JP2002538435A - 高帯域受動集積回路テスタのプローブカードアセンブリ - Google Patents
高帯域受動集積回路テスタのプローブカードアセンブリInfo
- Publication number
- JP2002538435A JP2002538435A JP2000601449A JP2000601449A JP2002538435A JP 2002538435 A JP2002538435 A JP 2002538435A JP 2000601449 A JP2000601449 A JP 2000601449A JP 2000601449 A JP2000601449 A JP 2000601449A JP 2002538435 A JP2002538435 A JP 2002538435A
- Authority
- JP
- Japan
- Prior art keywords
- signal path
- impedance
- signal
- conductive
- probe card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims abstract description 89
- 230000004044 response Effects 0.000 claims abstract description 50
- 239000004020 conductor Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 10
- 230000005405 multipole Effects 0.000 claims description 8
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 230000001939 inductive effect Effects 0.000 abstract description 4
- 238000012360 testing method Methods 0.000 description 59
- 230000005540 biological transmission Effects 0.000 description 9
- 239000003990 capacitor Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 238000013461 design Methods 0.000 description 4
- 238000013459 approach Methods 0.000 description 3
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000013598 vector Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06766—Input circuits therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/258,186 | 1999-02-25 | ||
| US09/258,186 US6218910B1 (en) | 1999-02-25 | 1999-02-25 | High bandwidth passive integrated circuit tester probe card assembly |
| PCT/US2000/004674 WO2000050905A1 (en) | 1999-02-25 | 2000-02-23 | High bandwidth passive integrated circuit tester probe card assembly |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007043029A Division JP2007178440A (ja) | 1999-02-25 | 2007-02-22 | 高帯域受動集積回路テスタのプローブカードアセンブリ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002538435A true JP2002538435A (ja) | 2002-11-12 |
| JP2002538435A5 JP2002538435A5 (enExample) | 2007-04-19 |
Family
ID=22979472
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000601449A Pending JP2002538435A (ja) | 1999-02-25 | 2000-02-23 | 高帯域受動集積回路テスタのプローブカードアセンブリ |
| JP2007043029A Pending JP2007178440A (ja) | 1999-02-25 | 2007-02-22 | 高帯域受動集積回路テスタのプローブカードアセンブリ |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007043029A Pending JP2007178440A (ja) | 1999-02-25 | 2007-02-22 | 高帯域受動集積回路テスタのプローブカードアセンブリ |
Country Status (8)
| Country | Link |
|---|---|
| US (5) | US6218910B1 (enExample) |
| EP (1) | EP1159624B1 (enExample) |
| JP (2) | JP2002538435A (enExample) |
| KR (3) | KR100757578B1 (enExample) |
| AU (1) | AU3603400A (enExample) |
| DE (1) | DE60007516T2 (enExample) |
| TW (1) | TW514733B (enExample) |
| WO (1) | WO2000050905A1 (enExample) |
Families Citing this family (135)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020053734A1 (en) | 1993-11-16 | 2002-05-09 | Formfactor, Inc. | Probe card assembly and kit, and methods of making same |
| US6232789B1 (en) * | 1997-05-28 | 2001-05-15 | Cascade Microtech, Inc. | Probe holder for low current measurements |
| US5729150A (en) * | 1995-12-01 | 1998-03-17 | Cascade Microtech, Inc. | Low-current probe card with reduced triboelectric current generating cables |
| US5914613A (en) | 1996-08-08 | 1999-06-22 | Cascade Microtech, Inc. | Membrane probing system with local contact scrub |
