JP2000349025A5 - - Google Patents
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- Publication number
- JP2000349025A5 JP2000349025A5 JP2000083162A JP2000083162A JP2000349025A5 JP 2000349025 A5 JP2000349025 A5 JP 2000349025A5 JP 2000083162 A JP2000083162 A JP 2000083162A JP 2000083162 A JP2000083162 A JP 2000083162A JP 2000349025 A5 JP2000349025 A5 JP 2000349025A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000083162A JP2000349025A (ja) | 1999-03-26 | 2000-03-24 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8486599 | 1999-03-26 | ||
| JP11-84865 | 1999-03-26 | ||
| JP2000083162A JP2000349025A (ja) | 1999-03-26 | 2000-03-24 | 半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000349025A JP2000349025A (ja) | 2000-12-15 |
| JP2000349025A5 true JP2000349025A5 (enExample) | 2007-04-26 |
Family
ID=26425841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000083162A Withdrawn JP2000349025A (ja) | 1999-03-26 | 2000-03-24 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000349025A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7151017B2 (en) | 2001-01-26 | 2006-12-19 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP4877897B2 (ja) * | 2004-07-21 | 2012-02-15 | シルトロニック・ジャパン株式会社 | シリコンウェハの不純物の除去方法及び分析方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2852853B2 (ja) * | 1993-07-27 | 1999-02-03 | 株式会社半導体エネルギー研究所 | 半導体装置の製造方法 |
| JP2649325B2 (ja) * | 1993-07-30 | 1997-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3575644B2 (ja) * | 1995-08-28 | 2004-10-13 | 三菱住友シリコン株式会社 | シリコンウェーハの製造方法 |
| JP3729955B2 (ja) * | 1996-01-19 | 2005-12-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3809503B2 (ja) * | 1997-02-28 | 2006-08-16 | 野村マイクロ・サイエンス株式会社 | 半導体基板内部の洗浄方法および洗浄装置 |
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2000
- 2000-03-24 JP JP2000083162A patent/JP2000349025A/ja not_active Withdrawn