JP2003532791A - 精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法 - Google Patents

精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法

Info

Publication number
JP2003532791A
JP2003532791A JP2000502233A JP2000502233A JP2003532791A JP 2003532791 A JP2003532791 A JP 2003532791A JP 2000502233 A JP2000502233 A JP 2000502233A JP 2000502233 A JP2000502233 A JP 2000502233A JP 2003532791 A JP2003532791 A JP 2003532791A
Authority
JP
Japan
Prior art keywords
billet
forging
thickness
temperature
solid lubricant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2000502233A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003532791A5 (enExample
Inventor
シーガル ブラッドミール
Original Assignee
ジョンソン マッセイ エレクトロニクス インク.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ジョンソン マッセイ エレクトロニクス インク. filed Critical ジョンソン マッセイ エレクトロニクス インク.
Publication of JP2003532791A publication Critical patent/JP2003532791A/ja
Publication of JP2003532791A5 publication Critical patent/JP2003532791A5/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0221Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the working steps
    • C21D8/0236Cold rolling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21JFORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J3/00Lubricating during forging or pressing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B1/00Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations
    • B21B1/38Metal-rolling methods or mills for making semi-finished products of solid or profiled cross-section; Sequence of operations in milling trains; Layout of rolling-mill plant, e.g. grouping of stands; Succession of passes or of sectional pass alternations for rolling sheets of limited length, e.g. folded sheets, superimposed sheets, pack rolling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21JFORGING; HAMMERING; PRESSING METAL; RIVETING; FORGE FURNACES
    • B21J5/00Methods for forging, hammering, or pressing; Special equipment or accessories therefor
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/02Hardening articles or materials formed by forging or rolling, with no further heating beyond that required for the formation
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D1/00General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
    • C21D1/26Methods of annealing
    • CCHEMISTRY; METALLURGY
    • C21METALLURGY OF IRON
    • C21DMODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
    • C21D8/00Modifying the physical properties by deformation combined with, or followed by, heat treatment
    • C21D8/02Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips
    • C21D8/0247Modifying the physical properties by deformation combined with, or followed by, heat treatment during manufacturing of plates or strips characterised by the heat treatment
    • C21D8/0273Final recrystallisation annealing
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C27/00Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
    • C22C27/02Alloys based on vanadium, niobium, or tantalum
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/04Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of aluminium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/10Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of nickel or cobalt or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18High-melting or refractory metals or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/16Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of other metals or alloys based thereon
    • C22F1/18High-melting or refractory metals or alloys based thereon
    • C22F1/183High-melting or refractory metals or alloys based thereon of titanium or alloys based thereon
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Forging (AREA)
  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2000502233A 1997-07-11 1998-06-26 精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法 Withdrawn JP2003532791A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US5221897P 1997-07-11 1997-07-11
US60/052,218 1997-07-11
US09/098,761 1998-06-17
US09/098,761 US6569270B2 (en) 1997-07-11 1998-06-17 Process for producing a metal article
PCT/US1998/013447 WO1999002743A1 (en) 1997-07-11 1998-06-26 Metal article with fine uniform structures and textures and process of making same

Publications (2)

Publication Number Publication Date
JP2003532791A true JP2003532791A (ja) 2003-11-05
JP2003532791A5 JP2003532791A5 (enExample) 2005-04-07

Family

ID=26730344

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000502233A Withdrawn JP2003532791A (ja) 1997-07-11 1998-06-26 精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法

Country Status (5)

Country Link
US (2) US6569270B2 (enExample)
EP (1) EP1027463A4 (enExample)
JP (1) JP2003532791A (enExample)
KR (1) KR100528090B1 (enExample)
WO (1) WO1999002743A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013530047A (ja) * 2010-06-14 2013-07-25 エイティーアイ・プロパティーズ・インコーポレーテッド 改良された鍛造性のための潤滑法
JP2018523754A (ja) * 2015-08-03 2018-08-23 ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. 向上した特性を有する無摩擦鍛造アルミニウム合金スパッタリングターゲット

