CN100534259C - 印刷布线基板及对该印刷布线基板安装元件的方法 - Google Patents

印刷布线基板及对该印刷布线基板安装元件的方法 Download PDF

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Publication number
CN100534259C
CN100534259C CNB2005800133267A CN200580013326A CN100534259C CN 100534259 C CN100534259 C CN 100534259C CN B2005800133267 A CNB2005800133267 A CN B2005800133267A CN 200580013326 A CN200580013326 A CN 200580013326A CN 100534259 C CN100534259 C CN 100534259C
Authority
CN
China
Prior art keywords
installation
mark
mounting
printed wiring
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005800133267A
Other languages
English (en)
Chinese (zh)
Other versions
CN1965617A (zh
Inventor
佐久间阳也
佐久间富雄
宍户浩
佐佐木纯二
林正夫
斋藤昌孝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1965617A publication Critical patent/CN1965617A/zh
Application granted granted Critical
Publication of CN100534259C publication Critical patent/CN100534259C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0456—Mounting of components, e.g. of leadless components simultaneously punching the circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/303—Assembling printed circuits with electric components, e.g. with resistors with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/306—Assembling printed circuits with electric components, e.g. with resistors with lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CNB2005800133267A 2004-04-28 2005-04-25 印刷布线基板及对该印刷布线基板安装元件的方法 Expired - Fee Related CN100534259C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004133739A JP4536416B2 (ja) 2004-04-28 2004-04-28 プリント配線基板及びそのプリント配線基板への部品取付方法
JP133739/2004 2004-04-28

Publications (2)

Publication Number Publication Date
CN1965617A CN1965617A (zh) 2007-05-16
CN100534259C true CN100534259C (zh) 2009-08-26

Family

ID=35242082

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800133267A Expired - Fee Related CN100534259C (zh) 2004-04-28 2005-04-25 印刷布线基板及对该印刷布线基板安装元件的方法

Country Status (3)

Country Link
JP (1) JP4536416B2 (enExample)
CN (1) CN100534259C (enExample)
WO (1) WO2005107343A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006057738A1 (de) * 2006-12-07 2008-06-19 Siemens Ag Leiterplattennutzen und Verfahren zur Verarbeitung eines Leiterplattennutzens
DE102006058569A1 (de) * 2006-12-12 2008-06-26 Siemens Ag Leiterplatte und Verfahren zur Verarbeitung einer Leiterplatte eines Leiterplattennutzens
JP6832499B2 (ja) * 2015-02-26 2021-02-24 パナソニックＩｐマネジメント株式会社 テープフィーダ
JP6582677B2 (ja) * 2015-07-24 2019-10-02 富士ゼロックス株式会社 基板装置及び光学装置の製造方法
CN114501799B (zh) * 2020-10-27 2023-05-30 健鼎（无锡）电子有限公司 用于电路板制作工艺的对位方法及复合靶点
JP2025139409A (ja) * 2024-03-12 2025-09-26 サミー株式会社 遊技機

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1441486A (zh) * 2002-02-27 2003-09-10 精工爱普生株式会社 布线基板及带状布线基板的制造方法
WO2004019670A1 (ja) * 2002-08-23 2004-03-04 Fuji Machine Mfg. Co., Ltd. 回路基板管理方法，タグチップの装着方法および電子回路生産システム

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61123564U (enExample) * 1985-01-22 1986-08-04
JPS6217169U (enExample) * 1985-07-17 1987-02-02
JPH0241473U (enExample) * 1988-09-09 1990-03-22
JPH1027950A (ja) * 1996-07-09 1998-01-27 Toppan Printing Co Ltd プリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1441486A (zh) * 2002-02-27 2003-09-10 精工爱普生株式会社 布线基板及带状布线基板的制造方法
WO2004019670A1 (ja) * 2002-08-23 2004-03-04 Fuji Machine Mfg. Co., Ltd. 回路基板管理方法，タグチップの装着方法および電子回路生産システム

Also Published As

Publication number Publication date
WO2005107343A1 (ja) 2005-11-10
CN1965617A (zh) 2007-05-16
JP2005317753A (ja) 2005-11-10
JP4536416B2 (ja) 2010-09-01

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Granted publication date: 20090826

CF01 Termination of patent right due to non-payment of annual fee