JP2004043814A5 - - Google Patents
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- JP2004043814A5 JP2004043814A5 JP2003272095A JP2003272095A JP2004043814A5 JP 2004043814 A5 JP2004043814 A5 JP 2004043814A5 JP 2003272095 A JP2003272095 A JP 2003272095A JP 2003272095 A JP2003272095 A JP 2003272095A JP 2004043814 A5 JP2004043814 A5 JP 2004043814A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- component
- groups
- alkenyl
- chain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000003342 alkenyl group Chemical group 0.000 description 4
- -1 3-chloropropyl group Chemical group 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004218 chloromethyl group Chemical group [H]C([H])(Cl)* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001183 hydrocarbyl group Chemical group 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003272095A JP2004043814A (ja) | 2002-07-15 | 2003-07-08 | シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002205869 | 2002-07-15 | ||
| JP2003272095A JP2004043814A (ja) | 2002-07-15 | 2003-07-08 | シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004043814A JP2004043814A (ja) | 2004-02-12 |
| JP2004043814A5 true JP2004043814A5 (https=) | 2006-08-10 |
Family
ID=30112779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003272095A Pending JP2004043814A (ja) | 2002-07-15 | 2003-07-08 | シリコーン系接着性シート、半導体チップと該チップ取付部の接着方法、および半導体装置 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US7534659B2 (https=) |
| EP (1) | EP1539898A1 (https=) |
| JP (1) | JP2004043814A (https=) |
| KR (1) | KR20050021485A (https=) |
| CN (1) | CN1276046C (https=) |
| AU (1) | AU2003249594A1 (https=) |
| TW (1) | TWI293191B (https=) |
| WO (1) | WO2004007628A1 (https=) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4536367B2 (ja) * | 2003-12-24 | 2010-09-01 | 東レ・ダウコーニング株式会社 | ダイシングダイボンディング用シート及びその製造方法 |
| JP2006005159A (ja) * | 2004-06-17 | 2006-01-05 | Shin Etsu Chem Co Ltd | ダイシング・ダイボンド用接着テープ |
| JP4676735B2 (ja) | 2004-09-22 | 2011-04-27 | 東レ・ダウコーニング株式会社 | 光半導体装置の製造方法および光半導体装置 |
| JP4664032B2 (ja) | 2004-10-13 | 2011-04-06 | 東レ・ダウコーニング株式会社 | シリルアルコキシメチルハライドの製造方法 |
| JP4849814B2 (ja) | 2005-03-29 | 2012-01-11 | 東レ・ダウコーニング株式会社 | ホットメルト型シリコーン系接着剤 |
| JP4828146B2 (ja) | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP4828145B2 (ja) | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP5004433B2 (ja) | 2005-04-27 | 2012-08-22 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| JP4931366B2 (ja) | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| TWI409309B (zh) * | 2005-10-04 | 2013-09-21 | Dow Corning Taiwan Inc | 供織物塗佈之液體聚矽氧橡膠組合物 |
| DE102006009394B4 (de) * | 2006-03-01 | 2025-07-31 | Nissan Chemical Industries, Ltd. | Mehrlagenschichtsystem mit einer Schicht als Trennschicht zum Trägern von dünnen Wafern bei der Halbleiterherstellung, Verwendung des Schichtsystems beim und Verfahren zum Abdünnen eines Wafers |
| US8911583B2 (en) | 2006-03-01 | 2014-12-16 | Thin Materials Ag | Method for processing, in particular, thin rear sides of a wafer, wafer-carrier arrangement and method for producing said type of wafer-carrier arrangement |