Families Citing this family (104)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6569270B2 (en) 1997-07-11 2003-05-27 Honeywell International Inc. Process for producing a metal article
US6348139B1 (en) * 1998-06-17 2002-02-19 Honeywell International Inc. Tantalum-comprising articles
US6348113B1 (en) 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
US6858102B1 (en) * 2000-11-15 2005-02-22 Honeywell International Inc. Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets
US6423161B1 (en) 1999-10-15 2002-07-23 Honeywell International Inc. High purity aluminum materials
KR20020070443A (ko) 1999-11-24 2002-09-09 허니웰 인터내셔널 인코포레이티드 전도성 상호연결장치
US20040072009A1 (en) * 1999-12-16 2004-04-15 Segal Vladimir M. Copper sputtering targets and methods of forming copper sputtering targets
US6878250B1 (en) 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
US6451222B1 (en) 1999-12-16 2002-09-17 Honeywell International Inc. Ferroelectric composition, ferroelectric vapor deposition target and method of making a ferroelectric vapor deposition target
US7517417B2 (en) 2000-02-02 2009-04-14 Honeywell International Inc. Tantalum PVD component producing methods
US6331233B1 (en) 2000-02-02 2001-12-18 Honeywell International Inc. Tantalum sputtering target with fine grains and uniform texture and method of manufacture
US20010047838A1 (en) * 2000-03-28 2001-12-06 Segal Vladimir M. Methods of forming aluminum-comprising physical vapor deposition targets; sputtered films; and target constructions
US6585870B1 (en) * 2000-04-28 2003-07-01 Honeywell International Inc. Physical vapor deposition targets having crystallographic orientations
AU2001265309A1 (en) * 2000-06-02 2001-12-17 Honeywell International, Inc. Fine grain size material, sputtering target, methods of forming, and micro-arc reduction method
US20030227068A1 (en) * 2001-05-31 2003-12-11 Jianxing Li Sputtering target
US6946039B1 (en) 2000-11-02 2005-09-20 Honeywell International Inc. Physical vapor deposition targets, and methods of fabricating metallic materials
US6887356B2 (en) * 2000-11-27 2005-05-03 Cabot Corporation Hollow cathode target and methods of making same
CN1257998C (zh) * 2001-01-11 2006-05-31 卡伯特公司 钽和铌的坯料及其制造方法
HUP0303269A3 (en) * 2001-02-20 2004-05-28 H C Starck Inc Newton Refractory metal plates with uniform texture and methods of making the same
AU2002236551A1 (en) * 2001-07-19 2003-03-03 Honeywell International Inc. Sputtering targets, sputter reactors, methods of forming cast ingots, and methods of forming metallic articles
US8562664B2 (en) 2001-10-25 2013-10-22 Advanced Cardiovascular Systems, Inc. Manufacture of fine-grained material for use in medical devices
EP1444376B1 (en) * 2001-11-13 2010-10-06 Praxair S.T. Technology, Inc. High-purity aluminum sputter targets
US20050000821A1 (en) * 2001-11-16 2005-01-06 White Tamara L Anodes for electroplating operations, and methods of forming materials over semiconductor substrates
