JP2003519929A - 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 - Google Patents

表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法

Info

Publication number
JP2003519929A
JP2003519929A JP2001550820A JP2001550820A JP2003519929A JP 2003519929 A JP2003519929 A JP 2003519929A JP 2001550820 A JP2001550820 A JP 2001550820A JP 2001550820 A JP2001550820 A JP 2001550820A JP 2003519929 A JP2003519929 A JP 2003519929A
Authority
JP
Japan
Prior art keywords
light source
molding material
emitting diode
plastic molding
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001550820A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003519929A5 (enExample
Inventor
イェーガー ハラルト
ヘーン クラウス
ブルナー ラインホルト
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of JP2003519929A publication Critical patent/JP2003519929A/ja
Publication of JP2003519929A5 publication Critical patent/JP2003519929A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0102—Calcium [Ca]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
JP2001550820A 1999-12-30 2000-12-28 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法 Pending JP2003519929A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19963806A DE19963806C2 (de) 1999-12-30 1999-12-30 Verfahren zum Herstellen einer Leuchtdioden-Weißlichtquelle, Verwendung einer Kunststoff-Preßmasse zum Herstellen einer Leuchtioden-Weißlichtquelle und oberflächenmontierbare Leuchtdioden-Weißlichtquelle
DE19963806.3 1999-12-30
PCT/DE2000/004660 WO2001050540A1 (de) 1999-12-30 2000-12-28 Oberflächenmontierbare leuchtdioden-lichtquelle und verfahren zur herstellung einer leuchtdioden-lichtquelle

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011223818A Division JP2012009902A (ja) 1999-12-30 2011-10-11 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法

Publications (2)

Publication Number Publication Date
JP2003519929A true JP2003519929A (ja) 2003-06-24
JP2003519929A5 JP2003519929A5 (enExample) 2011-04-21

Family

ID=7935014

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001550820A Pending JP2003519929A (ja) 1999-12-30 2000-12-28 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法
JP2011223818A Pending JP2012009902A (ja) 1999-12-30 2011-10-11 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011223818A Pending JP2012009902A (ja) 1999-12-30 2011-10-11 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法

Country Status (6)

Country Link
US (2) US7098588B2 (enExample)
EP (1) EP1243031B9 (enExample)
JP (2) JP2003519929A (enExample)
CN (1) CN100375299C (enExample)
DE (2) DE19964252A1 (enExample)
WO (1) WO2001050540A1 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006134992A (ja) * 2004-11-04 2006-05-25 Hitachi Displays Ltd 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
JP2006339653A (ja) * 2005-06-03 2006-12-14 Samsung Electro-Mechanics Co Ltd 高出力ｌｅｄパッケージおよび高出力ｌｅｄパッケージ製造方法
EP2081227A2 (en) 2008-01-18 2009-07-22 Sanyo Electric Co., Ltd. Light-emitting device and lighting apparatus incorporating same
KR101456266B1 (ko) * 2006-12-08 2014-11-04 서울반도체 주식회사 발광소자