| JP5285846B2 (ja) | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| WO2008056810A1 (en) * | 2006-11-08 | 2008-05-15 | Dow Corning Toray Co., Ltd. | Three-dimentional molded article, manufacturing method thereof and use thereof |
| JP5284143B2 (ja) * | 2009-03-02 | 2013-09-11 | 本田技研工業株式会社 | 燃料電池用接着剤及びこれを用いた膜電極構造体 |
| JP2010284869A (ja) * | 2009-06-11 | 2010-12-24 | Shin-Etsu Chemical Co Ltd | 接合部材 |
| DE102013225109A1 (de) * | 2013-12-06 | 2015-06-11 | Robert Bosch Gmbh | Verfahren zum Befestigen eines Mikrochips auf einem Substrat |
| DE102014219095A1 (de) * | 2014-09-22 | 2016-03-24 | Nissan Chemical Industries, Ltd. | Wafer-Träger-Anordnung |
| CN104485304B (zh) * | 2015-01-07 | 2018-03-20 | 海太半导体（无锡）有限公司 | 一种芯片黏着检测装置 |
| JP2017050322A (ja) * | 2015-08-31 | 2017-03-09 | Jsr株式会社 | 基材の処理方法、半導体装置およびその製造方法 |
| CN107346746B (zh) * | 2016-05-05 | 2020-09-08 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件及其制造方法和电子装置 |
| WO2018027108A1 (en) * | 2016-08-05 | 2018-02-08 | Marsh Stephen Alan | Micro pressure sensor |
| KR102318181B1 (ko) | 2017-02-08 | 2021-10-27 | 엘켐 실리콘즈 유에스에이 코포레이션 | 열 관리가 개선된 이차 배터리 팩 |
| GB2564188B (en) * | 2017-04-24 | 2022-02-09 | Fuji Polymer Ind | Silicone sheet and mounting method using the same |
| TWI762649B (zh) * | 2017-06-26 | 2022-05-01 | 日商杜邦東麗特殊材料股份有限公司 | 黏晶用固化性矽組合物 |
| KR102873949B1 (ko) | 2018-10-30 | 2025-10-22 | 다우 도레이 캄파니 리미티드 | 경화 반응성 실리콘 조성물 및 그 경화물 및 이들의 용도 |
| TWI843786B (zh) | 2018-12-27 | 2024-06-01 | 日商陶氏東麗股份有限公司 | 固化性聚矽氧組合物、其固化物及其製造方法 |
| KR102912731B1 (ko) | 2018-12-27 | 2026-01-16 | 다우 도레이 캄파니 리미티드 | 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법 |
| TWI844606B (zh) | 2018-12-27 | 2024-06-11 | 日商陶氏東麗股份有限公司 | 具有熱熔性之固化性聚矽氧薄片之製造方法 |
| WO2020203306A1 (ja) | 2019-03-29 | 2020-10-08 | ダウ・東レ株式会社 | 硬化性シリコーン組成物、その硬化物、およびその製造方法 |
| KR102952088B1 (ko) | 2019-03-29 | 2026-04-15 | 다우 도레이 캄파니 리미티드 | 경화성 실리콘 조성물, 그의 경화물 및 그의 제조 방법 |
| CN113631659B (zh) | 2019-03-29 | 2023-05-05 | 陶氏东丽株式会社 | 固化性有机硅组合物、其固化物及其制造方法 |
| CN110350061B (zh) * | 2019-07-10 | 2024-11-29 | 佛山市国星半导体技术有限公司 | 一种免用封装胶的led芯片、封装器件及封装方法 |
| US12134697B2 (en) | 2019-12-27 | 2024-11-05 | Dow Toray Co., Ltd. | Curable hot-melt silicone composition, cured material thereof, and laminate containing curable hot-melt silicone composition or cured material thereof |
Family Cites Families (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3284406A (en) * | 1963-12-18 | 1966-11-08 | Dow Corning | Organosiloxane encapsulating resins |
| US3457214A (en) * | 1965-12-15 | 1969-07-22 | Gen Electric | Low temperature vulcanizing composition and article made therefrom |
| US3436366A (en) * | 1965-12-17 | 1969-04-01 | Gen Electric | Silicone potting compositions comprising mixtures of organopolysiloxanes containing vinyl groups |
| BE759624A (fr) * | 1969-12-01 | 1971-06-01 | Dow Corning | Caoutchouc de silicone resistant aux salissures et sa fabrication |
| US3989790A (en) * | 1974-03-22 | 1976-11-02 | Sws Silicones Corporation | Method for preparing silicone rubber molds |
| US4163082A (en) * | 1978-10-23 | 1979-07-31 | Dow Corning Corporation | U.V.-radiation method for decreasing surface tack of disposed organopolysiloxane greases and gels |
| US4297265A (en) * | 1979-11-23 | 1981-10-27 | Otto Fabric, Inc. | Silicone rubber coating material having reduced surface tension |