EP1471164B1 (en) * 2002-01-30 2013-01-23 JX Nippon Mining & Metals Corporation Copper alloy sputtering target and method for manufacturing the target
US7416697B2 (en) 2002-06-14 2008-08-26 General Electric Company Method for preparing a metallic article having an other additive constituent, without any melting
WO2004001093A1 (ja) * 2002-06-24 2003-12-31 Kobelco Research Institute, Inc. 銀合金スパッタリングターゲットとその製造方法
US20040016635A1 (en) * 2002-07-19 2004-01-29 Ford Robert B. Monolithic sputtering target assembly
US7235143B2 (en) * 2002-08-08 2007-06-26 Praxair S.T. Technology, Inc. Controlled-grain-precious metal sputter targets
US20040123920A1 (en) * 2002-10-08 2004-07-01 Thomas Michael E. Homogenous solid solution alloys for sputter-deposited thin films
JP4794802B2 (ja) 2002-11-21 2011-10-19 Jx日鉱日石金属株式会社 銅合金スパッタリングターゲット及び半導体素子配線
US7897103B2 (en) * 2002-12-23 2011-03-01 General Electric Company Method for making and using a rod assembly
US6921470B2 (en) * 2003-02-13 2005-07-26 Cabot Corporation Method of forming metal blanks for sputtering targets
US20040186810A1 (en) * 2003-02-14 2004-09-23 Michaluk Christopher A. Method of supplying sputtering targets to fabricators and other users
EP1618586B1 (en) * 2003-04-23 2017-06-21 H.C. Starck Inc. Molybdenum alloy x-ray targets having uniform grain structure
US20040221929A1 (en) 2003-05-09 2004-11-11 Hebda John J. Processing of titanium-aluminum-vanadium alloys and products made thereby
US7228722B2 (en) * 2003-06-09 2007-06-12 Cabot Corporation Method of forming sputtering articles by multidirectional deformation
JP2007523993A (ja) * 2003-06-20 2007-08-23 キャボット コーポレイション スパッタターゲットをバッキングプレートに結合させるための方法及び設計
JP4384453B2 (ja) * 2003-07-16 2009-12-16 株式会社神戸製鋼所 Ag系スパッタリングターゲット及びその製造方法
CN1839213A (zh) * 2003-08-21 2006-09-27 霍尼韦尔国际公司 在三元混合物中包含铜的pvd靶和形成含铜pvd靶的方法
US6964600B2 (en) * 2003-11-21 2005-11-15 Praxair Technology, Inc. High selectivity colloidal silica slurry
US20050236076A1 (en) * 2003-12-22 2005-10-27 Michaluk Christopher A High integrity sputtering target material and method for producing bulk quantities of same
US20050252268A1 (en) * 2003-12-22 2005-11-17 Michaluk Christopher A High integrity sputtering target material and method for producing bulk quantities of same
JP4409572B2 (ja) * 2004-03-01 2010-02-03 日鉱金属株式会社 Ni−Pt合金及び同合金ターゲット
JP4980883B2 (ja) * 2004-03-26 2012-07-18 ハー ツェー シュタルク インコーポレイテッド 高融点金属ポット
US7837812B2 (en) 2004-05-21 2010-11-23 Ati Properties, Inc. Metastable beta-titanium alloys and methods of processing the same by direct aging
US20060213592A1 (en) * 2004-06-29 2006-09-28 Postech Foundation Nanocrystalline titanium alloy, and method and apparatus for manufacturing the same
US8088232B2 (en) * 2004-08-31 2012-01-03 H.C. Starck Inc. Molybdenum tubular sputtering targets with uniform grain size and texture
US20060042728A1 (en) * 2004-08-31 2006-03-02 Brad Lemon Molybdenum sputtering targets
US7531021B2 (en) 2004-11-12 2009-05-12 General Electric Company Article having a dispersion of ultrafine titanium boride particles in a titanium-base matrix
