JP2003502866A5 - - Google Patents

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Publication number
JP2003502866A5
JP2003502866A5 JP2001505058A JP2001505058A JP2003502866A5 JP 2003502866 A5 JP2003502866 A5 JP 2003502866A5 JP 2001505058 A JP2001505058 A JP 2001505058A JP 2001505058 A JP2001505058 A JP 2001505058A JP 2003502866 A5 JP2003502866 A5 JP 2003502866A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001505058A
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Japanese (ja)
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JP2003502866A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/DE2000/001123 external-priority patent/WO2000079589A1/de
Publication of JP2003502866A publication Critical patent/JP2003502866A/ja
Publication of JP2003502866A5 publication Critical patent/JP2003502866A5/ja
Pending legal-status Critical Current

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JP2001505058A 1999-06-17 2000-04-11 軟質ボンディング部を有する電子部品およびこのような部品を製造するための方法 Pending JP2003502866A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19927750.8 1999-06-17
DE19927750 1999-06-17
PCT/DE2000/001123 WO2000079589A1 (de) 1999-06-17 2000-04-11 Elektronisches bauelement mit flexiblen kontaktierungsstellen und verfahren zum herstellen eines derartigen bauelements

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2005339301A Division JP4226589B2 (ja) 1999-06-17 2005-11-24 軟質ボンディング部を有する電子部品およびこのような部品を製造するための方法

Publications (2)

Publication Number Publication Date
JP2003502866A JP2003502866A (ja) 2003-01-21
JP2003502866A5 true JP2003502866A5 (enExample) 2006-02-09

Family

ID=7911618

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2001505058A Pending JP2003502866A (ja) 1999-06-17 2000-04-11 軟質ボンディング部を有する電子部品およびこのような部品を製造するための方法
JP2005339301A Expired - Fee Related JP4226589B2 (ja) 1999-06-17 2005-11-24 軟質ボンディング部を有する電子部品およびこのような部品を製造するための方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2005339301A Expired - Fee Related JP4226589B2 (ja) 1999-06-17 2005-11-24 軟質ボンディング部を有する電子部品およびこのような部品を製造するための方法

Country Status (5)

Country Link
US (2) US6956287B2 (enExample)
EP (1) EP1186035A1 (enExample)
JP (2) JP2003502866A (enExample)
KR (1) KR20020011440A (enExample)
WO (1) WO2000079589A1 (enExample)

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US7749886B2 (en) * 2006-12-20 2010-07-06 Tessera, Inc. Microelectronic assemblies having compliancy and methods therefor
TWI381464B (zh) * 2008-08-29 2013-01-01 瀚宇彩晶股份有限公司 The bump structure and its making method
JP5149876B2 (ja) * 2009-07-23 2013-02-20 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
US8912021B2 (en) 2011-09-12 2014-12-16 SemiLEDs Optoelectronics Co., Ltd. System and method for fabricating light emitting diode (LED) dice with wavelength conversion layers
US8410508B1 (en) 2011-09-12 2013-04-02 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) package having wavelength conversion member and wafer level fabrication method
US8841146B2 (en) 2011-09-12 2014-09-23 SemiLEDs Optoelectronics Co., Ltd. Method and system for fabricating light emitting diode (LED) dice with wavelength conversion layers having controlled color characteristics
US8492746B2 (en) 2011-09-12 2013-07-23 SemiLEDs Optoelectronics Co., Ltd. Light emitting diode (LED) dice having wavelength conversion layers
US9074070B2 (en) 2011-10-31 2015-07-07 Ticona Llc Thermoplastic composition for use in forming a laser direct structured substrate
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