| US6034533A (en) * | 1997-06-10 | 2000-03-07 | Tervo; Paul A. | Low-current pogo probe card |
| US6256882B1 (en) | 1998-07-14 | 2001-07-10 | Cascade Microtech, Inc. | Membrane probing system |
| US6538538B2 (en) | 1999-02-25 | 2003-03-25 | Formfactor, Inc. | High frequency printed circuit board via |
| US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
| US7247035B2 (en) * | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
| US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
| US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
| US6799976B1 (en) * | 1999-07-28 | 2004-10-05 | Nanonexus, Inc. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
| US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
| US6392428B1 (en) * | 1999-11-16 | 2002-05-21 | Eaglestone Partners I, Llc | Wafer level interposer |
| US6801869B2 (en) * | 2000-02-22 | 2004-10-05 | Mccord Don | Method and system for wafer and device-level testing of an integrated circuit |
| US6838890B2 (en) | 2000-02-25 | 2005-01-04 | Cascade Microtech, Inc. | Membrane probing system |
| US6724209B1 (en) * | 2000-04-13 | 2004-04-20 | Ralph G. Whitten | Method for testing signal paths between an integrated circuit wafer and a wafer tester |
| JP2001296335A (ja) * | 2000-04-14 | 2001-10-26 | Nec Corp | 半導体装置の検査方法及び検査装置 |
| US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| US7579848B2 (en) | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
| US20050068054A1 (en) * | 2000-05-23 | 2005-03-31 | Sammy Mok | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
| US6812048B1 (en) * | 2000-07-31 | 2004-11-02 | Eaglestone Partners I, Llc | Method for manufacturing a wafer-interposer assembly |
| US6537831B1 (en) | 2000-07-31 | 2003-03-25 | Eaglestone Partners I, Llc | Method for selecting components for a matched set using a multi wafer interposer |
| US6970005B2 (en) * | 2000-08-24 | 2005-11-29 | Texas Instruments Incorporated | Multiple-chip probe and universal tester contact assemblage |
| WO2002025296A2 (en) * | 2000-09-22 | 2002-03-28 | Don Mccord | Method and system for wafer and device-level testing of an integrated circuit |
| US6815712B1 (en) | 2000-10-02 | 2004-11-09 | Eaglestone Partners I, Llc | Method for selecting components for a matched set from a wafer-interposer assembly |
| US6686657B1 (en) * | 2000-11-07 | 2004-02-03 | Eaglestone Partners I, Llc | Interposer for improved handling of semiconductor wafers and method of use of same |
| DE20114544U1 (de) | 2000-12-04 | 2002-02-21 | Cascade Microtech, Inc., Beaverton, Oreg. | Wafersonde |
| US6529022B2 (en) * | 2000-12-15 | 2003-03-04 | Eaglestone Pareners I, Llc | Wafer testing interposer for a conventional package |
| US6524885B2 (en) | 2000-12-15 | 2003-02-25 | Eaglestone Partners I, Llc | Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques |
| FR2819678B1 (fr) * | 2001-01-12 | 2003-04-11 | Sagem | Circuit de filtrage, et dispositif d'alimentation de puissance equipe d'un tel circuit de filtrage |
| US6673653B2 (en) | 2001-02-23 | 2004-01-06 | Eaglestone Partners I, Llc | Wafer-interposer using a ceramic substrate |
| CN1288450C (zh) | 2001-07-11 | 2006-12-06 | 佛姆法克特股份有限公司 | 探头和探测卡制造方法 |
