KR100757577B1 - 고대역폭 수동 집적회로 시험기 탐침 카드 조립체 - Google Patents

고대역폭 수동 집적회로 시험기 탐침 카드 조립체 Download PDF

Info

Publication number
KR100757577B1
KR100757577B1 KR1020017010746A KR20017010746A KR100757577B1 KR 100757577 B1 KR100757577 B1 KR 100757577B1 KR 1020017010746 A KR1020017010746 A KR 1020017010746A KR 20017010746 A KR20017010746 A KR 20017010746A KR 100757577 B1 KR100757577 B1 KR 100757577B1
Authority
KR
South Korea
Prior art keywords
impedances
signal path
probe
conductive
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020017010746A
Other languages
English (en)
Korean (ko)
Other versions
KR20010102357A (ko
Inventor
찰스 에이. 밀러
Original Assignee
폼팩터, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인크. filed Critical 폼팩터, 인크.
Publication of KR20010102357A publication Critical patent/KR20010102357A/ko
Application granted granted Critical
Publication of KR100757577B1 publication Critical patent/KR100757577B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06766Input circuits therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06772High frequency probes

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020017010746A 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체 Expired - Fee Related KR100757577B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/258,186 US6218910B1 (en) 1999-02-25 1999-02-25 High bandwidth passive integrated circuit tester probe card assembly
US09/258,186 1999-02-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020067019906A Division KR100757578B1 (ko) 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체

Publications (2)

Publication Number Publication Date
KR20010102357A KR20010102357A (ko) 2001-11-15
KR100757577B1 true KR100757577B1 (ko) 2007-09-10

Family

ID=22979472

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020017010746A Expired - Fee Related KR100757577B1 (ko) 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체
KR1020067019906A Expired - Fee Related KR100757578B1 (ko) 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체
KR1020077006242A Expired - Fee Related KR100793501B1 (ko) 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020067019906A Expired - Fee Related KR100757578B1 (ko) 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체
KR1020077006242A Expired - Fee Related KR100793501B1 (ko) 1999-02-25 2000-02-23 고대역폭 수동 집적회로 시험기 탐침 카드 조립체

Country Status (8)

Country Link
US (5) US6218910B1 (enExample)
EP (1) EP1159624B1 (enExample)
JP (2) JP2002538435A (enExample)
KR (3) KR100757577B1 (enExample)
AU (1) AU3603400A (enExample)
DE (1) DE60007516T2 (enExample)
TW (1) TW514733B (enExample)
WO (1) WO2000050905A1 (enExample)

