JP2000349025A - 半導体装置の作製方法 - Google Patents
半導体装置の作製方法Info
- Publication number
- JP2000349025A JP2000349025A JP2000083162A JP2000083162A JP2000349025A JP 2000349025 A JP2000349025 A JP 2000349025A JP 2000083162 A JP2000083162 A JP 2000083162A JP 2000083162 A JP2000083162 A JP 2000083162A JP 2000349025 A JP2000349025 A JP 2000349025A
- Authority
- JP
- Japan
- Prior art keywords
- film
- circuit
- region
- semiconductor film
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Recrystallisation Techniques (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000083162A JP2000349025A (ja) | 1999-03-26 | 2000-03-24 | 半導体装置の作製方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-84865 | 1999-03-26 | ||
| JP8486599 | 1999-03-26 | ||
| JP2000083162A JP2000349025A (ja) | 1999-03-26 | 2000-03-24 | 半導体装置の作製方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000349025A true JP2000349025A (ja) | 2000-12-15 |
| JP2000349025A5 JP2000349025A5 (enExample) | 2007-04-26 |
Family
ID=26425841
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000083162A Withdrawn JP2000349025A (ja) | 1999-03-26 | 2000-03-24 | 半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000349025A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006032859A (ja) * | 2004-07-21 | 2006-02-02 | Siltronic Japan Corp | シリコンウェハの不純物の除去方法及び分析方法 |
| US7361577B2 (en) | 2001-01-26 | 2008-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745519A (ja) * | 1993-07-27 | 1995-02-14 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその製造方法 |
| JPH0794757A (ja) * | 1993-07-30 | 1995-04-07 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JPH0964052A (ja) * | 1995-08-28 | 1997-03-07 | Mitsubishi Materials Shilicon Corp | シリコンウェーハおよびその製造方法 |
| JPH09312260A (ja) * | 1996-01-19 | 1997-12-02 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JPH10242099A (ja) * | 1997-02-28 | 1998-09-11 | Pure Retsukusu:Kk | 半導体基板内部の洗浄方法および洗浄装置 |
-
2000
- 2000-03-24 JP JP2000083162A patent/JP2000349025A/ja not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0745519A (ja) * | 1993-07-27 | 1995-02-14 | Semiconductor Energy Lab Co Ltd | 半導体装置およびその製造方法 |
| JPH0794757A (ja) * | 1993-07-30 | 1995-04-07 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JPH0964052A (ja) * | 1995-08-28 | 1997-03-07 | Mitsubishi Materials Shilicon Corp | シリコンウェーハおよびその製造方法 |
| JPH09312260A (ja) * | 1996-01-19 | 1997-12-02 | Semiconductor Energy Lab Co Ltd | 半導体装置及びその作製方法 |
| JPH10242099A (ja) * | 1997-02-28 | 1998-09-11 | Pure Retsukusu:Kk | 半導体基板内部の洗浄方法および洗浄装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7361577B2 (en) | 2001-01-26 | 2008-04-22 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing semiconductor device |
| JP2006032859A (ja) * | 2004-07-21 | 2006-02-02 | Siltronic Japan Corp | シリコンウェハの不純物の除去方法及び分析方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070301 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070301 |
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| A977 | Report on retrieval |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20100105 |
|
| A761 | Written withdrawal of application |
Free format text: JAPANESE INTERMEDIATE CODE: A761 Effective date: 20100215 |