JP2003243302A5 - - Google Patents

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Publication number
JP2003243302A5
JP2003243302A5 JP2002038841A JP2002038841A JP2003243302A5 JP 2003243302 A5 JP2003243302 A5 JP 2003243302A5 JP 2002038841 A JP2002038841 A JP 2002038841A JP 2002038841 A JP2002038841 A JP 2002038841A JP 2003243302 A5 JP2003243302 A5 JP 2003243302A5
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JP
Japan
Prior art keywords
group iii
nitride semiconductor
iii nitride
semiconductor crystal
producing
Prior art date
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Application number
JP2002038841A
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English (en)
Japanese (ja)
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JP3656606B2 (ja
JP2003243302A (ja
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Priority claimed from JP2002038841A external-priority patent/JP3656606B2/ja
Priority to JP2002038841A priority Critical patent/JP3656606B2/ja
Priority to EP03739657.9A priority patent/EP1474824B1/en
Priority to KR1020067010518A priority patent/KR100692267B1/ko
Priority to AU2003209712A priority patent/AU2003209712A1/en
Priority to CNB038050781A priority patent/CN100338733C/zh
Priority to US10/504,584 priority patent/US8236103B2/en
Priority to KR1020047012652A priority patent/KR100659520B1/ko
Priority to PCT/JP2003/001558 priority patent/WO2003068699A1/en
Priority to TW92103031A priority patent/TWI221638B/zh
Publication of JP2003243302A publication Critical patent/JP2003243302A/ja
Publication of JP2003243302A5 publication Critical patent/JP2003243302A5/ja
Publication of JP3656606B2 publication Critical patent/JP3656606B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2002038841A 2002-02-15 2002-02-15 Iii族窒化物半導体結晶の製造方法 Expired - Lifetime JP3656606B2 (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP2002038841A JP3656606B2 (ja) 2002-02-15 2002-02-15 Iii族窒化物半導体結晶の製造方法
KR1020047012652A KR100659520B1 (ko) 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법
TW92103031A TWI221638B (en) 2002-02-15 2003-02-14 Group III nitride semiconductor crystal, production method thereof and group III nitride semiconductor epitaxial wafer
AU2003209712A AU2003209712A1 (en) 2002-02-15 2003-02-14 Group iii nitride semiconductor crystal, production method thereof and group iii nitride semiconductor epitaxial wafer
CNB038050781A CN100338733C (zh) 2002-02-15 2003-02-14 Ⅲ族氮化物半导体晶体及其制造方法以及ⅲ族氮化物半导体外延晶片
US10/504,584 US8236103B2 (en) 2002-02-15 2003-02-14 Group III nitride semiconductor crystal, production method thereof and group III nitride semiconductor epitaxial wafer
EP03739657.9A EP1474824B1 (en) 2002-02-15 2003-02-14 Production method for group iii nitride semiconductor layer
PCT/JP2003/001558 WO2003068699A1 (en) 2002-02-15 2003-02-14 Group iii nitride semiconductor crystal, production method thereof and group iii nitride semiconductor epitaxial wafer
KR1020067010518A KR100692267B1 (ko) 2002-02-15 2003-02-14 Ⅲ족 질화물 반도체 결정의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002038841A JP3656606B2 (ja) 2002-02-15 2002-02-15 Iii族窒化物半導体結晶の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004301065A Division JP4222287B2 (ja) 2004-10-15 2004-10-15 Iii族窒化物半導体結晶の製造方法

Publications (3)

Publication Number Publication Date
JP2003243302A JP2003243302A (ja) 2003-08-29
JP2003243302A5 true JP2003243302A5 (enExample) 2005-05-19
JP3656606B2 JP3656606B2 (ja) 2005-06-08

Family

ID=27780051

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002038841A Expired - Lifetime JP3656606B2 (ja) 2002-02-15 2002-02-15 Iii族窒化物半導体結晶の製造方法

Country Status (4)