| US6729019B2 (en) * | 2001-07-11 | 2004-05-04 | Formfactor, Inc. | Method of manufacturing a probe card |
| JP2003043066A (ja) * | 2001-07-26 | 2003-02-13 | Hoya Corp | コンタクトプローブ部材及びその製造方法 |
| US6570397B2 (en) | 2001-08-07 | 2003-05-27 | Agilent Technologies, Inc. | Timing calibration and timing calibration verification of electronic circuit testers |
| AU2002327490A1 (en) | 2001-08-21 | 2003-06-30 | Cascade Microtech, Inc. | Membrane probing system |
| CN1575350A (zh) * | 2001-08-24 | 2005-02-02 | 纳米纳克斯公司 | 用于在溅射薄膜中产生均匀、各向同性应力的方法和装置 |
| US6714828B2 (en) * | 2001-09-17 | 2004-03-30 | Formfactor, Inc. | Method and system for designing a probe card |
| US6816031B1 (en) | 2001-12-04 | 2004-11-09 | Formfactor, Inc. | Adjustable delay transmission line |
| US20060053625A1 (en) * | 2002-05-07 | 2006-03-16 | Microfabrica Inc. | Microprobe tips and methods for making |
| US20060006888A1 (en) * | 2003-02-04 | 2006-01-12 | Microfabrica Inc. | Electrochemically fabricated microprobes |
| US7363705B2 (en) * | 2003-02-04 | 2008-04-29 | Microfabrica, Inc. | Method of making a contact |
| US7265565B2 (en) | 2003-02-04 | 2007-09-04 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components and methods for making such probes |
| US7412767B2 (en) * | 2003-02-04 | 2008-08-19 | Microfabrica, Inc. | Microprobe tips and methods for making |
| US7640651B2 (en) * | 2003-12-31 | 2010-01-05 | Microfabrica Inc. | Fabrication process for co-fabricating multilayer probe array and a space transformer |
| US20060051948A1 (en) * | 2003-02-04 | 2006-03-09 | Microfabrica Inc. | Microprobe tips and methods for making |
| US20060238209A1 (en) * | 2002-05-07 | 2006-10-26 | Microfabrica Inc. | Vertical microprobes for contacting electronic components and method for making such probes |
| US20050104609A1 (en) * | 2003-02-04 | 2005-05-19 | Microfabrica Inc. | Microprobe tips and methods for making |
| US7531077B2 (en) | 2003-02-04 | 2009-05-12 | Microfabrica Inc. | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
| US7273812B2 (en) * | 2002-05-07 | 2007-09-25 | Microfabrica Inc. | Microprobe tips and methods for making |
| US20050184748A1 (en) * | 2003-02-04 | 2005-08-25 | Microfabrica Inc. | Pin-type probes for contacting electronic circuits and methods for making such probes |
| US6965244B2 (en) * | 2002-05-08 | 2005-11-15 | Formfactor, Inc. | High performance probe system |
| US6911835B2 (en) * | 2002-05-08 | 2005-06-28 | Formfactor, Inc. | High performance probe system |
| US6798225B2 (en) * | 2002-05-08 | 2004-09-28 | Formfactor, Inc. | Tester channel to multiple IC terminals |
| US6784674B2 (en) * | 2002-05-08 | 2004-08-31 | Formfactor, Inc. | Test signal distribution system for IC tester |
| EP1509776A4 (en) | 2002-05-23 | 2010-08-18 | Cascade Microtech Inc | PROBE TO TEST ANY TESTING EQUIPMENT |
| US7102367B2 (en) * | 2002-07-23 | 2006-09-05 | Fujitsu Limited | Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof |
| US6724205B1 (en) | 2002-11-13 | 2004-04-20 | Cascade Microtech, Inc. | Probe for combined signals |
| US6956448B1 (en) | 2002-12-17 | 2005-10-18 | Itt Manufacturing Enterprises, Inc. | Electromagnetic energy probe with integral impedance matching |
| US9244101B2 (en) * | 2003-02-04 | 2016-01-26 | University Of Southern California | Electrochemical fabrication process for forming multilayer multimaterial microprobe structures |