Families Citing this family (135)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020053734A1 (en) 1993-11-16 2002-05-09 Formfactor, Inc. Probe card assembly and kit, and methods of making same
US6232789B1 (en) * 1997-05-28 2001-05-15 Cascade Microtech, Inc. Probe holder for low current measurements
US5729150A (en) * 1995-12-01 1998-03-17 Cascade Microtech, Inc. Low-current probe card with reduced triboelectric current generating cables
US5914613A (en) 1996-08-08 1999-06-22 Cascade Microtech, Inc. Membrane probing system with local contact scrub
US6034533A (en) * 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6256882B1 (en) 1998-07-14 2001-07-10 Cascade Microtech, Inc. Membrane probing system
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
US6538538B2 (en) 1999-02-25 2003-03-25 Formfactor, Inc. High frequency printed circuit board via
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US6799976B1 (en) * 1999-07-28 2004-10-05 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US7349223B2 (en) 2000-05-23 2008-03-25 Nanonexus, Inc. Enhanced compliant probe card systems having improved planarity
US7247035B2 (en) * 2000-06-20 2007-07-24 Nanonexus, Inc. Enhanced stress metal spring contactor
US6812718B1 (en) 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6578264B1 (en) 1999-06-04 2003-06-17 Cascade Microtech, Inc. Method for constructing a membrane probe using a depression
US6392428B1 (en) * 1999-11-16 2002-05-21 Eaglestone Partners I, Llc Wafer level interposer
WO2001063311A2 (en) * 2000-02-22 2001-08-30 Don Mccord Method and system for wafer and device-level testing of an integrated circuit
US6838890B2 (en) 2000-02-25 2005-01-04 Cascade Microtech, Inc. Membrane probing system
US6724209B1 (en) * 2000-04-13 2004-04-20 Ralph G. Whitten Method for testing signal paths between an integrated circuit wafer and a wafer tester
JP2001296335A (ja) * 2000-04-14 2001-10-26 Nec Corp 半導体装置の検査方法及び検査装置
US20050068054A1 (en) * 2000-05-23 2005-03-31 Sammy Mok Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
US7579848B2 (en) 2000-05-23 2009-08-25 Nanonexus, Inc. High density interconnect system for IC packages and interconnect assemblies
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6537831B1 (en) 2000-07-31 2003-03-25 Eaglestone Partners I, Llc Method for selecting components for a matched set using a multi wafer interposer
US6812048B1 (en) * 2000-07-31 2004-11-02 Eaglestone Partners I, Llc Method for manufacturing a wafer-interposer assembly
US6970005B2 (en) * 2000-08-24 2005-11-29 Texas Instruments Incorporated Multiple-chip probe and universal tester contact assemblage
US6927591B2 (en) * 2000-09-22 2005-08-09 Mccord Don Method and system for wafer and device level testing of an integrated circuit
US6815712B1 (en) 2000-10-02 2004-11-09 Eaglestone Partners I, Llc Method for selecting components for a matched set from a wafer-interposer assembly
US6686657B1 (en) * 2000-11-07 2004-02-03 Eaglestone Partners I, Llc Interposer for improved handling of semiconductor wafers and method of use of same
DE20114544U1 (de) 2000-12-04 2002-02-21 Cascade Microtech, Inc., Beaverton, Oreg. Wafersonde
US6524885B2 (en) 2000-12-15 2003-02-25 Eaglestone Partners I, Llc Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
US6529022B2 (en) * 2000-12-15 2003-03-04 Eaglestone Pareners I, Llc Wafer testing interposer for a conventional package
FR2819678B1 (fr) * 2001-01-12 2003-04-11 Sagem Circuit de filtrage, et dispositif d'alimentation de puissance equipe d'un tel circuit de filtrage
US6673653B2 (en) 2001-02-23 2004-01-06 Eaglestone Partners I, Llc Wafer-interposer using a ceramic substrate