US7998287B2 (en) 2005-02-10 2011-08-16 Cabot Corporation Tantalum sputtering target and method of fabrication
US20060201589A1 (en) * 2005-03-11 2006-09-14 Honeywell International Inc. Components comprising metallic material, physical vapor deposition targets, thin films, and methods of forming metallic components
US20080274369A1 (en) * 2005-04-21 2008-11-06 Lee Eal H Novel Ruthenium-Based Materials and Ruthenium Alloys, Their Use in Vapor Deposition or Atomic Layer Deposition and Films Produced Therefrom
US20060259126A1 (en) * 2005-05-05 2006-11-16 Jason Lenz Medical devices and methods of making the same
JP5114812B2 (ja) 2006-03-07 2013-01-09 キャボット コーポレイション 変形させた金属部材の製造方法
US20070251818A1 (en) * 2006-05-01 2007-11-01 Wuwen Yi Copper physical vapor deposition targets and methods of making copper physical vapor deposition targets
US20070251819A1 (en) * 2006-05-01 2007-11-01 Kardokus Janine K Hollow cathode magnetron sputtering targets and methods of forming hollow cathode magnetron sputtering targets
US9358000B2 (en) 2006-12-15 2016-06-07 Ethicon, Inc. Tungsten alloy suture needles
US8062437B2 (en) * 2007-06-01 2011-11-22 Ethicon, Inc. Thermal forming of refractory alloy surgical needles and fixture and apparatus
US20080300552A1 (en) * 2007-06-01 2008-12-04 Cichocki Frank R Thermal forming of refractory alloy surgical needles
US8250895B2 (en) 2007-08-06 2012-08-28 H.C. Starck Inc. Methods and apparatus for controlling texture of plates and sheets by tilt rolling
JP5389802B2 (ja) * 2007-08-06 2014-01-15 エイチ.シー. スターク インコーポレイテッド 組織の均一性が改善された高融点金属プレート
US8702919B2 (en) * 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
US8551267B2 (en) 2009-01-22 2013-10-08 Tosoh Smd, Inc. Monolithic aluminum alloy target and method of manufacturing
US10053758B2 (en) * 2010-01-22 2018-08-21 Ati Properties Llc Production of high strength titanium
US9267184B2 (en) 2010-02-05 2016-02-23 Ati Properties, Inc. Systems and methods for processing alloy ingots
US8230899B2 (en) 2010-02-05 2012-07-31 Ati Properties, Inc. Systems and methods for forming and processing alloy ingots
JP5364202B2 (ja) * 2010-04-26 2013-12-11 Jx日鉱日石金属株式会社 Sb−Te基合金焼結体スパッタリングターゲット
KR101226483B1 (ko) * 2010-05-24 2013-01-25 국방과학연구소 균질하고 초미립의 미세조직을 갖는 구리 라이너 제조 방법
US9255316B2 (en) 2010-07-19 2016-02-09 Ati Properties, Inc. Processing of α+β titanium alloys
US8499605B2 (en) 2010-07-28 2013-08-06 Ati Properties, Inc. Hot stretch straightening of high strength α/β processed titanium
US9206497B2 (en) 2010-09-15 2015-12-08 Ati Properties, Inc. Methods for processing titanium alloys
US8613818B2 (en) 2010-09-15 2013-12-24 Ati Properties, Inc. Processing routes for titanium and titanium alloys
US10513755B2 (en) 2010-09-23 2019-12-24 Ati Properties Llc High strength alpha/beta titanium alloy fasteners and fastener stock
US8789254B2 (en) 2011-01-17 2014-07-29 Ati Properties, Inc. Modifying hot workability of metal alloys via surface coating