| US7567089B2 (en) * | 2003-02-04 | 2009-07-28 | Microfabrica Inc. | Two-part microprobes for contacting electronic components and methods for making such probes |
| US20080211524A1 (en) * | 2003-02-04 | 2008-09-04 | Microfabrica Inc. | Electrochemically Fabricated Microprobes |
| US10416192B2 (en) | 2003-02-04 | 2019-09-17 | Microfabrica Inc. | Cantilever microprobes for contacting electronic components |
| US8613846B2 (en) * | 2003-02-04 | 2013-12-24 | Microfabrica Inc. | Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
| US20080157793A1 (en) * | 2003-02-04 | 2008-07-03 | Microfabrica Inc. | Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes |
| US9671429B2 (en) | 2003-05-07 | 2017-06-06 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
| US7057404B2 (en) | 2003-05-23 | 2006-06-06 | Sharp Laboratories Of America, Inc. | Shielded probe for testing a device under test |
| NL1023597C2 (nl) * | 2003-06-04 | 2004-12-07 | Tu Delft | Verliescompenserende schakeling. |
| WO2006017078A2 (en) | 2004-07-07 | 2006-02-16 | Cascade Microtech, Inc. | Probe head having a membrane suspended probe |
| US7276895B2 (en) * | 2003-10-03 | 2007-10-02 | Intest Corporation | Adjustable test head docking apparatus |
| DE112004002554T5 (de) | 2003-12-24 | 2006-11-23 | Cascade Microtech, Inc., Beaverton | Active wafer probe |
| US20080108221A1 (en) * | 2003-12-31 | 2008-05-08 | Microfabrica Inc. | Microprobe Tips and Methods for Making |
| US10641792B2 (en) | 2003-12-31 | 2020-05-05 | University Of Southern California | Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties |
| US7388424B2 (en) | 2004-04-07 | 2008-06-17 | Formfactor, Inc. | Apparatus for providing a high frequency loop back with a DC path for a parametric test |
| US10188973B2 (en) | 2004-04-08 | 2019-01-29 | Research Triangle Institute | Apparatus and method using an electric field for creating uniform nanofiber patterns on nonconductive materials to enhance filtration and for embedment of fibers into materials for other applications |
| US7071720B2 (en) * | 2004-06-10 | 2006-07-04 | International Business Machines Corporation | Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit |
| US20060030179A1 (en) * | 2004-08-05 | 2006-02-09 | Palo Alto Research Center, Incorporated | Transmission-line spring structure |
| US6956389B1 (en) * | 2004-08-16 | 2005-10-18 | Jem America Corporation | Highly resilient cantilever spring probe for testing ICs |
| DE202005021435U1 (de) | 2004-09-13 | 2008-02-28 | Cascade Microtech, Inc., Beaverton | Doppelseitige Prüfaufbauten |
| DE102004050615A1 (de) * | 2004-10-18 | 2006-04-27 | Siemens Ag | Vorrichtung zum Prüfen einer Verarbeitungselektronik |
| US7088118B2 (en) * | 2004-12-15 | 2006-08-08 | Chipmos Technologies (Bermuda) Ltd. | Modularized probe card for high frequency probing |
| US7414418B2 (en) * | 2005-01-07 | 2008-08-19 | Formfactor, Inc. | Method and apparatus for increasing operating frequency of a system for testing electronic devices |
| US7535247B2 (en) | 2005-01-31 | 2009-05-19 | Cascade Microtech, Inc. | Interface for testing semiconductors |
| US7656172B2 (en) | 2005-01-31 | 2010-02-02 | Cascade Microtech, Inc. | System for testing semiconductors |