US6729019B2 (en) * 2001-07-11 2004-05-04 Formfactor, Inc. Method of manufacturing a probe card
TW546858B (en) * 2001-07-11 2003-08-11 Formfactor Inc Method of manufacturing a probe card
JP2003043066A (ja) * 2001-07-26 2003-02-13 Hoya Corp コンタクトプローブ部材及びその製造方法
US6570397B2 (en) 2001-08-07 2003-05-27 Agilent Technologies, Inc. Timing calibration and timing calibration verification of electronic circuit testers
AU2002327490A1 (en) 2001-08-21 2003-06-30 Cascade Microtech, Inc. Membrane probing system
JP3794586B2 (ja) * 2001-08-24 2006-07-05 ナノネクサス インク スパッタされた膜において、均一な等方性の応力を生じさせるための方法および装置
US6714828B2 (en) * 2001-09-17 2004-03-30 Formfactor, Inc. Method and system for designing a probe card
US6816031B1 (en) 2001-12-04 2004-11-09 Formfactor, Inc. Adjustable delay transmission line
US20050104609A1 (en) * 2003-02-04 2005-05-19 Microfabrica Inc. Microprobe tips and methods for making
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
US20060006888A1 (en) * 2003-02-04 2006-01-12 Microfabrica Inc. Electrochemically fabricated microprobes
US20060238209A1 (en) * 2002-05-07 2006-10-26 Microfabrica Inc. Vertical microprobes for contacting electronic components and method for making such probes
US7412767B2 (en) * 2003-02-04 2008-08-19 Microfabrica, Inc. Microprobe tips and methods for making
US20060051948A1 (en) * 2003-02-04 2006-03-09 Microfabrica Inc. Microprobe tips and methods for making
US7640651B2 (en) * 2003-12-31 2010-01-05 Microfabrica Inc. Fabrication process for co-fabricating multilayer probe array and a space transformer
US7363705B2 (en) * 2003-02-04 2008-04-29 Microfabrica, Inc. Method of making a contact
US20050184748A1 (en) * 2003-02-04 2005-08-25 Microfabrica Inc. Pin-type probes for contacting electronic circuits and methods for making such probes
US7531077B2 (en) 2003-02-04 2009-05-12 Microfabrica Inc. Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US7273812B2 (en) * 2002-05-07 2007-09-25 Microfabrica Inc. Microprobe tips and methods for making
US20060053625A1 (en) * 2002-05-07 2006-03-16 Microfabrica Inc. Microprobe tips and methods for making
US6784674B2 (en) * 2002-05-08 2004-08-31 Formfactor, Inc. Test signal distribution system for IC tester
US6911835B2 (en) * 2002-05-08 2005-06-28 Formfactor, Inc. High performance probe system
US6965244B2 (en) * 2002-05-08 2005-11-15 Formfactor, Inc. High performance probe system
US6798225B2 (en) * 2002-05-08 2004-09-28 Formfactor, Inc. Tester channel to multiple IC terminals
KR100864916B1 (ko) 2002-05-23 2008-10-22 캐스케이드 마이크로테크 인코포레이티드 피시험 디바이스를 테스트하기 위한 프로브
US7102367B2 (en) * 2002-07-23 2006-09-05 Fujitsu Limited Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof
US6724205B1 (en) 2002-11-13 2004-04-20 Cascade Microtech, Inc. Probe for combined signals
US6956448B1 (en) 2002-12-17 2005-10-18 Itt Manufacturing Enterprises, Inc. Electromagnetic energy probe with integral impedance matching
US7567089B2 (en) * 2003-02-04 2009-07-28 Microfabrica Inc. Two-part microprobes for contacting electronic components and methods for making such probes
US10416192B2 (en) 2003-02-04 2019-09-17 Microfabrica Inc. Cantilever microprobes for contacting electronic components
US20080211524A1 (en) * 2003-02-04 2008-09-04 Microfabrica Inc. Electrochemically Fabricated Microprobes
US8613846B2 (en) * 2003-02-04 2013-12-24 Microfabrica Inc. Multi-layer, multi-material fabrication methods for producing micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US20080106280A1 (en) * 2003-02-04 2008-05-08 Microfabrica Inc. Vertical Microprobes for Contacting Electronic Components and Method for Making Such Probes
