TWI258485B - High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto - Google Patents

High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto Download PDF

Info

Publication number
TWI258485B
TWI258485B TW92125087A TW92125087A TWI258485B TW I258485 B TWI258485 B TW I258485B TW 92125087 A TW92125087 A TW 92125087A TW 92125087 A TW92125087 A TW 92125087A TW I258485 B TWI258485 B TW I258485B
Authority
TW
Taiwan
Prior art keywords
substrate
crankshaft
aromatic
layer
dianhydride
Prior art date
Application number
TW92125087A
Other languages
English (en)
Chinese (zh)
Other versions
TW200416242A (en
Inventor
John Donald Summers
Richard Frederich Sutton Jr
Brian Carl Auman
Original Assignee
Du Pont
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Du Pont filed Critical Du Pont
Publication of TW200416242A publication Critical patent/TW200416242A/zh
Application granted granted Critical
Publication of TWI258485B publication Critical patent/TWI258485B/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31721—Of polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
TW92125087A 2002-09-20 2003-09-10 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto TWI258485B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/251,134 US6956098B2 (en) 2002-09-20 2002-09-20 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

Publications (2)

Publication Number Publication Date
TW200416242A TW200416242A (en) 2004-09-01
TWI258485B true TWI258485B (en) 2006-07-21

Family

ID=31946459

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92125087A TWI258485B (en) 2002-09-20 2003-09-10 High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto

Country Status (5)

Country Link
US (1) US6956098B2 (enExample)
EP (1) EP1400552B1 (enExample)
JP (1) JP2004115799A (enExample)
DE (1) DE60324998D1 (enExample)
TW (1) TWI258485B (enExample)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7026436B2 (en) * 2002-11-26 2006-04-11 E.I. Du Pont De Nemours And Company Low temperature polyimide adhesive compositions and methods relating thereto
WO2005051652A1 (ja) * 2003-11-26 2005-06-09 Dowa Mining Co., Ltd. 金属被覆基板及びその製造方法
JP2005195690A (ja) * 2003-12-26 2005-07-21 Toshiba Corp 金属含有樹脂粒子、樹脂粒子、及び電子回路の製造方法
CN100365158C (zh) * 2004-08-17 2008-01-30 同济大学 超薄自支撑聚酰亚胺滤光薄膜的物理气相沉积制备方法
CN101035875B (zh) 2004-10-05 2011-04-06 株式会社钟化 粘接片材及覆铜层压板
JP4548828B2 (ja) * 2004-10-29 2010-09-22 Ｄｏｗａホールディングス株式会社 金属被覆基板の製造方法
CA2603131A1 (en) * 2005-03-28 2006-10-05 Teijin Limited Aromatic polyimide film and process for the production thereof
JP2006278664A (ja) * 2005-03-29 2006-10-12 Toyobo Co Ltd 薄膜コンデンサ用誘電体積層フィルムおよびその製法
KR100786185B1 (ko) 2005-12-07 2007-12-21 마이크로코즘 테크놀리지 씨오.,엘티디 폴리아믹산 조성물 및 이를 이용하여 제조된 적층체
EP2102268A2 (en) * 2006-12-12 2009-09-23 E.I. Du Pont De Nemours And Company Crystalline encapsulants
US8309627B2 (en) 2007-09-07 2012-11-13 Nexolve Corporation Polymeric coating for the protection of objects
JP2009120796A (ja) * 2007-10-22 2009-06-04 Hitachi Chem Co Ltd 耐熱性ポリイミド樹脂及びこれを用いたシームレス管状体、塗膜、塗膜板及び耐熱性塗料
US20110084419A1 (en) * 2008-06-02 2011-04-14 Ube Industries, Ltd. Method for producing aromatic polyimide film wherein linear expansion coefficient in transverse direction is lower than linear expansion coefficient in machine direction
KR101142723B1 (ko) * 2009-07-31 2012-05-04 에스케이씨코오롱피아이 주식회사 폴리이미드 필름
US9877673B2 (en) * 2010-12-10 2018-01-30 Clinitech, Llc Transdermal sampling and analysis device
US9751984B2 (en) * 2012-12-21 2017-09-05 Hitachi Chemical Dupont Microsystems, Ltd. Polyimide precursor, photosensitive resin composition containing said polyimide precursor, and cured-pattern-film manufacturing method and semiconductor device using said photosensitive resin composition
US10898116B2 (en) 2013-03-15 2021-01-26 Cambridge Medical Technologies LLC Methods of manufacture to optimize performance of transdermal sampling and analysis device
CN105705334B (zh) * 2013-11-01 2018-03-20 杜邦-东丽株式会社 石墨层压体
CN105015099B (zh) * 2014-04-30 2017-06-06 台虹科技股份有限公司 聚酰亚胺/金属复合积层板及其制备方法
US9694569B2 (en) 2014-06-24 2017-07-04 Taiflex Scientific Co., Ltd. Polyimide metal laminated plate and method of making the same
WO2017136242A1 (en) * 2016-02-02 2017-08-10 Georgia Tech Research Corporation Inkjet printed flexible van alta array sensor
WO2018213161A1 (en) 2017-05-15 2018-11-22 Alpha Assembly Solutions Inc. Dielectric ink composition
US11633129B2 (en) 2019-04-05 2023-04-25 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating redox cofactors
TWI871330B (zh) * 2019-06-14 2025-02-01 美商杜邦電子股份有限公司 聚合物膜及電子裝置
US11375931B2 (en) 2019-08-08 2022-07-05 Cambridge Medical Technologies LLC Non-invasive transdermal sampling and analysis device incorporating an electrochemical bioassay
KR102396418B1 (ko) * 2019-11-29 2022-05-12 피아이첨단소재 주식회사 폴리이미드 필름, 이의 제조 방법, 및 이를 포함한 연성 금속박 적층판
CN119081110A (zh) * 2024-05-22 2024-12-06 哈尔滨理工大学 一种高温耐电晕聚酰亚胺基复合电介质及其制备方法