| US7449899B2 (en) | 2005-06-08 | 2008-11-11 | Cascade Microtech, Inc. | Probe for high frequency signals |
| WO2006137979A2 (en) | 2005-06-13 | 2006-12-28 | Cascade Microtech, Inc. | Wideband active-passive differential signal probe |
| CN100424512C (zh) * | 2005-08-25 | 2008-10-08 | 南茂科技股份有限公司 | 模组化高频探测卡 |
| US7498883B2 (en) * | 2005-10-07 | 2009-03-03 | University Of Rochester | Distributed amplifier with built-in filtering functions |
| WO2007142204A1 (ja) * | 2006-06-08 | 2007-12-13 | Nhk Spring Co., Ltd. | プローブカード |
| DE112007001399T5 (de) | 2006-06-09 | 2009-05-07 | Cascade Microtech, Inc., Beaverton | Messfühler für differentielle Signale mit integrierter Symmetrieschaltung |
| US7764072B2 (en) | 2006-06-12 | 2010-07-27 | Cascade Microtech, Inc. | Differential signal probing system |
| US7443186B2 (en) | 2006-06-12 | 2008-10-28 | Cascade Microtech, Inc. | On-wafer test structures for differential signals |
| US7723999B2 (en) | 2006-06-12 | 2010-05-25 | Cascade Microtech, Inc. | Calibration structures for differential signal probing |
| US7403028B2 (en) | 2006-06-12 | 2008-07-22 | Cascade Microtech, Inc. | Test structure and probe for differential signals |
| US7629804B2 (en) * | 2006-08-04 | 2009-12-08 | Vertical Test Inc. | Probe head assembly for use in testing multiple wafer die |
| US7378832B2 (en) * | 2006-08-22 | 2008-05-27 | Lecroy Corporation | Probing high-frequency signals |
| US7659790B2 (en) * | 2006-08-22 | 2010-02-09 | Lecroy Corporation | High speed signal transmission line having reduced thickness regions |
| US20090027071A1 (en) * | 2007-07-23 | 2009-01-29 | Finsar Corporation | Probe tap |
| US7876114B2 (en) | 2007-08-08 | 2011-01-25 | Cascade Microtech, Inc. | Differential waveguide probe |
| KR20090082783A (ko) * | 2008-01-28 | 2009-07-31 | 삼성전자주식회사 | Eds 공정용 프로브 카드 어셈블리 |
| US8056025B1 (en) * | 2008-02-21 | 2011-11-08 | Altera Corporation | Integration of open space/dummy metal at CAD for physical debug of new silicon |
| US8033012B2 (en) * | 2008-03-07 | 2011-10-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method for fabricating a semiconductor test probe card space transformer |
| US7924035B2 (en) * | 2008-07-15 | 2011-04-12 | Formfactor, Inc. | Probe card assembly for electronic device testing with DC test resource sharing |
| US7888957B2 (en) | 2008-10-06 | 2011-02-15 | Cascade Microtech, Inc. | Probing apparatus with impedance optimized interface |
| WO2010048971A1 (en) * | 2008-10-30 | 2010-05-06 | Verigy (Singapore) Pte., Ltd. | Test arrangement, pogo-pin and method for testing a device under test |
| US8410806B2 (en) | 2008-11-21 | 2013-04-02 | Cascade Microtech, Inc. | Replaceable coupon for a probing apparatus |
| US8134380B2 (en) * | 2008-11-26 | 2012-03-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test probe structure |
| JP5228925B2 (ja) * | 2009-01-09 | 2013-07-03 | 三菱電機株式会社 | 高周波用コンタクタ |
| US8098076B2 (en) * | 2009-04-01 | 2012-01-17 | Formfactor, Inc. | Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test |
| JP5800796B2 (ja) | 2009-04-03 | 2015-10-28 | スリーエム イノベイティブ プロパティズ カンパニー | 微生物濃縮方法及び装置 |
| CN102004173B (zh) * | 2009-09-01 | 2014-02-19 | 鸿富锦精密工业(深圳)有限公司 | 探针 |
| US8638114B2 (en) * | 2009-12-08 | 2014-01-28 | Qualcomm Incorporated | Transformer within wafer test probe |