US9244101B2 (en) * 2003-02-04 2016-01-26 University Of Southern California Electrochemical fabrication process for forming multilayer multimaterial microprobe structures
US9671429B2 (en) 2003-05-07 2017-06-06 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7057404B2 (en) 2003-05-23 2006-06-06 Sharp Laboratories Of America, Inc. Shielded probe for testing a device under test
NL1023597C2 (nl) * 2003-06-04 2004-12-07 Tu Delft Verliescompenserende schakeling.
US7276895B2 (en) * 2003-10-03 2007-10-02 Intest Corporation Adjustable test head docking apparatus
JP2007517231A (ja) 2003-12-24 2007-06-28 カスケード マイクロテック インコーポレイテッド アクティブ・ウェハプローブ
US20080108221A1 (en) * 2003-12-31 2008-05-08 Microfabrica Inc. Microprobe Tips and Methods for Making
US10641792B2 (en) 2003-12-31 2020-05-05 University Of Southern California Multi-layer, multi-material micro-scale and millimeter-scale devices with enhanced electrical and/or mechanical properties
US7388424B2 (en) * 2004-04-07 2008-06-17 Formfactor, Inc. Apparatus for providing a high frequency loop back with a DC path for a parametric test
US10188973B2 (en) 2004-04-08 2019-01-29 Research Triangle Institute Apparatus and method using an electric field for creating uniform nanofiber patterns on nonconductive materials to enhance filtration and for embedment of fibers into materials for other applications
US7071720B2 (en) * 2004-06-10 2006-07-04 International Business Machines Corporation Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit
KR101157449B1 (ko) 2004-07-07 2012-06-22 캐스케이드 마이크로테크 인코포레이티드 멤브레인 서스펜디드 프로브를 구비한 프로브 헤드
US20060030179A1 (en) * 2004-08-05 2006-02-09 Palo Alto Research Center, Incorporated Transmission-line spring structure
US6956389B1 (en) * 2004-08-16 2005-10-18 Jem America Corporation Highly resilient cantilever spring probe for testing ICs
DE202005021435U1 (de) 2004-09-13 2008-02-28 Cascade Microtech, Inc., Beaverton Doppelseitige Prüfaufbauten
DE102004050615A1 (de) * 2004-10-18 2006-04-27 Siemens Ag Vorrichtung zum Prüfen einer Verarbeitungselektronik
US7088118B2 (en) * 2004-12-15 2006-08-08 Chipmos Technologies (Bermuda) Ltd. Modularized probe card for high frequency probing
US7414418B2 (en) * 2005-01-07 2008-08-19 Formfactor, Inc. Method and apparatus for increasing operating frequency of a system for testing electronic devices
US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7449899B2 (en) 2005-06-08 2008-11-11 Cascade Microtech, Inc. Probe for high frequency signals
JP5080459B2 (ja) 2005-06-13 2012-11-21 カスケード マイクロテック インコーポレイテッド 広帯域能動/受動差動信号プローブ
CN100424512C (zh) * 2005-08-25 2008-10-08 南茂科技股份有限公司 模组化高频探测卡
WO2007044595A2 (en) * 2005-10-07 2007-04-19 University Of Rochester Distributed amplifier with built-in filtering functions
WO2007142204A1 (ja) * 2006-06-08 2007-12-13 Nhk Spring Co., Ltd. プローブカード
DE202007018733U1 (de) 2006-06-09 2009-03-26 Cascade Microtech, Inc., Beaverton Messfühler für differentielle Signale mit integrierter Symmetrieschaltung
US7723999B2 (en) 2006-06-12 2010-05-25 Cascade Microtech, Inc. Calibration structures for differential signal probing
US7443186B2 (en) 2006-06-12 2008-10-28 Cascade Microtech, Inc. On-wafer test structures for differential signals
US7764072B2 (en) 2006-06-12 2010-07-27 Cascade Microtech, Inc. Differential signal probing system
US7403028B2 (en) 2006-06-12 2008-07-22 Cascade Microtech, Inc. Test structure and probe for differential signals
US7629804B2 (en) * 2006-08-04 2009-12-08 Vertical Test Inc. Probe head assembly for use in testing multiple wafer die
US7659790B2 (en) * 2006-08-22 2010-02-09 Lecroy Corporation High speed signal transmission line having reduced thickness regions