| JPS5952910B2 (ja) * | 1980-12-26 | 1984-12-21 | 東芝シリコ−ン株式会社 | 常温硬化性ポリオルガノシロキサン組成物 |
| US4746699A (en) * | 1983-07-07 | 1988-05-24 | General Electric Company | Curable silicone compositions |
| US4500584A (en) * | 1983-07-07 | 1985-02-19 | General Electric Company | Transparent membrane structures |
| JPS6290369A (ja) * | 1985-10-11 | 1987-04-24 | ト−レ・シリコ−ン株式会社 | シリコ−ン被覆布の接合方法 |
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| JPH0584861A (ja) * | 1991-09-30 | 1993-04-06 | Japan Gore Tex Inc | シリコーン樹脂を使用した複合材料 |
| JPH05179211A (ja) * | 1991-12-30 | 1993-07-20 | Nitto Denko Corp | ダイシング・ダイボンドフイルム |
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| JPH09183903A (ja) * | 1995-12-28 | 1997-07-15 | Toray Dow Corning Silicone Co Ltd | 硬化性シリコーン組成物 |
| JP3280224B2 (ja) * | 1996-02-06 | 2002-04-30 | 東レ・ダウコーニング・シリコーン株式会社 | 熱伝導性シリコーンゲルシートおよびその製造方法 |
| JP3413707B2 (ja) | 1996-07-04 | 2003-06-09 | 信越化学工業株式会社 | シート状接着剤 |
| JP3420473B2 (ja) * | 1997-04-30 | 2003-06-23 | 東レ・ダウコーニング・シリコーン株式会社 | シリコーン系接着性シート、その製造方法、および半導体装置 |
| JP3915940B2 (ja) * | 1997-06-10 | 2007-05-16 | 日立化成工業株式会社 | 絶縁層用接着フィルム |
| US5993590A (en) * | 1997-07-01 | 1999-11-30 | Manni-Kit, Inc. | Method for coating objects with silicone |
| US5932060A (en) * | 1997-09-12 | 1999-08-03 | General Electric Company | Paper release laminates having improved release characteristics |
| US6369185B1 (en) * | 1999-03-31 | 2002-04-09 | Dow Corning Toray Silicone Co., Ltd. | Curable organopolysiloxane composition, cured products formed therefrom and unified articles |
| JP2001019933A (ja) * | 1999-07-09 | 2001-01-23 | Dow Corning Toray Silicone Co Ltd | シリコーン系接着性シート、およびその製造方法 |
| JP2001139894A (ja) * | 1999-11-15 | 2001-05-22 | Dow Corning Toray Silicone Co Ltd | シリコーン系接着性シート、および半導体装置 |
| JP3850629B2 (ja) * | 2000-05-19 | 2006-11-29 | ユニ・チャーム株式会社 | シリコーン系化合物の層を有する吸収性物品 |
| US6319754B1 (en) * | 2000-07-10 | 2001-11-20 | Advanced Semiconductor Engineering, Inc. | Wafer-dicing process |
| US6716533B2 (en) * | 2001-08-27 | 2004-04-06 | General Electric Company | Paper release compositions having improved adhesion to paper and polymeric films |
| TWI250190B (en) * | 2001-10-03 | 2006-03-01 | Dow Corning Toray Silicone | Adhesive sheet of cross-linked silicone, method of manufacturing thereof, and device |
| US6660396B1 (en) * | 2002-06-03 | 2003-12-09 | Truseal Usa, Inc. | Molded encapsulated indicia system |
| JP3919001B2 (ja) * | 2002-08-08 | 2007-05-23 | 信越化学工業株式会社 | 付加反応硬化型オルガノポリシロキサン組成物 |
-
2003
- 2003-07-08 JP JP2003272095A patent/JP2004043814A/ja active Pending
- 2003-07-14 WO PCT/JP2003/008936 patent/WO2004007628A1/en not_active Ceased
- 2003-07-14 KR KR10-2005-7000776A patent/KR20050021485A/ko not_active Withdrawn
- 2003-07-14 AU AU2003249594A patent/AU2003249594A1/en not_active Abandoned
- 2003-07-14 US US10/521,287 patent/US7534659B2/en not_active Expired - Fee Related
- 2003-07-14 CN CNB038168367A patent/CN1276046C/zh not_active Expired - Fee Related
- 2003-07-14 EP EP03764198A patent/EP1539898A1/en not_active Withdrawn
- 2003-07-15 TW TW092119248A patent/TWI293191B/zh not_active IP Right Cessation
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