| US20110147568A1 (en) * | 2009-12-18 | 2011-06-23 | Irvine Sensors Corporation | High density array module and connector |
| IT1403475B1 (it) * | 2010-12-20 | 2013-10-17 | St Microelectronics Srl | Struttura di connessione per un circuito integrato con funzione capacitiva |
| JP5492230B2 (ja) * | 2012-01-20 | 2014-05-14 | 株式会社日本マイクロニクス | 検査装置 |
| CN103454571B (zh) * | 2012-05-30 | 2017-10-27 | 富泰华工业(深圳)有限公司 | 测试系统、测试方法以及使用该测试系统的测试设备 |
| US9470753B2 (en) * | 2012-11-07 | 2016-10-18 | Cascade Microtech, Inc. | Systems and methods for testing electronic devices that include low power output drivers |
| WO2014094819A1 (en) * | 2012-12-17 | 2014-06-26 | Advantest (Singapore) Pte. Ltd. | Rf probe |
| US10067163B2 (en) * | 2012-12-26 | 2018-09-04 | Mpi Corporation | Probe card capable of transmitting high-frequency signals |
| TWI471570B (zh) * | 2012-12-26 | 2015-02-01 | Mpi Corp | High frequency probe card |
| GB2511528A (en) | 2013-03-06 | 2014-09-10 | Speciality Fibres And Materials Ltd | Absorbent materials |
| TWI661206B (zh) * | 2018-01-19 | 2019-06-01 | 新加坡商美亞國際電子有限公司 | 測試用電路板 |
| JP7301882B2 (ja) | 2018-06-14 | 2023-07-03 | フォームファクター, インコーポレイテッド | 電気的設計及び機械的設計が互いに分離された電気試験プローブ |
| JP2021534382A (ja) * | 2018-08-06 | 2021-12-09 | テストメトリックス, インコーポレイテッド | 半導体デバイスを試験するための装置および方法 |
| US20220137132A1 (en) * | 2018-08-06 | 2022-05-05 | Testmetrix, Inc. | Apparatus and Method for Testing Semiconductor Devices |
| US11262383B1 (en) | 2018-09-26 | 2022-03-01 | Microfabrica Inc. | Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making |
| US12078657B2 (en) | 2019-12-31 | 2024-09-03 | Microfabrica Inc. | Compliant pin probes with extension springs, methods for making, and methods for using |
| US11573264B2 (en) | 2019-04-10 | 2023-02-07 | Mediatek Inc. | Device for testing chip or die with better system IR drop |
| EP3859359B8 (en) * | 2020-01-28 | 2024-04-10 | Rohde & Schwarz GmbH & Co. KG | Signal analysis method and test system |
| US11215663B2 (en) | 2020-04-28 | 2022-01-04 | Reedholm Systems Corporation | Systems and methods for parametric testing |
| DE112022002039T5 (de) * | 2021-04-08 | 2024-01-18 | Tektronix, Inc. | Präzisions-schaltdämpfungsglied mit hoher bandbreite |
| US11782154B1 (en) | 2021-11-01 | 2023-10-10 | National Technology & Engineering Solutions Of Sandia, Llc | Terrain-aided position determination using range angle radar altimetry |
| EP4533106A1 (en) * | 2022-06-03 | 2025-04-09 | FormFactor, Inc. | Abbreviated loopback attenuation |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62130367A (ja) * | 1985-12-03 | 1987-06-12 | Hitachi Electronics Eng Co Ltd | 電子デバイス駆動回路 |
| JPH0799220A (ja) * | 1993-08-04 | 1995-04-11 | Tokyo Electron Ltd | プローブカード、プローブカード用同軸プローブ針、及びその製造方法 |
| JPH07321168A (ja) * | 1994-05-27 | 1995-12-08 | Tokyo Electron Ltd | プローブカード |
| JPH08139142A (ja) * | 1994-11-09 | 1996-05-31 | Tokyo Electron Ltd | プローブ装置 |
| JPH1019930A (ja) * | 1996-06-28 | 1998-01-23 | Nhk Spring Co Ltd | 導電性接触子 |
| JPH10123215A (ja) * | 1996-10-21 | 1998-05-15 | Toshiba Microelectron Corp | 半導体集積回路 |
| JPH10300778A (ja) * | 1997-04-24 | 1998-11-13 | Kiyandotsukusu Syst:Kk | 高周波デバイスの高周波特性を測定する方法 |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4354268A (en) * | 1980-04-03 | 1982-10-12 | Santek, Inc. | Intelligent test head for automatic test system |