Country Link
JP (1) JP3656606B2 (enExample)
KR (2) KR100659520B1 (enExample)
CN (1) CN100338733C (enExample)
TW (1) TWI221638B (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100524624C (zh) * 2004-01-26 2009-08-05 昭和电工株式会社 Ⅲ族氮化物半导体多层结构
JP2005244202A (ja) * 2004-01-26 2005-09-08 Showa Denko Kk Iii族窒化物半導体積層物
US7935955B2 (en) 2004-01-26 2011-05-03 Showa Denko K.K. Group III nitride semiconductor multilayer structure
WO2005086241A1 (en) 2004-03-04 2005-09-15 Showa Denko K.K. Gallium nitride-based semiconductor device
JP4901115B2 (ja) 2004-03-04 2012-03-21 昭和電工株式会社 窒化ガリウム系半導体素子
WO2005088738A1 (en) 2004-03-12 2005-09-22 Showa Denko K.K. Group iii nitride semiconductor light-emitting device, forming method thereof, lamp and light source using same
US7495261B2 (en) 2004-03-18 2009-02-24 Showa Denko K.K. Group III nitride semiconductor light-emitting device and method of producing the same
US7655491B2 (en) 2004-05-12 2010-02-02 Showa Denko K.K. P-type Group III nitride semiconductor and production method thereof
JP2006229219A (ja) * 2004-05-12 2006-08-31 Showa Denko Kk III族窒化物p型半導体およびその製造方法
JP4833616B2 (ja) 2004-09-13 2011-12-07 昭和電工株式会社 Iii族窒化物半導体の製造方法
US7652299B2 (en) 2005-02-14 2010-01-26 Showa Denko K.K. Nitride semiconductor light-emitting device and method for fabrication thereof
KR100926094B1 (ko) 2005-03-09 2009-11-11 쇼와 덴코 가부시키가이샤 질화물 반도체 발광 소자 및 그 제조 방법
US8076165B2 (en) 2005-04-01 2011-12-13 Sharp Kabushiki Kaisha Method of manufacturing p-type nitride semiconductor and semiconductor device fabricated by the method
JP4432827B2 (ja) 2005-04-26 2010-03-17 住友電気工業株式会社 Iii族窒化物半導体素子およびエピタキシャル基板
US7951617B2 (en) 2005-10-06 2011-05-31 Showa Denko K.K. Group III nitride semiconductor stacked structure and production method thereof
JP2007220745A (ja) * 2006-02-14 2007-08-30 Showa Denko Kk III族窒化物p型半導体の製造方法
JPWO2007129773A1 (ja) 2006-05-10 2009-09-17 昭和電工株式会社 Iii族窒化物化合物半導体積層構造体
JP5250856B2 (ja) 2006-06-13 2013-07-31 豊田合成株式会社 窒化ガリウム系化合物半導体発光素子の製造方法
JP2009123718A (ja) 2007-01-16 2009-06-04 Showa Denko Kk Iii族窒化物化合物半導体素子及びその製造方法、iii族窒化物化合物半導体発光素子及びその製造方法、並びにランプ
JP4993627B2 (ja) * 2009-03-24 2012-08-08 古河機械金属株式会社 Iii族窒化物半導体層の製造方法
CN103460359A (zh) * 2011-04-05 2013-12-18 住友电气工业株式会社 制造氮化物电子设备的方法
JP5948698B2 (ja) * 2012-04-13 2016-07-06 パナソニックIpマネジメント株式会社 紫外発光素子およびその製造方法
JP6442957B2 (ja) * 2014-09-29 2018-12-26 日亜化学工業株式会社 窒化物半導体テンプレートの製造方法
CN107039250B (zh) * 2016-02-03 2018-08-21 中晟光电设备(上海)股份有限公司 一种在蓝宝石衬底上生长氮化镓材料的方法、氮化镓材料及其用途
JP7429522B2 (ja) * 2019-11-22 2024-02-08 住友化学株式会社 Iii族窒化物積層基板および半導体素子
JP7535399B2 (ja) * 2020-07-08 2024-08-16 住友化学株式会社 Iii族窒化物積層物、半導体素子およびiii族窒化物積層物の製造方法

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Publication number Priority date Publication date Assignee Title
US5751752A (en) * 1994-09-14 1998-05-12 Rohm Co., Ltd. Semiconductor light emitting device and manufacturing method therefor
JPH08264886A (ja) * 1995-03-27 1996-10-11 Sumitomo Electric Ind Ltd 半導体レーザ素子およびその製造方法
JP3491492B2 (ja) * 1997-04-09 2004-01-26 松下電器産業株式会社 窒化ガリウム結晶の製造方法
CN1044840C (zh) * 1997-07-24 1999-08-25 北京大学 GaN/Al2O3复合材料在Ⅲ-V族氮化物外延生长中做衬底的方法
JP3615081B2 (ja) * 1999-03-30 2005-01-26 古河電気工業株式会社 GaN単結晶の作製方法
CN1313412A (zh) * 2000-03-10 2001-09-19 广镓光电股份有限公司 在单晶基板上形成第三族氮化物外延层方法、制品及设备
KR100319300B1 (ko) * 2000-03-23 2002-01-04 윤종용 이종접합구조의 양자점 버퍼층을 가지는 반도체 소자
JP3285341B2 (ja) * 2000-06-01 2002-05-27 士郎 酒井 窒化ガリウム系化合物半導体の製造方法

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