JP2003040976A5 - - Google Patents

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Publication number
JP2003040976A5
JP2003040976A5 JP2002180082A JP2002180082A JP2003040976A5 JP 2003040976 A5 JP2003040976 A5 JP 2003040976A5 JP 2002180082 A JP2002180082 A JP 2002180082A JP 2002180082 A JP2002180082 A JP 2002180082A JP 2003040976 A5 JP2003040976 A5 JP 2003040976A5
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JP
Japan
Prior art keywords
adduct
solvent
initial charge
charge solution
temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002180082A
Other languages
English (en)
Japanese (ja)
Other versions
JP4008768B2 (ja
JP2003040976A (ja
Filing date
Publication date
Priority claimed from US09/887,450 external-priority patent/US6492437B1/en
Application filed filed Critical
Publication of JP2003040976A publication Critical patent/JP2003040976A/ja
Publication of JP2003040976A5 publication Critical patent/JP2003040976A5/ja
Application granted granted Critical
Publication of JP4008768B2 publication Critical patent/JP4008768B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002180082A 2001-06-21 2002-06-20 潜伏性硬化触媒を製造するための溶媒型製法 Expired - Fee Related JP4008768B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/887450 2001-06-21
US09/887,450 US6492437B1 (en) 2001-06-21 2001-06-21 Solvent-based process for manufacturing latent curing catalysts

Publications (3)

Publication Number Publication Date
JP2003040976A JP2003040976A (ja) 2003-02-13
JP2003040976A5 true JP2003040976A5 (https=) 2005-10-13
JP4008768B2 JP4008768B2 (ja) 2007-11-14

Family

ID=25391158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002180082A Expired - Fee Related JP4008768B2 (ja) 2001-06-21 2002-06-20 潜伏性硬化触媒を製造するための溶媒型製法

Country Status (5)

Country Link
US (1) US6492437B1 (https=)
EP (1) EP1270635B1 (https=)
JP (1) JP4008768B2 (https=)
AT (1) ATE302806T1 (https=)
DE (1) DE60205681T2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7485242B2 (en) * 2004-01-23 2009-02-03 Printar Ltd Reactive fine particles
US20060159525A1 (en) * 2005-01-03 2006-07-20 Ramzy Moumneh Grout injecting/structure anchoring system
CN100412264C (zh) * 2005-09-13 2008-08-20 张新华 一种用于干法制造合成革的无毒溶剂
JP5045895B2 (ja) * 2007-04-04 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 エポキシ樹脂用潜在性硬化剤及びその製造方法
JP5045896B2 (ja) * 2007-04-05 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 エポキシ樹脂用潜在性硬化剤及びその製造方法
CN101314704B (zh) * 2007-05-31 2011-09-21 湖南神力实业有限公司 一种用于石材表面修补的双组份环氧树脂胶粘剂及其制备方法
US20090265220A1 (en) * 2008-04-18 2009-10-22 Argela Technologies Intelligent multi-channel targeted telecommunications advertisement campaign manager
BRPI0804908C1 (pt) * 2008-11-18 2012-08-21 Ana Paula Ameruso Abulasan sistema de chamadas telefÈnicas subsidiadas
JP5355113B2 (ja) * 2009-01-29 2013-11-27 株式会社Ａｄｅｋａ 一液型シアン酸エステル−エポキシ複合樹脂組成物
TWI488841B (zh) * 2009-03-27 2015-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition, and an insulating film, a laminate, and a printed wiring board
US9279032B2 (en) * 2010-09-01 2016-03-08 Air Products And Chemicals, Inc. Low temperature curable epoxy compositions
CN102391472B (zh) * 2011-06-24 2013-03-13 焦作市卓立烫印材料有限公司 一种环氧树脂微胶囊潜伏性固化剂及其制备方法
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CN114044883B (zh) * 2021-12-08 2023-10-03 浙江万盛股份有限公司 一种含嘌呤结构的腰果酚醛胺环氧树脂固化剂及其制备方法
WO2026041464A1 (en) 2024-08-19 2026-02-26 Huntsman Advanced Materials (Switzerland) Gmbh Storage-stable epoxy methacrylate

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
NL130328C (https=) 1963-05-02
US4066625A (en) 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
FR1566468A (https=) 1968-03-04 1969-05-09
BE793212A (fr) 1971-12-24 1973-06-22 Ciba Geigy Matieres durcissables a base de resines epoxydiques
US4022946A (en) 1973-10-23 1977-05-10 Pvo International Inc. Method for coating wet surfaces or surfaces immersed in water
US3993707A (en) 1973-10-23 1976-11-23 Pacific Vegetable Oil Corporation Composition for coating wet surfaces or surfaces immersed in water
GB1500206A (en) 1975-10-23 1978-02-08 Ciba Geigy Ag Compositions for curing epoxide resins
DE3162413D1 (en) 1980-05-22 1984-04-05 Shell Int Research Aqueous coating powder suspensions, preparation and use
DE3382736T2 (de) 1982-09-21 1994-05-26 Ajinomoto Kk Latente Härter für Epoxyharze.
GB8403823D0 (en) 1984-02-14 1984-03-21 Raychem Ltd Adhesive composition
US4588617A (en) 1984-09-17 1986-05-13 Toray Industries, Inc. Process for producing cured epoxy resin spherical particles
US4689390A (en) 1985-04-01 1987-08-25 Asahi Denka Kogyo K.K. Curable epoxy resin composition
CA1287427C (en) 1985-09-25 1991-08-06 Koichiro Oka Epoxy type spherical particulate adhesive and process for preparation thereof
US4894403A (en) 1987-07-14 1990-01-16 The Dow Chemical Company Polyisocyanate compositions containing rigid compounds or polymers, and polyurethanes prepared therefrom
US4959398A (en) 1989-02-13 1990-09-25 Toray Industries, Inc. Powdery adhesive and process for preparation thereof
JPH02227470A (ja) 1989-02-28 1990-09-10 Somar Corp エポキシ樹脂紛体塗料組成物
US5357008A (en) 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
US5464910A (en) 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
WO1996020970A1 (en) * 1994-12-29 1996-07-11 Henkel Corporation Aqueous self-dispersible epoxy resin based on epoxy-amine adducts
US5733954A (en) 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole

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