US8652400B2 (en) 2011-06-01 2014-02-18 Ati Properties, Inc. Thermo-mechanical processing of nickel-base alloys
JP5159962B1 (ja) 2012-01-10 2013-03-13 三菱マテリアル株式会社 導電性膜形成用銀合金スパッタリングターゲットおよびその製造方法
US9050647B2 (en) 2013-03-15 2015-06-09 Ati Properties, Inc. Split-pass open-die forging for hard-to-forge, strain-path sensitive titanium-base and nickel-base alloys
US9869003B2 (en) 2013-02-26 2018-01-16 Ati Properties Llc Methods for processing alloys
WO2014136679A1 (ja) 2013-03-04 2014-09-12 Jx日鉱日石金属株式会社 タンタルスパッタリングターゲット及びその製造方法
US9192981B2 (en) 2013-03-11 2015-11-24 Ati Properties, Inc. Thermomechanical processing of high strength non-magnetic corrosion resistant material
US9777361B2 (en) 2013-03-15 2017-10-03 Ati Properties Llc Thermomechanical processing of alpha-beta titanium alloys
US9027374B2 (en) 2013-03-15 2015-05-12 Ati Properties, Inc. Methods to improve hot workability of metal alloys
US9539636B2 (en) 2013-03-15 2017-01-10 Ati Properties Llc Articles, systems, and methods for forging alloys
KR101282229B1 (ko) * 2013-03-28 2013-07-09 국방과학연구소 성형작약탄용 몰리브데늄 라이너의 제조방법 및 그 제조방법에 의해 제조된 성형작약탄용 몰리브데늄 라이너
US11111552B2 (en) 2013-11-12 2021-09-07 Ati Properties Llc Methods for processing metal alloys
DE102013225187B4 (de) * 2013-12-06 2018-07-19 Heraeus Deutschland GmbH & Co. KG Verfahren zur Bearbeitung einer dispersionsgehärteten Platinzusammensetzung
US10011895B2 (en) 2014-05-06 2018-07-03 Gyrus Acmi, Inc. Assembly fabrication and modification of elasticity in materials
US10094003B2 (en) 2015-01-12 2018-10-09 Ati Properties Llc Titanium alloy
US10502252B2 (en) 2015-11-23 2019-12-10 Ati Properties Llc Processing of alpha-beta titanium alloys
US10900102B2 (en) 2016-09-30 2021-01-26 Honeywell International Inc. High strength aluminum alloy backing plate and methods of making
WO2018193035A1 (en) * 2017-04-21 2018-10-25 Oerlikon Surface Solutions Ag, Pfäffikon Pvd bond coat
US11062889B2 (en) 2017-06-26 2021-07-13 Tosoh Smd, Inc. Method of production of uniform metal plates and sputtering targets made thereby
US10760156B2 (en) 2017-10-13 2020-09-01 Honeywell International Inc. Copper manganese sputtering target
JP7308013B2 (ja) * 2017-11-10 2023-07-13 Jx金属株式会社 タングステンスパッタリングターゲット及びその製造方法
US11035036B2 (en) 2018-02-01 2021-06-15 Honeywell International Inc. Method of forming copper alloy sputtering targets with refined shape and microstructure
KR20210047343A (ko) * 2018-09-26 2021-04-29 제이엑스금속주식회사 스퍼터링 타깃 및 그 제조 방법
CN112084924B (zh) * 2020-09-02 2022-05-24 燕山大学 晶粒组织均匀性的评价方法、锻造成形工艺选择方法
CN112481565B (zh) * 2020-11-12 2021-10-26 贵州航宇科技发展股份有限公司 一种Waspaloy合金的锻造方法
CN113231465B (zh) * 2021-05-13 2022-05-13 太原理工大学 一种大尺寸Ni-Ni3Al-NiAl层状结构复合板的制备方法
CN115283431B (zh) * 2022-08-04 2025-08-19 南京理工大学 一种高强高韧等轴超细晶纯钛的制备方法
CN116005085A (zh) * 2023-03-17 2023-04-25 内蒙金属材料研究所 一种用于含钪铝合金板材的大辊径板厚比的冷轧制备工艺
US12344918B2 (en) 2023-07-12 2025-07-01 Ati Properties Llc Titanium alloys
CN118497645B (zh) * 2024-07-18 2024-12-17 东北大学 一种阳极氧化外观用铝合金带材的制备方法及铝合金带材
CN120755295B (zh) * 2025-09-05 2025-11-18 宝武特种冶金有限公司 一种精确控制航空发动机钛合金机匣的超塑成形方法

