JP2003031763A5 - - Google Patents

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Publication number
JP2003031763A5
JP2003031763A5 JP2002163925A JP2002163925A JP2003031763A5 JP 2003031763 A5 JP2003031763 A5 JP 2003031763A5 JP 2002163925 A JP2002163925 A JP 2002163925A JP 2002163925 A JP2002163925 A JP 2002163925A JP 2003031763 A5 JP2003031763 A5 JP 2003031763A5
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JP
Japan
Prior art keywords
lsi chip
chip
semiconductor device
wiring substrate
electrodes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002163925A
Other languages
English (en)
Japanese (ja)
Other versions
JP3558070B2 (ja
JP2003031763A (ja
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Publication date
Application filed filed Critical
Priority to JP2002163925A priority Critical patent/JP3558070B2/ja
Priority claimed from JP2002163925A external-priority patent/JP3558070B2/ja
Publication of JP2003031763A publication Critical patent/JP2003031763A/ja
Application granted granted Critical
Publication of JP3558070B2 publication Critical patent/JP3558070B2/ja
Publication of JP2003031763A5 publication Critical patent/JP2003031763A5/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2002163925A 2002-06-05 2002-06-05 半導体装置およびその製造方法 Expired - Fee Related JP3558070B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002163925A JP3558070B2 (ja) 2002-06-05 2002-06-05 半導体装置およびその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002163925A JP3558070B2 (ja) 2002-06-05 2002-06-05 半導体装置およびその製造方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2000271113A Division JP3581086B2 (ja) 2000-09-07 2000-09-07 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004115273A Division JP2004207760A (ja) 2004-04-09 2004-04-09 半導体装置

Publications (3)

Publication Number Publication Date
JP2003031763A JP2003031763A (ja) 2003-01-31
JP3558070B2 JP3558070B2 (ja) 2004-08-25
JP2003031763A5 true JP2003031763A5 (enrdf_load_stackoverflow) 2004-12-16

Family

ID=19195013

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002163925A Expired - Fee Related JP3558070B2 (ja) 2002-06-05 2002-06-05 半導体装置およびその製造方法

Country Status (1)

Country Link
JP (1) JP3558070B2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3718205B2 (ja) * 2003-07-04 2005-11-24 松下電器産業株式会社 チップ積層型半導体装置およびその製造方法
JP4538830B2 (ja) * 2004-03-30 2010-09-08 ルネサスエレクトロニクス株式会社 半導体装置

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