Families Citing this family (98)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7320632B2 (en) 2000-06-15 2008-01-22 Lednium Pty Limited Method of producing a lamp
AUPQ818100A0 (en) 2000-06-15 2000-07-06 Arlec Australia Limited Led lamp
AUPR570501A0 (en) * 2001-06-15 2001-07-12 Q1 (Pacific) Limited Led lamp
DE10131698A1 (de) * 2001-06-29 2003-01-30 Osram Opto Semiconductors Gmbh Oberflächenmontierbares strahlungsemittierendes Bauelement und Verfahren zu dessen Herstellung
DE10134968A1 (de) * 2001-07-23 2003-02-20 Lite On Electronics Inc Leuchtdiode und Verfahren zu deren Herstellung
DE10147986A1 (de) * 2001-09-28 2003-04-10 Osram Opto Semiconductors Gmbh Oberflächenmontierbare Leuchtdioden-Lichtquelle und Verfahren zur Herstellung derselben
DE10153615C1 (de) * 2001-10-31 2003-07-24 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von elektronischen Bauteilen
DE10213294B4 (de) 2002-03-25 2015-05-13 Osram Gmbh Verwendung eines UV-beständigen Polymers in der Optoelektronik sowie im Außenanwendungsbereich, UV-beständiges Polymer sowie optisches Bauelement
DE10214208B9 (de) * 2002-03-28 2006-12-28 Osram Opto Semiconductors Gmbh Gußform für ein elektronisches Bauelement und elektronisches Bauelement
US6870311B2 (en) * 2002-06-07 2005-03-22 Lumileds Lighting U.S., Llc Light-emitting devices utilizing nanoparticles
US6841802B2 (en) 2002-06-26 2005-01-11 Oriol, Inc. Thin film light emitting diode
AU2003261181A1 (en) * 2002-07-19 2004-02-09 Microsemi Corporation Process for fabricating, and light emitting device resulting from, a homogenously mixed powder/pelletized compound
JP2005535144A (ja) 2002-07-31 2005-11-17 オスラム　オプト　セミコンダクターズ　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 表面実装可能な半導体素子及び該半導体素子の製造のための方法
DE10234978A1 (de) * 2002-07-31 2004-02-12 Osram Opto Semiconductors Gmbh Oberflächenmontierbares Halbleiterbauelement und Verfahren zu dessen Herstellung
US20050047115A1 (en) * 2002-09-17 2005-03-03 Hsi-Huang Lin Method for making a lamp string
US6879040B2 (en) * 2002-09-18 2005-04-12 Agilent Technologies, Inc. Surface mountable electronic device
DE10250877B4 (de) * 2002-10-31 2008-09-04 Osram Opto Semiconductors Gmbh Lichtemittierendes Halbleiterbauelement, Herstellungsverfahren und Verwendung dafür, eine Vielzahl der lichtemittierenden Halbleiterbauelemente enthaltendes Modul und dessen Verwendung
DE10258193B4 (de) 2002-12-12 2014-04-10 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen von Leuchtdioden-Lichtquellen mit Lumineszenz-Konversionselement
DE10261672B4 (de) * 2002-12-31 2005-11-24 Osram Opto Semiconductors Gmbh LED-Chip mit Konversionsstoff, optoelektronisches Bauelement mit einem derartigen LED-Chip und Verfahren zum Herstellen eines derartigen LED-Chips
DE10303455B4 (de) * 2003-01-29 2007-11-29 Osram Opto Semiconductors Gmbh Leiterrahmenband und Verfahren zum Herstellen einer Mehrzahl von Leiterrahmen-basierten Leuchtdiodenbauelementen
KR20040092512A (ko) * 2003-04-24 2004-11-04 (주)그래픽테크노재팬 방열 기능을 갖는 반사판이 구비된 반도체 발광장치
US7520635B2 (en) 2003-07-02 2009-04-21 S.C. Johnson & Son, Inc. Structures for color changing light devices
US7476002B2 (en) 2003-07-02 2009-01-13 S.C. Johnson & Son, Inc. Color changing light devices with active ingredient and sound emission for mood enhancement
US7484860B2 (en) 2003-07-02 2009-02-03 S.C. Johnson & Son, Inc. Combination white light and colored LED light device with active ingredient emission
US7318659B2 (en) * 2004-03-03 2008-01-15 S. C. Johnson & Son, Inc. Combination white light and colored LED light device with active ingredient emission
US7604378B2 (en) 2003-07-02 2009-10-20 S.C. Johnson & Son, Inc. Color changing outdoor lights with active ingredient and sound emission
US7915085B2 (en) * 2003-09-18 2011-03-29 Cree, Inc. Molded chip fabrication method
KR101131648B1 (ko) 2003-09-24 2012-03-28 오스람 옵토 세미컨덕터스 게엠베하 연색성이 개선된 ｌｅｄ-기반 고효율 조명 시스템
EP1664239B1 (de) 2003-09-24 2013-01-30 OSRAM GmbH Weiss emittierende led mit definierter farbtemperatur
DE10361801A1 (de) * 2003-12-30 2005-08-04 Osram Opto Semiconductors Gmbh Strahlungsemittierendes und/oder strahlungsempfangendes Halbleiterbauelement und Verfahren zu dessen Herstellung
TWI275189B (en) 2003-12-30 2007-03-01 Osram Opto Semiconductors Gmbh Radiation-emitting and/or radiation-receiving semiconductor component and method for producing such component
US7503675B2 (en) 2004-03-03 2009-03-17 S.C. Johnson & Son, Inc. Combination light device with insect control ingredient emission
JP2005310756A (ja) 2004-03-26 2005-11-04 Koito Mfg Co Ltd 光源モジュールおよび車両用前照灯
DE102004038199A1 (de) 2004-08-05 2006-03-16 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH LED mit niedriger Farbtemperatur
DE102004047640A1 (de) 2004-09-30 2006-04-13 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Gehäuse für ein optoelektronisches Bauelement
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US20060186428A1 (en) * 2005-02-23 2006-08-24 Tan Kheng L Light emitting device with enhanced encapsulant adhesion using siloxane material and method for fabricating the device
DE102005009066A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optischen und eines strahlungsemittierenden Bauelementes und optisches sowie strahlungsemittierendes Bauelement
DE102006016548B9 (de) 2005-04-15 2021-12-16 Osram Gmbh Blau bis Gelb-Orange emittierender Leuchtstoff und Lichtquelle mit derartigem Leuchtstoff
US7489073B2 (en) 2005-04-15 2009-02-10 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Blue to yellow-orange emitting phosphor, and light source having such a phosphor
DE102005036520A1 (de) * 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
US7350933B2 (en) * 2005-05-23 2008-04-01 Avago Technologies Ecbu Ip Pte Ltd Phosphor converted light source
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
JP2007053170A (ja) * 2005-08-16 2007-03-01 Toshiba Corp 発光装置
DE102005041064B4 (de) 2005-08-30 2023-01-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zu dessen Herstellung
DE102005059521A1 (de) 2005-12-13 2007-06-14 Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH Rot emittierender Leuchtstoff und Lichtquelle mit einem derartigen Leuchtstoff
KR20080106402A (ko) 2006-01-05 2008-12-05 일루미텍스, 인크. Ｌｅｄ로부터 광을 유도하기 위한 개별 광학 디바이스
US7675145B2 (en) * 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
US8969908B2 (en) 2006-04-04 2015-03-03 Cree, Inc. Uniform emission LED package
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
CN101553928B (zh) 2006-10-02 2011-06-01 伊鲁米特克有限公司 Led系统和方法
US10295147B2 (en) 2006-11-09 2019-05-21 Cree, Inc. LED array and method for fabricating same
WO2008073400A1 (en) 2006-12-11 2008-06-19 The Regents Of The University Of California Transparent light emitting diodes
US7968900B2 (en) * 2007-01-19 2011-06-28 Cree, Inc. High performance LED package
US9024349B2 (en) 2007-01-22 2015-05-05 Cree, Inc. Wafer level phosphor coating method and devices fabricated utilizing method
US9711703B2 (en) 2007-02-12 2017-07-18 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
US7510400B2 (en) * 2007-03-14 2009-03-31 Visteon Global Technologies, Inc. LED interconnect spring clip assembly
US7621752B2 (en) * 2007-07-17 2009-11-24 Visteon Global Technologies, Inc. LED interconnection integrated connector holder package
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
US7993940B2 (en) * 2007-12-05 2011-08-09 Luminus Devices, Inc. Component attach methods and related device structures
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
WO2009100358A1 (en) 2008-02-08 2009-08-13 Illumitex, Inc. System and method for emitter layer shaping
US8637883B2 (en) 2008-03-19 2014-01-28 Cree, Inc. Low index spacer layer in LED devices
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
DE102008052751A1 (de) 2008-10-22 2010-04-29 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines Lumineszenzkonversionselements, Lumineszenzkonversionselement und optoelektronisches Bauteil
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
KR20100087851A (ko) * 2009-01-29 2010-08-06 삼성전자주식회사 발광 유닛, 이의 제조 방법 및 발광 유닛을 포함하는 광원 장치
TW201034256A (en) 2008-12-11 2010-09-16 Illumitex Inc Systems and methods for packaging light-emitting diode devices
US20110037083A1 (en) * 2009-01-14 2011-02-17 Alex Chi Keung Chan Led package with contrasting face
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
US8449128B2 (en) 2009-08-20 2013-05-28 Illumitex, Inc. System and method for a lens and phosphor layer
US8585253B2 (en) 2009-08-20 2013-11-19 Illumitex, Inc. System and method for color mixing lens array
US20110101062A1 (en) * 2009-11-04 2011-05-05 Benjamin Franklin Roberts Pouch and pouches to carry personal items and lights on a belt
DE102009058796A1 (de) 2009-12-18 2011-06-22 OSRAM Opto Semiconductors GmbH, 93055 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
US9166126B2 (en) 2011-01-31 2015-10-20 Cree, Inc. Conformally coated light emitting devices and methods for providing the same
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
US9653656B2 (en) 2012-03-16 2017-05-16 Advanced Semiconductor Engineering, Inc. LED packages and related methods
US8637887B2 (en) 2012-05-08 2014-01-28 Advanced Semiconductor Engineering, Inc. Thermally enhanced semiconductor packages and related methods
DE102012106984A1 (de) * 2012-07-31 2014-02-06 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE102012109754A1 (de) * 2012-10-12 2014-04-17 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement und Verfahren zum Herstellen eines optoelektronischen Halbleiterbauelements
US9059379B2 (en) 2012-10-29 2015-06-16 Advanced Semiconductor Engineering, Inc. Light-emitting semiconductor packages and related methods
US9618191B2 (en) 2013-03-07 2017-04-11 Advanced Semiconductor Engineering, Inc. Light emitting package and LED bulb
US9431319B2 (en) * 2014-08-01 2016-08-30 Linear Technology Corporation Exposed, solderable heat spreader for integrated circuit packages
DE102016104790A1 (de) 2016-03-15 2017-09-21 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Materialien für die LED-Verkapselung
CN108540086A (zh) * 2018-01-18 2018-09-14 浙江人和光伏科技有限公司 一种太阳能电池接线盒的导电模块
CN111430343A (zh) * 2020-03-31 2020-07-17 深圳市唯亮光电科技有限公司 一种垂直式集成封装组件及其封装方法
US11592166B2 (en) 2020-05-12 2023-02-28 Feit Electric Company, Inc. Light emitting device having improved illumination and manufacturing flexibility
US11876042B2 (en) 2020-08-03 2024-01-16 Feit Electric Company, Inc. Omnidirectional flexible light emitting device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596839A (ja) * 1982-07-05 1984-01-13 Fuji Oil Co Ltd 大豆乳製品の製造法
JPH05183075A (ja) * 1991-12-27 1993-07-23 Nitto Denko Corp 光半導体装置
JPH0697349A (ja) * 1992-09-14 1994-04-08 Sony Corp 樹脂封止型半導体装置とその製造方法
JPH11209579A (ja) * 1998-01-26 1999-08-03 Matsushita Electric Works Ltd 封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3935501A (en) * 1975-02-13 1976-01-27 Digital Components Corporation Micro-miniature light source assemblage and mounting means therefor
GB1557685A (en) * 1976-02-02 1979-12-12 Fairchild Camera Instr Co Optically coupled isolator device
US4412135A (en) * 1979-03-23 1983-10-25 Sharp Kabushiki Kaisha Photo coupler device molding including filler particles
US4287105A (en) * 1980-01-14 1981-09-01 Plaskon Products, Inc. Flash resistant epoxy encapsulating composition and process for preparing same
US4334035A (en) * 1981-03-19 1982-06-08 Mitsubishi Petrochemical Co., Ltd. Unsaturated polyester resin composition
JPS596839U (ja) * 1982-07-07 1984-01-17 日本電気株式会社 半導体装置
JPS60101141A (ja) * 1983-11-07 1985-06-05 Mitsubishi Electric Corp エポキシ樹脂用着色剤
JPS6195581A (ja) * 1984-10-16 1986-05-14 Toshiba Corp 光結合素子
DE3804392A1 (de) * 1988-02-12 1989-08-24 Basf Ag Fuellstoffhaltige polyamid-formmassen mit verbesserter oberflaeche und lackierbarkeit
DE3804293A1 (de) 1988-02-12 1989-08-24 Philips Patentverwaltung Anordnung mit einer elektrolumineszenz- oder laserdiode
JPH02169619A (ja) * 1988-12-23 1990-06-29 Toshiba Corp 封止用エポキシ樹脂組成物及びこれを用いてなる光半導体素子
US5137940A (en) * 1989-02-09 1992-08-11 Shin-Etsu Chemical Co., Ltd. Semiconductor encapsulating epoxy resin compositions
JPH0537008A (ja) * 1991-07-29 1993-02-12 Sharp Corp 光結合装置
US5436492A (en) * 1992-06-23 1995-07-25 Sony Corporation Charge-coupled device image sensor
EP0646971B1 (de) 1993-09-30 1997-03-12 Siemens Aktiengesellschaft Zweipoliges SMT-Miniatur-Gehäuse für Halbleiterbauelemente und Verfahren zu dessen Herstellung
JPH07309927A (ja) * 1994-05-17 1995-11-28 Nitto Denko Corp 光半導体装置
EP0716102B1 (en) * 1994-06-24 2002-02-06 Seiko Epson Corporation Transparent plastic material, optical article made therefrom, and production process
JPH08222757A (ja) * 1995-02-14 1996-08-30 Sharp Corp 光結合素子
JPH0983013A (ja) * 1995-09-14 1997-03-28 Sharp Corp 光結合装置及びその製造方法
DE19604492C1 (de) * 1996-02-08 1997-06-12 Wustlich Hans Dieter Spritzgießwerkzeug zur Herstellung von Leuchtdioden
US5803579A (en) * 1996-06-13 1998-09-08 Gentex Corporation Illuminator assembly incorporating light emitting diodes
BR9709998B1 (pt) 1996-06-26 2010-04-20 elemento de construção semicondutor, irradiador de luz, com elemento de conversão de luminescência
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
US5777433A (en) * 1996-07-11 1998-07-07 Hewlett-Packard Company High refractive index package material and a light emitting device encapsulated with such material
US5813753A (en) * 1997-05-27 1998-09-29 Philips Electronics North America Corporation UV/blue led-phosphor device with efficient conversion of UV/blues light to visible light
FR2765517B1 (fr) * 1997-07-04 1999-08-27 Oreal Article en matiere plastique, procede de fabrication et composition de moulage
JPH11163419A (ja) * 1997-11-26 1999-06-18 Rohm Co Ltd 発光装置
DE29901093U1 (de) * 1999-01-22 1999-04-08 Chu Mao Precision Industry Co., Ltd., Shen Kang Hsiang, Taichung Fotoabtastelement-Leuchtdiode für SMD

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS596839A (ja) * 1982-07-05 1984-01-13 Fuji Oil Co Ltd 大豆乳製品の製造法
JPH05183075A (ja) * 1991-12-27 1993-07-23 Nitto Denko Corp 光半導体装置
JPH0697349A (ja) * 1992-09-14 1994-04-08 Sony Corp 樹脂封止型半導体装置とその製造方法
JPH11209579A (ja) * 1998-01-26 1999-08-03 Matsushita Electric Works Ltd 封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006134992A (ja) * 2004-11-04 2006-05-25 Hitachi Displays Ltd 光源ユニット、それを用いた照明装置及びそれを用いた表示装置
JP2006339653A (ja) * 2005-06-03 2006-12-14 Samsung Electro-Mechanics Co Ltd 高出力ｌｅｄパッケージおよび高出力ｌｅｄパッケージ製造方法
US7875476B2 (en) 2005-06-03 2011-01-25 Samsung Led Co., Ltd. High power LED package and fabrication method thereof
KR101456266B1 (ko) * 2006-12-08 2014-11-04 서울반도체 주식회사 발광소자
EP2081227A2 (en) 2008-01-18 2009-07-22 Sanyo Electric Co., Ltd. Light-emitting device and lighting apparatus incorporating same
US8400051B2 (en) 2008-01-18 2013-03-19 Sanyo Electric Co., Ltd. Light-emitting device and lighting apparatus incorporating same

