JP2003078220A - 樹脂成形基板 - Google Patents

樹脂成形基板

Info

Publication number
JP2003078220A
JP2003078220A JP2002157324A JP2002157324A JP2003078220A JP 2003078220 A JP2003078220 A JP 2003078220A JP 2002157324 A JP2002157324 A JP 2002157324A JP 2002157324 A JP2002157324 A JP 2002157324A JP 2003078220 A JP2003078220 A JP 2003078220A
Authority
JP
Japan
Prior art keywords
opening
land
resin
metal frame
molded substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002157324A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003078220A5 (enExample
Inventor
Yukio Yokoyama
幸生 横山
Keisuke Someya
恵介 染谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2002157324A priority Critical patent/JP2003078220A/ja
Priority to US10/162,584 priority patent/US20020189850A1/en
Priority to EP02013312A priority patent/EP1272016B1/en
Priority to DE60218936T priority patent/DE60218936T2/de
Publication of JP2003078220A publication Critical patent/JP2003078220A/ja
Publication of JP2003078220A5 publication Critical patent/JP2003078220A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3468—Application of molten solder, e.g. dip soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2002157324A 2001-06-18 2002-05-30 樹脂成形基板 Pending JP2003078220A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2002157324A JP2003078220A (ja) 2001-06-18 2002-05-30 樹脂成形基板
US10/162,584 US20020189850A1 (en) 2001-06-18 2002-06-06 Resin-molded board
EP02013312A EP1272016B1 (en) 2001-06-18 2002-06-18 Resin-molded board
DE60218936T DE60218936T2 (de) 2001-06-18 2002-06-18 Harzgegossene Platte

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001183306 2001-06-18
JP2001-183306 2001-06-18
JP2002157324A JP2003078220A (ja) 2001-06-18 2002-05-30 樹脂成形基板

Publications (2)

Publication Number Publication Date
JP2003078220A true JP2003078220A (ja) 2003-03-14
JP2003078220A5 JP2003078220A5 (enExample) 2005-04-21

Family

ID=26617100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002157324A Pending JP2003078220A (ja) 2001-06-18 2002-05-30 樹脂成形基板

Country Status (4)

Country Link
US (1) US20020189850A1 (enExample)
EP (1) EP1272016B1 (enExample)
JP (1) JP2003078220A (enExample)
DE (1) DE60218936T2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299543C (zh) * 2004-02-26 2007-02-07 友达光电股份有限公司 软性电路板
JP2011258612A (ja) * 2010-06-04 2011-12-22 Tdk-Lambda Corp 回路基板
KR101211732B1 (ko) 2006-09-30 2012-12-12 엘지이노텍 주식회사 방열성이 우수한 연성 회로 기판

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4821592B2 (ja) * 2006-12-08 2011-11-24 日本電気株式会社 枠体の補強構造及び該構造を備えた電子機器

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3978375A (en) * 1973-04-20 1976-08-31 Matsushita Electric Industrial Co., Ltd. Wiring unit
JPS56129394A (en) * 1980-03-14 1981-10-09 Dainippon Screen Mfg Method of producing through hole of printed board
JPS62135474U (enExample) * 1986-02-21 1987-08-26
US4835345A (en) * 1987-09-18 1989-05-30 Compaq Computer Corporation Printed wiring board having robber pads for excess solder
JPH02155288A (ja) * 1988-12-07 1990-06-14 Nippon Avionics Co Ltd プリント配線基板
JPH0319389A (ja) * 1989-06-16 1991-01-28 Fujitsu Ltd プリント回路基板
JPH031598A (ja) * 1989-08-09 1991-01-08 Kyushu Hitachi Maxell Ltd 小型電気機器
US5243143A (en) * 1990-11-13 1993-09-07 Compaq Computer Corporation Solder snap bar
JPH0758422A (ja) * 1993-08-17 1995-03-03 Hitachi Cable Ltd モールド成形回路基板
JPH07288385A (ja) * 1994-04-19 1995-10-31 Hitachi Chem Co Ltd 多層配線板及びその製造法
JPH0846317A (ja) * 1994-07-26 1996-02-16 Honda Motor Co Ltd 制御基板
JPH08195534A (ja) * 1995-01-13 1996-07-30 Toshiba Corp 回路基板
JPH09290434A (ja) * 1996-04-26 1997-11-11 Hitachi Cable Ltd リードフレームインサート成形部品
JPH11220231A (ja) * 1998-02-02 1999-08-10 Matsushita Electric Ind Co Ltd 樹脂成形基板
DE19817850A1 (de) * 1998-04-24 1999-10-28 Alcatel Sa Baugruppe mit elektronischen Bauelementen
JP2000252613A (ja) * 1999-02-26 2000-09-14 Canon Inc 電子回路基板及びその半田付け方法
US7331502B2 (en) * 2001-03-19 2008-02-19 Sumitomo Bakelite Company, Ltd. Method of manufacturing electronic part and electronic part obtained by the method
JP2003204126A (ja) * 2001-10-25 2003-07-18 Canon Inc 樹脂成形基板および樹脂成形基板ユニット

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1299543C (zh) * 2004-02-26 2007-02-07 友达光电股份有限公司 软性电路板
KR101211732B1 (ko) 2006-09-30 2012-12-12 엘지이노텍 주식회사 방열성이 우수한 연성 회로 기판
JP2011258612A (ja) * 2010-06-04 2011-12-22 Tdk-Lambda Corp 回路基板

Also Published As

Publication number Publication date
EP1272016B1 (en) 2007-03-21
US20020189850A1 (en) 2002-12-19
EP1272016A2 (en) 2003-01-02
DE60218936T2 (de) 2007-12-06
EP1272016A3 (en) 2003-10-29
DE60218936D1 (de) 2007-05-03

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