JP2005317753A5 - - Google Patents

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Publication number
JP2005317753A5
JP2005317753A5 JP2004133739A JP2004133739A JP2005317753A5 JP 2005317753 A5 JP2005317753 A5 JP 2005317753A5 JP 2004133739 A JP2004133739 A JP 2004133739A JP 2004133739 A JP2004133739 A JP 2004133739A JP 2005317753 A5 JP2005317753 A5 JP 2005317753A5
Authority
JP
Japan
Prior art keywords
mounting
reference mark
wiring board
printed wiring
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004133739A
Other languages
English (en)
Japanese (ja)
Other versions
JP2005317753A (ja
JP4536416B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004133739A priority Critical patent/JP4536416B2/ja
Priority claimed from JP2004133739A external-priority patent/JP4536416B2/ja
Priority to PCT/JP2005/007851 priority patent/WO2005107343A1/ja
Priority to CNB2005800133267A priority patent/CN100534259C/zh
Publication of JP2005317753A publication Critical patent/JP2005317753A/ja
Publication of JP2005317753A5 publication Critical patent/JP2005317753A5/ja
Application granted granted Critical
Publication of JP4536416B2 publication Critical patent/JP4536416B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2004133739A 2004-04-28 2004-04-28 プリント配線基板及びそのプリント配線基板への部品取付方法 Expired - Fee Related JP4536416B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004133739A JP4536416B2 (ja) 2004-04-28 2004-04-28 プリント配線基板及びそのプリント配線基板への部品取付方法
PCT/JP2005/007851 WO2005107343A1 (ja) 2004-04-28 2005-04-25 プリント配線基板及びそのプリント配線基板への部品取付方法
CNB2005800133267A CN100534259C (zh) 2004-04-28 2005-04-25 印刷布线基板及对该印刷布线基板安装元件的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004133739A JP4536416B2 (ja) 2004-04-28 2004-04-28 プリント配線基板及びそのプリント配線基板への部品取付方法

Publications (3)

Publication Number Publication Date
JP2005317753A JP2005317753A (ja) 2005-11-10
JP2005317753A5 true JP2005317753A5 (enExample) 2007-04-05
JP4536416B2 JP4536416B2 (ja) 2010-09-01

Family

ID=35242082

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004133739A Expired - Fee Related JP4536416B2 (ja) 2004-04-28 2004-04-28 プリント配線基板及びそのプリント配線基板への部品取付方法

Country Status (3)

Country Link
JP (1) JP4536416B2 (enExample)
CN (1) CN100534259C (enExample)
WO (1) WO2005107343A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006057738A1 (de) * 2006-12-07 2008-06-19 Siemens Ag Leiterplattennutzen und Verfahren zur Verarbeitung eines Leiterplattennutzens
DE102006058569A1 (de) * 2006-12-12 2008-06-26 Siemens Ag Leiterplatte und Verfahren zur Verarbeitung einer Leiterplatte eines Leiterplattennutzens
JP6832499B2 (ja) * 2015-02-26 2021-02-24 パナソニックＩｐマネジメント株式会社 テープフィーダ
JP6582677B2 (ja) * 2015-07-24 2019-10-02 富士ゼロックス株式会社 基板装置及び光学装置の製造方法
CN114501799B (zh) * 2020-10-27 2023-05-30 健鼎（无锡）电子有限公司 用于电路板制作工艺的对位方法及复合靶点
JP2025139409A (ja) * 2024-03-12 2025-09-26 サミー株式会社 遊技機

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123564U (enExample) * 1985-01-22 1986-08-04
JPS6217169U (enExample) * 1985-07-17 1987-02-02
JPH0241473U (enExample) * 1988-09-09 1990-03-22
JPH1027950A (ja) * 1996-07-09 1998-01-27 Toppan Printing Co Ltd プリント配線板
JP3767691B2 (ja) * 2002-02-27 2006-04-19 セイコーエプソン株式会社 配線基板及びテープ状配線基板の製造方法
JP4317351B2 (ja) * 2002-08-23 2009-08-19 富士機械製造株式会社 回路基板管理方法および電子回路生産システム

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