| US4342013A (en) | 1980-08-25 | 1982-07-27 | Pilgrim Electric Co. | Bidirectional power line filter |
| JPS5873881A (ja) | 1981-10-29 | 1983-05-04 | Advantest Corp | Icテスタ |
| US4472725A (en) | 1982-02-01 | 1984-09-18 | Century Iii Electronics Inc. | LC Delay line for feedforward amplifier |
| US4616178A (en) * | 1982-05-27 | 1986-10-07 | Harris Corporation | Pulsed linear integrated circuit tester |
| US4837622A (en) * | 1985-05-10 | 1989-06-06 | Micro-Probe, Inc. | High density probe card |
| US4928062A (en) * | 1988-01-20 | 1990-05-22 | Texas Instruments Incorporated | Loading and accurate measurement of integrated dynamic parameters at point of contact in automatic device handlers |
| US5012213A (en) | 1989-12-19 | 1991-04-30 | Motorola, Inc. | Providing a PGA package with a low reflection line |
| US5090118A (en) * | 1990-07-31 | 1992-02-25 | Texas Instruments Incorporated | High performance test head and method of making |
| JPH04107940A (ja) | 1990-08-29 | 1992-04-09 | Hitachi Ltd | 半導体装置及びその構成部品 |
| US5172051A (en) | 1991-04-24 | 1992-12-15 | Hewlett-Packard Company | Wide bandwidth passive probe |
| US5574382A (en) * | 1991-09-17 | 1996-11-12 | Japan Synthetic Rubber Co., Ltd. | Inspection electrode unit for printed wiring board |
| GB2263980B (en) * | 1992-02-07 | 1996-04-10 | Marconi Gec Ltd | Apparatus and method for testing bare dies |
| US5182220A (en) | 1992-04-02 | 1993-01-26 | United Microelectronics Corporation | CMOS on-chip ESD protection circuit and semiconductor structure |
| US5270673A (en) | 1992-07-24 | 1993-12-14 | Hewlett-Packard Company | Surface mount microcircuit hybrid |
| US5424693A (en) | 1993-01-13 | 1995-06-13 | Industrial Technology Research Institute | Surface mountable microwave IC package |
| US5309019A (en) | 1993-02-26 | 1994-05-03 | Motorola, Inc. | Low inductance lead frame for a semiconductor package |
| US5536906A (en) | 1993-07-23 | 1996-07-16 | Texas Instruments Incorporated | Package for integrated circuits |
| WO1996016440A1 (en) | 1994-11-15 | 1996-05-30 | Formfactor, Inc. | Interconnection elements for microelectronic components |
| US5521406A (en) | 1994-08-31 | 1996-05-28 | Texas Instruments Incorporated | Integrated circuit with improved thermal impedance |
| US5546405A (en) * | 1995-07-17 | 1996-08-13 | Advanced Micro Devices, Inc. | Debug apparatus for an automated semiconductor testing system |
| US5642054A (en) * | 1995-08-08 | 1997-06-24 | Hughes Aircraft Company | Active circuit multi-port membrane probe for full wafer testing |
| US5744869A (en) | 1995-12-05 | 1998-04-28 | Motorola, Inc. | Apparatus for mounting a flip-chip semiconductor device |
| US5917220A (en) | 1996-12-31 | 1999-06-29 | Stmicroelectronics, Inc. | Integrated circuit with improved overvoltage protection |
| US5901022A (en) | 1997-02-24 | 1999-05-04 | Industrial Technology Research Inst. | Charged device mode ESD protection circuit |
| JP2000510653A (ja) | 1997-04-16 | 2000-08-15 | ザ ボード オブ トラスティーズ オブ ザ リーランド スタンフォード ジュニア ユニバーシティ | 高速集積回路のための分散型esd保護デバイス |
| US5869898A (en) | 1997-04-25 | 1999-02-09 | Nec Corporation | Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof |
| WO1998052224A1 (en) | 1997-05-15 | 1998-11-19 | Formfactor, Inc. | Lithographically defined microelectronic contact structures |