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4451971A (en) * 1982-08-02 1984-06-05 Fairchild Camera And Instrument Corporation Lift-off wafer processing
JPS6012744A (ja) 1983-07-01 1985-01-23 Hitachi Ltd 半導体装置
JPS61111359A (ja) * 1984-11-06 1986-05-29 Ube Ind Ltd ポリイミド膜
JPS61158025A (ja) * 1984-12-28 1986-07-17 Canon Inc 磁気記録媒体
JPH0768347B2 (ja) 1985-09-25 1995-07-26 株式会社日立製作所 有機ケイ素末端ポリイミド前駆体とポリイミドの製造方法
JPH0745580B2 (ja) * 1986-05-16 1995-05-17 宇部興産株式会社 芳香族ポリイミドフィルム
EP0276405B1 (en) 1986-11-29 1994-03-09 Kanegafuchi Chemical Industry Co., Ltd. Polyimide having a thermal dimensional stability
JPH0762082B2 (ja) 1988-07-29 1995-07-05 宇部興産株式会社 記録媒体用ポリイミドフィルム及びその製法
JP2626827B2 (ja) 1990-03-15 1997-07-02 宇部興産株式会社 ポリイミド延伸成形体及びその製造法
US5166308A (en) * 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
US5272247A (en) * 1990-10-19 1993-12-21 Hitachi, Ltd. Polyimide precursor, cured product thereof, and processes for producing them
JP2676650B2 (ja) 1990-11-02 1997-11-17 宇部興産株式会社 研磨シートおよびその製法
US5219977A (en) * 1990-12-17 1993-06-15 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing oxydipthalic dianhydride
US5196500A (en) * 1990-12-17 1993-03-23 E. I. Du Pont De Nemours And Company Tetrapolyimide film containing benzophenone tetracarboxylic dianhydride
US5260408A (en) * 1991-10-29 1993-11-09 E. I. Du Pont De Nemours And Company Low thermal expansion coefficient polyimides with improved elongation
US5460890A (en) * 1991-10-30 1995-10-24 E. I. Du Pont De Nemours And Company Biaxially stretched isotropic polyimide film having specific properties
US5356656A (en) * 1993-03-26 1994-10-18 Industrial Technology Research Institute Method for manufacturing flexible amorphous silicon solar cell
KR0146671B1 (ko) * 1994-02-25 1998-08-17 김충환 사이클로스포린-함유 분말 조성물
JP2722333B2 (ja) 1995-03-27 1998-03-04 宇部興産株式会社 粗面化ポリイミドフィルムの製造法
WO1997003542A1 (en) * 1995-07-10 1997-01-30 Hitachi, Ltd. Circuit board and method of manufacturing the same
US5731088A (en) 1996-06-04 1998-03-24 E. I. Du Pont De Nemours And Company Multilayer polyimide-fluoropolymer insulation having superior cut-through resistance
US5952448A (en) * 1996-12-31 1999-09-14 Korea Research Institute Of Chemical Technology Stable precursor of polyimide and a process for preparing the same
JP2982745B2 (ja) 1997-06-02 1999-11-29 宇部興産株式会社 ポリイミドフィルム
US6201945B1 (en) * 1998-01-08 2001-03-13 Xerox Corporation Polyimide and doped metal oxide fuser components
KR100572646B1 (ko) * 1998-07-17 2006-04-24 제이에스알 가부시끼가이샤 폴리이미드계 복합체 및 이 복합체를 사용한 전자 부품, 및 폴리이미드계 수성 분산액
US6653433B2 (en) * 1999-11-24 2003-11-25 E. I. Du Pont De Nemours And Company Polyimide composition having improved peel strength when clad
TW574261B (en) * 2000-08-28 2004-02-01 Ube Industries Method of producing through-hole in aromatic polyimide film
US6469126B1 (en) * 2000-12-21 2002-10-22 E. I. Du Pont De Nmeours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476177B2 (en) * 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes
US6476182B1 (en) * 2000-12-21 2002-11-05 E. I. Du Pont De Nemours And Company Melt-processible, thermoplastic random copolyimides having recoverable crystallinity and associated processes