Family Cites Families (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3246361A1 (de) 1982-02-27 1983-09-08 Philips Patentverwaltung Gmbh, 2000 Hamburg Kohlenstoff enthaltende gleitschicht
JPS6066425A (ja) 1983-09-22 1985-04-16 Nippon Telegr & Teleph Corp <Ntt> Lsi電極用の高純度モリブデンタ−ゲツトならびに高純度モリブデンシリサイドタ−ゲツトおよびその製造方法
US4663130A (en) 1983-11-14 1987-05-05 Cabot Corporation Process for dissolving tantalum/columbium materials containing alkali metal impurities
US4663120A (en) 1985-04-15 1987-05-05 Gte Products Corporation Refractory metal silicide sputtering target
JPH0621346B2 (ja) 1986-06-11 1994-03-23 日本鉱業株式会社 高純度金属タンタル製ターゲットの製造方法
US4889745A (en) 1986-11-28 1989-12-26 Japan As Represented By Director General Of Agency Of Industrial Science And Technology Method for reactive preparation of a shaped body of inorganic compound of metal
JPS63216966A (ja) * 1987-03-06 1988-09-09 Toshiba Corp スパツタタ−ゲツト
JPS63244727A (ja) * 1987-03-31 1988-10-12 Nkk Corp スパツタリング用タ−ゲツトの製造方法
US4762558A (en) 1987-05-15 1988-08-09 Rensselaer Polytechnic Institute Production of reactive sintered nickel aluminide material
US4960163A (en) * 1988-11-21 1990-10-02 Aluminum Company Of America Fine grain casting by mechanical stirring
FR2648404B1 (fr) 1989-06-14 1991-09-13 Faiveley Sa Pantographe a coussin d'air
US5468401A (en) 1989-06-16 1995-11-21 Chem-Trend, Incorporated Carrier-free metalworking lubricant and method of making and using same
US5074907A (en) 1989-08-16 1991-12-24 General Electric Company Method for developing enhanced texture in titanium alloys, and articles made thereby
US5409517A (en) 1990-05-15 1995-04-25 Kabushiki Kaisha Toshiba Sputtering target and method of manufacturing the same
JPH05508509A (ja) 1990-07-03 1993-11-25 トーソー エスエムディー,インコーポレーテッド コンパクトディスクのコーティング用改良スパッタリングターゲットとその使用方法及びその製造方法
US5087297A (en) 1991-01-17 1992-02-11 Johnson Matthey Inc. Aluminum target for magnetron sputtering and method of making same
US5282946A (en) 1991-08-30 1994-02-01 Mitsubishi Materials Corporation Platinum-cobalt alloy sputtering target and method for manufacturing same
US5231306A (en) 1992-01-31 1993-07-27 Micron Technology, Inc. Titanium/aluminum/nitrogen material for semiconductor devices
JPH05214523A (ja) 1992-02-05 1993-08-24 Toshiba Corp スパッタリングターゲットおよびその製造方法
US5330701A (en) 1992-02-28 1994-07-19 Xform, Inc. Process for making finely divided intermetallic
JP3338476B2 (ja) 1992-06-29 2002-10-28 住友チタニウム株式会社 スパッタリング用の金属Tiターゲットの製造方法
JPH0693400A (ja) 1992-09-16 1994-04-05 Nkk Corp チタン製電着ドラムの製造方法
TW234767B (enExample) 1992-09-29 1994-11-21 Nippon En Kk
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
JPH06256919A (ja) 1993-03-01 1994-09-13 Seiko Instr Inc チタン合金の加工方法
JPH06264232A (ja) 1993-03-12 1994-09-20 Nikko Kinzoku Kk Ta製スパッタリングタ−ゲットとその製造方法
US5400633A (en) 1993-09-03 1995-03-28 The Texas A&M University System Apparatus and method for deformation processing of metals, ceramics, plastics and other materials
US5772860A (en) * 1993-09-27 1998-06-30 Japan Energy Corporation High purity titanium sputtering targets
US5513512A (en) 1994-06-17 1996-05-07 Segal; Vladimir Plastic deformation of crystalline materials
JP3506782B2 (ja) 1994-11-24 2004-03-15 オリンパス株式会社 光学薄膜の製造方法
US5590389A (en) 1994-12-23 1996-12-31 Johnson Matthey Electronics, Inc. Sputtering target with ultra-fine, oriented grains and method of making same
JP2984778B2 (ja) 1995-02-27 1999-11-29 株式会社住友シチックス尼崎 高純度チタン材の鍛造方法
JP3413782B2 (ja) 1995-03-31 2003-06-09 日立金属株式会社 スパッタリング用チタンタ−ゲットおよびその製造方法
US5600989A (en) 1995-06-14 1997-02-11 Segal; Vladimir Method of and apparatus for processing tungsten heavy alloys for kinetic energy penetrators
US5673581A (en) 1995-10-03 1997-10-07 Segal; Vladimir Method and apparatus for forming thin parts of large length and width
JP3713332B2 (ja) 1996-06-21 2005-11-09 同和鉱業株式会社 単結晶銅ターゲット及びその製造方法
US5766380A (en) 1996-11-05 1998-06-16 Sony Corporation Method for fabricating randomly oriented aluminum alloy sputtering targets with fine grains and fine precipitates
JPH10158829A (ja) 1996-12-04 1998-06-16 Sony Corp スパッタリングターゲット組立体の製造方法
JP3867328B2 (ja) 1996-12-04 2007-01-10 ソニー株式会社 スパッタリングターゲット及びその製造方法
US6569270B2 (en) 1997-07-11 2003-05-27 Honeywell International Inc. Process for producing a metal article
US5993621A (en) 1997-07-11 1999-11-30 Johnson Matthey Electronics, Inc. Titanium sputtering target
US6001227A (en) 1997-11-26 1999-12-14 Applied Materials, Inc. Target for use in magnetron sputtering of aluminum for forming metallization films having low defect densities and methods for manufacturing and using such target
US6348139B1 (en) 1998-06-17 2002-02-19 Honeywell International Inc. Tantalum-comprising articles
US6193821B1 (en) 1998-08-19 2001-02-27 Tosoh Smd, Inc. Fine grain tantalum sputtering target and fabrication process
US6348113B1 (en) 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
US6423161B1 (en) 1999-10-15 2002-07-23 Honeywell International Inc. High purity aluminum materials

