JP2003078220A5 - - Google Patents

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Publication number
JP2003078220A5
JP2003078220A5 JP2002157324A JP2002157324A JP2003078220A5 JP 2003078220 A5 JP2003078220 A5 JP 2003078220A5 JP 2002157324 A JP2002157324 A JP 2002157324A JP 2002157324 A JP2002157324 A JP 2002157324A JP 2003078220 A5 JP2003078220 A5 JP 2003078220A5
Authority
JP
Japan
Prior art keywords
opening
metal frame
land
resin molded
molded substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002157324A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003078220A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002157324A priority Critical patent/JP2003078220A/ja
Priority claimed from JP2002157324A external-priority patent/JP2003078220A/ja
Priority to US10/162,584 priority patent/US20020189850A1/en
Priority to EP02013312A priority patent/EP1272016B1/en
Priority to DE60218936T priority patent/DE60218936T2/de
Publication of JP2003078220A publication Critical patent/JP2003078220A/ja
Publication of JP2003078220A5 publication Critical patent/JP2003078220A5/ja
Pending legal-status Critical Current

Links

JP2002157324A 2001-06-18 2002-05-30 樹脂成形基板 Pending JP2003078220A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002157324A JP2003078220A (ja) 2001-06-18 2002-05-30 樹脂成形基板
US10/162,584 US20020189850A1 (en) 2001-06-18 2002-06-06 Resin-molded board
EP02013312A EP1272016B1 (en) 2001-06-18 2002-06-18 Resin-molded board
DE60218936T DE60218936T2 (de) 2001-06-18 2002-06-18 Harzgegossene Platte

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001183306 2001-06-18
JP2001-183306 2001-06-18
JP2002157324A JP2003078220A (ja) 2001-06-18 2002-05-30 樹脂成形基板

Publications (2)

Publication Number Publication Date
JP2003078220A JP2003078220A (ja) 2003-03-14
JP2003078220A5 true JP2003078220A5 (enExample) 2005-04-21

Family

ID=26617100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002157324A Pending JP2003078220A (ja) 2001-06-18 2002-05-30 樹脂成形基板

Country Status (4)

Country Link
US (1) US20020189850A1 (enExample)
EP (1) EP1272016B1 (enExample)
JP (1) JP2003078220A (enExample)
DE (1) DE60218936T2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299543C (zh) * 2004-02-26 2007-02-07 友达光电股份有限公司 软性电路板
KR101211732B1 (ko) 2006-09-30 2012-12-12 엘지이노텍 주식회사 방열성이 우수한 연성 회로 기판
JP4821592B2 (ja) * 2006-12-08 2011-11-24 日本電気株式会社 枠体の補強構造及び該構造を備えた電子機器
JP5213910B2 (ja) * 2010-06-04 2013-06-19 Ｔｄｋラムダ株式会社 回路基板

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978375A (en) * 1973-04-20 1976-08-31 Matsushita Electric Industrial Co., Ltd. Wiring unit
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
JPS62135474U (enExample) * 1986-02-21 1987-08-26
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
JPH02155288A (ja) * 1988-12-07 1990-06-14 Nippon Avionics Co Ltd プリント配線基板
JPH0319389A (ja) * 1989-06-16 1991-01-28 Fujitsu Ltd プリント回路基板
JPH031598A (ja) * 1989-08-09 1991-01-08 Kyushu Hitachi Maxell Ltd 小型電気機器
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
JPH0758422A (ja) * 1993-08-17 1995-03-03 Hitachi Cable Ltd モールド成形回路基板
JPH07288385A (ja) * 1994-04-19 1995-10-31 Hitachi Chem Co Ltd 多層配線板及びその製造法
JPH0846317A (ja) * 1994-07-26 1996-02-16 Honda Motor Co Ltd 制御基板
JPH08195534A (ja) * 1995-01-13 1996-07-30 Toshiba Corp 回路基板
JPH09290434A (ja) * 1996-04-26 1997-11-11 Hitachi Cable Ltd リードフレームインサート成形部品
JPH11220231A (ja) * 1998-02-02 1999-08-10 Matsushita Electric Ind Co Ltd 樹脂成形基板
DE19817850A1 (de) * 1998-04-24 1999-10-28 Alcatel Sa Baugruppe mit elektronischen Bauelementen
JP2000252613A (ja) * 1999-02-26 2000-09-14 Canon Inc 電子回路基板及びその半田付け方法
US7331502B2 (en) * 2001-03-19 2008-02-19 Sumitomo Bakelite Company, Ltd. Method of manufacturing electronic part and electronic part obtained by the method
JP2003204126A (ja) * 2001-10-25 2003-07-18 Canon Inc 樹脂成形基板および樹脂成形基板ユニット

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