Also Published As

Publication number Publication date
US20040058172A1 (en) 2004-03-25
JP2004115799A (ja) 2004-04-15
EP1400552A1 (en) 2004-03-24
TW200416242A (en) 2004-09-01
DE60324998D1 (de) 2009-01-15
US6956098B2 (en) 2005-10-18
EP1400552B1 (en) 2008-12-03

Similar Documents

Publication Publication Date Title
TWI258485B (en) High modulus polyimide compositions useful as dielectric substrates for electronics applications, and methods relating thereto
US4690999A (en) Low thermal expansion resin material and composite shaped article
US6320019B1 (en) Method for the preparation of polyamic acid and polyimide
JP3003992B2 (ja) ブロック成分を有するテトラポリイミドフィルムの製造方法およびそれによって製造されたテトラポリイミドフィルムを基材として用いたテープ自動化接合用テープ
TWI871330B (zh) 聚合物膜及電子裝置
US20120088109A1 (en) Linear polyimide precursor, linear polyimide and heat-cured product thereof, and method for producing them
JPS6160725A (ja) 電子装置用多層配線基板の製法
TW200412213A (en) Polyimide substrates having enhanced flatness, isotropy and thermal dimensional stability, and methods and compositions relating thereto
Dunson Synthesis and characterization of thermosetting polyimide oligomers for microelectronics packaging
JP4426774B2 (ja) 熱硬化性樹脂組成物、及びそれを用いてなる積層体、回路基板
JP4691555B2 (ja) 反応性モノマー、及びそれを含む樹脂組成物
TWI243186B (en) Polyimide film, manufacturing method of same, and usage of same
US20020022310A1 (en) Epoxy-polyimide composites suitable as encapsulants
JP4999318B2 (ja) ビスイミド又はビスイソイミド化合物及びそれを含む樹脂組成物
TW576846B (en) Polyimide film, method of manufacture, and metal interconnect board with polyimide film substrate
TW200400217A (en) Novel polyimide copolymer
US6252033B1 (en) Method for the preparation of polyamic acid and polymide useful for adhesives
KR20080070924A (ko) 가교화된 폴리이미드 필름 및 이의 제조방법
CN115505124A (zh) 聚合物及其应用
JPS61287736A (ja) ポリイミド−金属箔複合フイルム
JP2603928B2 (ja) 新規なポリアミド酸組成物
JP6765093B2 (ja) ポリイミド
JPH04298093A (ja) 保護塗膜被覆配線部材及びその製法
TW508360B (en) Method for the preparation of polyamic acid and polyimide useful for adhesives
TW200909520A (en) Polyamic acid resin composition, cured film produced using the resin composition, and semiconductor device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees