhesives
Ishii et al. Ultra-low-modulus Positive-type Photosensitive Polyimides (4). Improvement of Adhesion Strength with Copper Foil

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees