JP2003504218A5 - - Google Patents

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Publication number
JP2003504218A5
JP2003504218A5 JP2001509433A JP2001509433A JP2003504218A5 JP 2003504218 A5 JP2003504218 A5 JP 2003504218A5 JP 2001509433 A JP2001509433 A JP 2001509433A JP 2001509433 A JP2001509433 A JP 2001509433A JP 2003504218 A5 JP2003504218 A5 JP 2003504218A5
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JP
Japan
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JP2001509433A
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Japanese (ja)
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JP2003504218A (ja
JP4582980B2 (ja
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Priority claimed from US09/350,580 external-priority patent/US6319108B1/en
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Publication of JP4582980B2 publication Critical patent/JP4582980B2/ja
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JP2001509433A 1999-07-09 2000-07-06 多孔性セラミック研磨複合材料を含むメタルボンド研磨物品およびそれを用いたワークピースの研磨方法 Expired - Fee Related JP4582980B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/350,580 1999-07-09
US09/350,580 US6319108B1 (en) 1999-07-09 1999-07-09 Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece
PCT/US2000/018522 WO2001004227A2 (en) 1999-07-09 2000-07-06 Metal bond abrasive article comprising porous ceramic abrasive composites and method of using same to abrade a workpiece

Publications (3)

Publication Number Publication Date
JP2003504218A JP2003504218A (ja) 2003-02-04
JP2003504218A5 true JP2003504218A5 (enExample) 2010-08-12
JP4582980B2 JP4582980B2 (ja) 2010-11-17

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ID=23377342

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JP2001509433A Expired - Fee Related JP4582980B2 (ja) 1999-07-09 2000-07-06 多孔性セラミック研磨複合材料を含むメタルボンド研磨物品およびそれを用いたワークピースの研磨方法

Country Status (8)

Country Link
US (1) US6319108B1 (enExample)
EP (1) EP1198529A2 (enExample)
JP (1) JP4582980B2 (enExample)
KR (1) KR20020029075A (enExample)
CN (1) CN1359322A (enExample)
AU (1) AU5917400A (enExample)
TW (1) TW533229B (enExample)
WO (1) WO2001004227A2 (enExample)

Families Citing this family (240)

* Cited by examiner, † Cited by third party
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