Also Published As

Publication number Publication date
DE19963806C2 (de) 2002-02-07
EP1243031B9 (de) 2017-07-26
DE19964252A1 (de) 2002-06-06
JP2012009902A (ja) 2012-01-12
US20020195935A1 (en) 2002-12-26
EP1243031A1 (de) 2002-09-25
DE19963806A1 (de) 2001-07-19
US7098588B2 (en) 2006-08-29
CN1421048A (zh) 2003-05-28
CN100375299C (zh) 2008-03-12
EP1243031B1 (de) 2017-03-08
US20060244000A1 (en) 2006-11-02
WO2001050540A1 (de) 2001-07-12
US7534634B2 (en) 2009-05-19

Similar Documents

Publication Publication Date Title
JP2003519929A (ja) 表面に取り付け可能な発光ダイオード光源および発光ダイオード光源を製造する方法
CN101420006B (zh) 用于制造一种辐射的、可表面安装的构件的方法
JP3866091B2 (ja) 波長変換注型材料及び発光素子
CN100433386C (zh) 半导体发光器件
US20040094757A1 (en) Light emitting diode with wavelength conversion
KR100767604B1 (ko) 발광 다이오드 소자 및 그 제조방법
JPH11233831A (ja) 発光ダイオード及びその形成方法
KR100821684B1 (ko) 백색 발광 다이오드 소자
KR20040089979A (ko) 백색 발광소자의 제조 방법
KR100712877B1 (ko) 새로운 몰딩 컴파운드에 의한 백색 발광소자의 제조방법
TWI467814B (zh) 螢光粉膠體製備方法及相應的發光二極體封裝方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20071226

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20101124

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20101203

RD04 Notification of resignation of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7424

Effective date: 20101228

A524 Written submission of copy of amendment under article 19 pct

Free format text: JAPANESE INTERMEDIATE CODE: A524

Effective date: 20110303

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20110609

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111011

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20111014

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20111104