| US6008533A (en) | 1997-12-08 | 1999-12-28 | Micron Technology, Inc. | Controlling impedances of an integrated circuit |
| US6208225B1 (en) * | 1999-02-25 | 2001-03-27 | Formfactor, Inc. | Filter structures for integrated circuit interfaces |
| US6448865B1 (en) * | 1999-02-25 | 2002-09-10 | Formfactor, Inc. | Integrated circuit interconnect system |
| US6218910B1 (en) * | 1999-02-25 | 2001-04-17 | Formfactor, Inc. | High bandwidth passive integrated circuit tester probe card assembly |
-
1999
- 1999-02-25 US US09/258,186 patent/US6218910B1/en not_active Expired - Lifetime
-
2000
- 2000-02-22 TW TW089103077A patent/TW514733B/zh not_active IP Right Cessation
- 2000-02-23 AU AU36034/00A patent/AU3603400A/en not_active Abandoned
- 2000-02-23 KR KR1020067019906A patent/KR100757578B1/ko not_active Expired - Fee Related
- 2000-02-23 WO PCT/US2000/004674 patent/WO2000050905A1/en not_active Ceased
- 2000-02-23 EP EP00914677A patent/EP1159624B1/en not_active Expired - Lifetime
- 2000-02-23 DE DE60007516T patent/DE60007516T2/de not_active Expired - Lifetime
- 2000-02-23 KR KR1020017010746A patent/KR100757577B1/ko not_active Expired - Fee Related
- 2000-02-23 KR KR1020077006242A patent/KR100793501B1/ko not_active Expired - Fee Related
- 2000-02-23 JP JP2000601449A patent/JP2002538435A/ja active Pending
-
2001
- 2001-03-13 US US09/805,668 patent/US6501343B2/en not_active Expired - Fee Related
-
2002
- 2002-10-31 US US10/286,062 patent/US6686754B2/en not_active Expired - Fee Related
-
2003
- 2003-12-29 US US10/749,358 patent/US6917210B2/en not_active Expired - Fee Related
-
2005
- 2005-07-12 US US11/180,247 patent/US20110115512A1/en not_active Abandoned
-
2007
- 2007-02-22 JP JP2007043029A patent/JP2007178440A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62130367A (ja) * | 1985-12-03 | 1987-06-12 | Hitachi Electronics Eng Co Ltd | 電子デバイス駆動回路 |
| JPH0799220A (ja) * | 1993-08-04 | 1995-04-11 | Tokyo Electron Ltd | プローブカード、プローブカード用同軸プローブ針、及びその製造方法 |
| JPH07321168A (ja) * | 1994-05-27 | 1995-12-08 | Tokyo Electron Ltd | プローブカード |
| JPH08139142A (ja) * | 1994-11-09 | 1996-05-31 | Tokyo Electron Ltd | プローブ装置 |
| JPH1019930A (ja) * | 1996-06-28 | 1998-01-23 | Nhk Spring Co Ltd | 導電性接触子 |
| JPH10123215A (ja) * | 1996-10-21 | 1998-05-15 | Toshiba Microelectron Corp | 半導体集積回路 |
| JPH10300778A (ja) * | 1997-04-24 | 1998-11-13 | Kiyandotsukusu Syst:Kk | 高周波デバイスの高周波特性を測定する方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US6917210B2 (en) | 2005-07-12 |
| EP1159624B1 (en) | 2004-01-02 |
| US6686754B2 (en) | 2004-02-03 |
| KR20070038181A (ko) | 2007-04-09 |
| US20010035800A1 (en) | 2001-11-01 |
| US6501343B2 (en) | 2002-12-31 |
| TW514733B (en) | 2002-12-21 |
| KR100793501B1 (ko) | 2008-01-14 |
| WO2000050905A1 (en) | 2000-08-31 |
| AU3603400A (en) | 2000-09-14 |
| DE60007516D1 (de) | 2004-02-05 |
| KR100757578B1 (ko) | 2007-09-10 |
| JP2007178440A (ja) | 2007-07-12 |
| US6218910B1 (en) | 2001-04-17 |
| US20040140822A1 (en) | 2004-07-22 |
| US20110115512A1 (en) | 2011-05-19 |
| DE60007516T2 (de) | 2004-09-23 |
| KR20010102357A (ko) | 2001-11-15 |
| KR20060106938A (ko) | 2006-10-12 |
| KR100757577B1 (ko) | 2007-09-10 |
| US20030067316A1 (en) | 2003-04-10 |
| EP1159624A1 (en) | 2001-12-05 |
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