JP4008768B2 - 潜伏性硬化触媒を製造するための溶媒型製法 - Google Patents

潜伏性硬化触媒を製造するための溶媒型製法 Download PDF

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Publication number
JP4008768B2
JP4008768B2 JP2002180082A JP2002180082A JP4008768B2 JP 4008768 B2 JP4008768 B2 JP 4008768B2 JP 2002180082 A JP2002180082 A JP 2002180082A JP 2002180082 A JP2002180082 A JP 2002180082A JP 4008768 B2 JP4008768 B2 JP 4008768B2
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solvent
adduct
solution
initial charge
temperature
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Japanese (ja)
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JP2003040976A (ja
JP2003040976A5 (https=
Inventor
エム．ムーサ オサマ
ジェイ．シプロ マイケル
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ナショナル スターチ アンド ケミカル インベストメント ホールディング コーポレイション
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
    • C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Catalysts (AREA)
JP2002180082A 2001-06-21 2002-06-20 潜伏性硬化触媒を製造するための溶媒型製法 Expired - Fee Related JP4008768B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/887450 2001-06-21
US09/887,450 US6492437B1 (en) 2001-06-21 2001-06-21 Solvent-based process for manufacturing latent curing catalysts

Publications (3)

Publication Number Publication Date
JP2003040976A JP2003040976A (ja) 2003-02-13
JP2003040976A5 JP2003040976A5 (https=) 2005-10-13
JP4008768B2 true JP4008768B2 (ja) 2007-11-14

Family

ID=25391158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002180082A Expired - Fee Related JP4008768B2 (ja) 2001-06-21 2002-06-20 潜伏性硬化触媒を製造するための溶媒型製法

Country Status (5)

Country Link
US (1) US6492437B1 (https=)
EP (1) EP1270635B1 (https=)
JP (1) JP4008768B2 (https=)
AT (1) ATE302806T1 (https=)
DE (1) DE60205681T2 (https=)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7485242B2 (en) * 2004-01-23 2009-02-03 Printar Ltd Reactive fine particles
US20060159525A1 (en) * 2005-01-03 2006-07-20 Ramzy Moumneh Grout injecting/structure anchoring system
CN100412264C (zh) * 2005-09-13 2008-08-20 张新华 一种用于干法制造合成革的无毒溶剂
JP5045895B2 (ja) * 2007-04-04 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 エポキシ樹脂用潜在性硬化剤及びその製造方法
JP5045896B2 (ja) * 2007-04-05 2012-10-10 ソニーケミカル＆インフォメーションデバイス株式会社 エポキシ樹脂用潜在性硬化剤及びその製造方法
CN101314704B (zh) * 2007-05-31 2011-09-21 湖南神力实业有限公司 一种用于石材表面修补的双组份环氧树脂胶粘剂及其制备方法
US20090265220A1 (en) * 2008-04-18 2009-10-22 Argela Technologies Intelligent multi-channel targeted telecommunications advertisement campaign manager
BRPI0804908C1 (pt) * 2008-11-18 2012-08-21 Ana Paula Ameruso Abulasan sistema de chamadas telefÈnicas subsidiadas
JP5355113B2 (ja) * 2009-01-29 2013-11-27 株式会社Ａｄｅｋａ 一液型シアン酸エステル−エポキシ複合樹脂組成物
TWI488841B (zh) * 2009-03-27 2015-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition, and an insulating film, a laminate, and a printed wiring board
US9279032B2 (en) * 2010-09-01 2016-03-08 Air Products And Chemicals, Inc. Low temperature curable epoxy compositions
CN102391472B (zh) * 2011-06-24 2013-03-13 焦作市卓立烫印材料有限公司 一种环氧树脂微胶囊潜伏性固化剂及其制备方法
DE102016203867A1 (de) * 2016-03-09 2017-09-14 Siemens Aktiengesellschaft Fester Isolationswerkstoff, Verwendung dazu und damit hergestelltes Isolationssystem
CN114044883B (zh) * 2021-12-08 2023-10-03 浙江万盛股份有限公司 一种含嘌呤结构的腰果酚醛胺环氧树脂固化剂及其制备方法
WO2026041464A1 (en) 2024-08-19 2026-02-26 Huntsman Advanced Materials (Switzerland) Gmbh Storage-stable epoxy methacrylate

Family Cites Families (20)

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Publication number Priority date Publication date Assignee Title
NL130328C (https=) 1963-05-02
US4066625A (en) 1967-05-02 1978-01-03 Amicon Corporation Unitary curable resin compositions
FR1566468A (https=) 1968-03-04 1969-05-09
BE793212A (fr) 1971-12-24 1973-06-22 Ciba Geigy Matieres durcissables a base de resines epoxydiques
US4022946A (en) 1973-10-23 1977-05-10 Pvo International Inc. Method for coating wet surfaces or surfaces immersed in water
US3993707A (en) 1973-10-23 1976-11-23 Pacific Vegetable Oil Corporation Composition for coating wet surfaces or surfaces immersed in water
GB1500206A (en) 1975-10-23 1978-02-08 Ciba Geigy Ag Compositions for curing epoxide resins
DE3162413D1 (en) 1980-05-22 1984-04-05 Shell Int Research Aqueous coating powder suspensions, preparation and use
DE3382736T2 (de) 1982-09-21 1994-05-26 Ajinomoto Kk Latente Härter für Epoxyharze.
GB8403823D0 (en) 1984-02-14 1984-03-21 Raychem Ltd Adhesive composition
US4588617A (en) 1984-09-17 1986-05-13 Toray Industries, Inc. Process for producing cured epoxy resin spherical particles
US4689390A (en) 1985-04-01 1987-08-25 Asahi Denka Kogyo K.K. Curable epoxy resin composition
CA1287427C (en) 1985-09-25 1991-08-06 Koichiro Oka Epoxy type spherical particulate adhesive and process for preparation thereof
US4894403A (en) 1987-07-14 1990-01-16 The Dow Chemical Company Polyisocyanate compositions containing rigid compounds or polymers, and polyurethanes prepared therefrom
US4959398A (en) 1989-02-13 1990-09-25 Toray Industries, Inc. Powdery adhesive and process for preparation thereof
JPH02227470A (ja) 1989-02-28 1990-09-10 Somar Corp エポキシ樹脂紛体塗料組成物
US5357008A (en) 1992-01-22 1994-10-18 W. R. Grace & Co.-Conn. Latent curing agent for epoxy resin and its preparation
US5464910A (en) 1993-12-22 1995-11-07 Shikoku Chemicals Corporation Epoxy resin adduct combined with a borate ester and phenolic compound
WO1996020970A1 (en) * 1994-12-29 1996-07-11 Henkel Corporation Aqueous self-dispersible epoxy resin based on epoxy-amine adducts
US5733954A (en) 1995-12-14 1998-03-31 Minnesota Mining And Manufacturing Company Epoxy resin curing agent made via aqueous dispersion of an epoxide and an imidazole

Also Published As

Publication number Publication date
US6492437B1 (en) 2002-12-10
EP1270635A1 (en) 2003-01-02
ATE302806T1 (de) 2005-09-15
DE60205681T2 (de) 2006-06-14
JP2003040976A (ja) 2003-02-13
EP1270635B1 (en) 2005-08-24
DE60205681D1 (de) 2005-09-29

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