JP2003229382A - 切削装置 - Google Patents

切削装置

Info

Publication number
JP2003229382A
JP2003229382A JP2002028100A JP2002028100A JP2003229382A JP 2003229382 A JP2003229382 A JP 2003229382A JP 2002028100 A JP2002028100 A JP 2002028100A JP 2002028100 A JP2002028100 A JP 2002028100A JP 2003229382 A JP2003229382 A JP 2003229382A
Authority
JP
Japan
Prior art keywords
cutting
coordinate value
order
cut
blade
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002028100A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003229382A5 (OSRAM
Inventor
Naoya Tokumitsu
直哉 徳満
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP2002028100A priority Critical patent/JP2003229382A/ja
Publication of JP2003229382A publication Critical patent/JP2003229382A/ja
Publication of JP2003229382A5 publication Critical patent/JP2003229382A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
JP2002028100A 2002-02-05 2002-02-05 切削装置 Pending JP2003229382A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002028100A JP2003229382A (ja) 2002-02-05 2002-02-05 切削装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002028100A JP2003229382A (ja) 2002-02-05 2002-02-05 切削装置

Publications (2)

Publication Number Publication Date
JP2003229382A true JP2003229382A (ja) 2003-08-15
JP2003229382A5 JP2003229382A5 (OSRAM) 2007-05-17

Family

ID=27749423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002028100A Pending JP2003229382A (ja) 2002-02-05 2002-02-05 切削装置

Country Status (1)

Country Link
JP (1) JP2003229382A (OSRAM)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005257A (ja) * 2004-06-18 2006-01-05 Apic Yamada Corp 半導体装置の製造装置
JP2009188296A (ja) * 2008-02-08 2009-08-20 Disco Abrasive Syst Ltd ウエーハの洗浄装置
JP2014172150A (ja) * 2013-03-12 2014-09-22 Disco Abrasive Syst Ltd 切削方法
JP2020136555A (ja) * 2019-02-22 2020-08-31 株式会社ディスコ 加工装置
KR20230018319A (ko) 2021-07-29 2023-02-07 가부시기가이샤 디스코 세정 장치
KR20230120098A (ko) 2022-02-08 2023-08-16 가부시기가이샤 디스코 세정 장치
US12512333B2 (en) 2022-02-08 2025-12-30 Disco Corporation Cleaning apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07156133A (ja) * 1993-12-08 1995-06-20 Yamaha Fine Tec Kk スクライバー
JPH1126402A (ja) * 1997-07-02 1999-01-29 Disco Abrasive Syst Ltd 精密切削装置及び切削方法
JPH1174228A (ja) * 1997-08-28 1999-03-16 Disco Abrasive Syst Ltd 精密切削装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07156133A (ja) * 1993-12-08 1995-06-20 Yamaha Fine Tec Kk スクライバー
JPH1126402A (ja) * 1997-07-02 1999-01-29 Disco Abrasive Syst Ltd 精密切削装置及び切削方法
JPH1174228A (ja) * 1997-08-28 1999-03-16 Disco Abrasive Syst Ltd 精密切削装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006005257A (ja) * 2004-06-18 2006-01-05 Apic Yamada Corp 半導体装置の製造装置
JP2009188296A (ja) * 2008-02-08 2009-08-20 Disco Abrasive Syst Ltd ウエーハの洗浄装置
JP2014172150A (ja) * 2013-03-12 2014-09-22 Disco Abrasive Syst Ltd 切削方法
JP2020136555A (ja) * 2019-02-22 2020-08-31 株式会社ディスコ 加工装置
JP7232077B2 (ja) 2019-02-22 2023-03-02 株式会社ディスコ 加工装置
KR20230018319A (ko) 2021-07-29 2023-02-07 가부시기가이샤 디스코 세정 장치
KR20230120098A (ko) 2022-02-08 2023-08-16 가부시기가이샤 디스코 세정 장치
US12512333B2 (en) 2022-02-08 2025-12-30 Disco Corporation Cleaning apparatus

Similar Documents

Publication Publication Date Title
JP4447074B2 (ja) 切削装置
CN101131921B (zh) 晶片的加工方法
KR101266373B1 (ko) 절삭장치
JP5619559B2 (ja) 加工装置
US7329079B2 (en) Semiconductor wafer processing machine
CN106956370B (zh) 加工装置的搬送机构
JP5389580B2 (ja) 切削装置
JP2003211354A (ja) 切削装置
JP2025037001A (ja) ワーク搬送装置及びワーク加工装置
JP2004303855A (ja) 切削装置
CN113246324A (zh) 切削装置和切削方法
KR20180113165A (ko) 절삭 장치
JP2003229382A (ja) 切削装置
US8289388B2 (en) Alignment method for singulation system
JP4542223B2 (ja) 切削装置
JP2005203540A (ja) ウエーハの切削方法
JP2003173986A (ja) ２スピンドル切削装置における切削方法
KR20180131970A (ko) 부채형 웨이퍼편의 가공 방법
JP7561307B2 (ja) アライメント装置及び方法
CN1931551A (zh) 切削装置和加工方法
JP5872799B2 (ja) レーザー加工装置
JP3222726U (ja) 切削装置
JP4342861B2 (ja) 半導体ウエーハの加工装置
JP5389540B2 (ja) 切削装置
JP4590060B2 (ja) 切削装置

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041102

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20070115

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070323

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070731

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071127