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013530047A (ja) * 2010-06-14 2013-07-25 エイティーアイ・プロパティーズ・インコーポレーテッド 改良された鍛造性のための潤滑法
JP2018523754A (ja) * 2015-08-03 2018-08-23 ハネウェル・インターナショナル・インコーポレーテッドHoneywell International Inc. 向上した特性を有する無摩擦鍛造アルミニウム合金スパッタリングターゲット
JP7021069B2 (ja) 2015-08-03 2022-02-16 ハネウェル・インターナショナル・インコーポレーテッド 向上した特性を有する無摩擦鍛造アルミニウム合金スパッタリングターゲット

Also Published As

Publication number Publication date
US20010001401A1 (en) 2001-05-24
US6569270B2 (en) 2003-05-27
KR20010021652A (ko) 2001-03-15
EP1027463A1 (en) 2000-08-16
WO1999002743A1 (en) 1999-01-21
KR100528090B1 (ko) 2005-11-15
EP1027463A4 (en) 2004-06-16
US6238494B1 (en) 2001-05-29

Similar Documents

Publication Publication Date Title
JP2003532791A (ja) 精微で均質な構造及び表面状態を備えた金属物体並びにその製造方法
KR100512295B1 (ko) 미세균일 구조 및 조직을 갖는 금속재 및 그 제조방법
US5902424A (en) Method of making an article of manufacture made of a magnesium alloy
US5409555A (en) Method of manufacturing a forged magnesium alloy
US6712916B2 (en) Metal superplasticity enhancement and forming process
EP2508643A1 (en) Titanium alloy part and method of manufacturing same
WO2003052155A1 (en) Method for processing beta titanium alloys
US6811625B2 (en) Method for processing of continuously cast aluminum sheet
WO1998017836A1 (en) Method of processing titanium alloys and the article
EP4317497A1 (en) Material for the manufacture of high-strength fasteners and method for producing same
US6589371B1 (en) Method of processing titanium metal alloys
US5092940A (en) Process for production of titanium and titanium alloy material having fine equiaxial microstructure
USH1659H (en) Method for heat treating titanium aluminide alloys
JPH0617178A (ja) 超塑性アルミニウム基合金材料及び超塑性合金材料の製造方法
RU2164263C2 (ru) СПОСОБ ОБРАБОТКИ ЗАГОТОВОК ИЗ ЗАЭВТЕКТОИДНЫХ γ+α2 СПЛАВОВ
RU2224047C1 (ru) Способ изготовления листовых полуфабрикатов из титановых сплавов
US4243437A (en) Process for forming articles from leaded bronzes
JPH0696759B2 (ja) 組織の良好なα+β型チタン合金圧延棒および線の製造方法
TW397722B (en) Metal article with fine uniform structures and textures and process of making same
JP2021066900A (ja) 熱間加工品およびその製造方法
JPS60149751A (ja) 金属組成物
JPS61501458A (ja) アルミニウム又はアルミニウム合金の冷間衝撃押出し法
Russell et al. Microstructure development and thermal response of delta processed billet and bar for alloy 718
Shields Jr et al. Forging of Refractory Metals
JPH0819503B2 (ja) 超塑性加工性に優れたチタン合金及びその製造方法、並びにチタン合金の超塑性加工方法

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060324

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20060718

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060914