US7378832B2 (en) * 2006-08-22 2008-05-27 Lecroy Corporation Probing high-frequency signals
US20090027071A1 (en) * 2007-07-23 2009-01-29 Finsar Corporation Probe tap
US7876114B2 (en) 2007-08-08 2011-01-25 Cascade Microtech, Inc. Differential waveguide probe
KR20090082783A (ko) * 2008-01-28 2009-07-31 삼성전자주식회사 Eds 공정용 프로브 카드 어셈블리
US8056025B1 (en) * 2008-02-21 2011-11-08 Altera Corporation Integration of open space/dummy metal at CAD for physical debug of new silicon
US8033012B2 (en) * 2008-03-07 2011-10-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating a semiconductor test probe card space transformer
US7924035B2 (en) * 2008-07-15 2011-04-12 Formfactor, Inc. Probe card assembly for electronic device testing with DC test resource sharing
US7888957B2 (en) 2008-10-06 2011-02-15 Cascade Microtech, Inc. Probing apparatus with impedance optimized interface
WO2010048971A1 (en) * 2008-10-30 2010-05-06 Verigy (Singapore) Pte., Ltd. Test arrangement, pogo-pin and method for testing a device under test
US8410806B2 (en) 2008-11-21 2013-04-02 Cascade Microtech, Inc. Replaceable coupon for a probing apparatus
US8134380B2 (en) * 2008-11-26 2012-03-13 Taiwan Semiconductor Manufacturing Company, Ltd. Test probe structure
JP5228925B2 (ja) * 2009-01-09 2013-07-03 三菱電機株式会社 高周波用コンタクタ
US8098076B2 (en) * 2009-04-01 2012-01-17 Formfactor, Inc. Method and apparatus for terminating a test signal applied to multiple semiconductor loads under test
JP5800796B2 (ja) 2009-04-03 2015-10-28 スリーエム イノベイティブ プロパティズ カンパニー 微生物濃縮方法及び装置
CN102004173B (zh) * 2009-09-01 2014-02-19 鸿富锦精密工业(深圳)有限公司 探针
US8638114B2 (en) * 2009-12-08 2014-01-28 Qualcomm Incorporated Transformer within wafer test probe
US20110147568A1 (en) * 2009-12-18 2011-06-23 Irvine Sensors Corporation High density array module and connector
IT1403475B1 (it) * 2010-12-20 2013-10-17 St Microelectronics Srl Struttura di connessione per un circuito integrato con funzione capacitiva
JP5492230B2 (ja) * 2012-01-20 2014-05-14 株式会社日本マイクロニクス 検査装置
CN103454571B (zh) * 2012-05-30 2017-10-27 富泰华工业(深圳)有限公司 测试系统、测试方法以及使用该测试系统的测试设备
US9470753B2 (en) * 2012-11-07 2016-10-18 Cascade Microtech, Inc. Systems and methods for testing electronic devices that include low power output drivers
CN104884965B (zh) * 2012-12-17 2017-09-08 爱德万测试公司 Rf探头
US10067163B2 (en) * 2012-12-26 2018-09-04 Mpi Corporation Probe card capable of transmitting high-frequency signals
TWI471570B (zh) * 2012-12-26 2015-02-01 Mpi Corp High frequency probe card
GB2511528A (en) 2013-03-06 2014-09-10 Speciality Fibres And Materials Ltd Absorbent materials
TWI661206B (zh) * 2018-01-19 2019-06-01 新加坡商美亞國際電子有限公司 測試用電路板
JP7301882B2 (ja) 2018-06-14 2023-07-03 フォームファクター, インコーポレイテッド 電気的設計及び機械的設計が互いに分離された電気試験プローブ
US20220137132A1 (en) * 2018-08-06 2022-05-05 Testmetrix, Inc. Apparatus and Method for Testing Semiconductor Devices
CN113196070B (zh) * 2018-08-06 2024-10-25 麦翠斯测试股份有限公司 用于测试半导体装置的设备及方法
US11262383B1 (en) 2018-09-26 2022-03-01 Microfabrica Inc. Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for making
US12078657B2 (en) 2019-12-31 2024-09-03 Microfabrica Inc. Compliant pin probes with extension springs, methods for making, and methods for using
US11573264B2 (en) 2019-04-10 2023-02-07 Mediatek Inc. Device for testing chip or die with better system IR drop
EP3859359B8 (en) * 2020-01-28 2024-04-10 Rohde & Schwarz GmbH & Co. KG Signal analysis method and test system
US11215663B2 (en) * 2020-04-28 2022-01-04 Reedholm Systems Corporation Systems and methods for parametric testing
WO2022217046A1 (en) * 2021-04-08 2022-10-13 Tektronix, Inc. Precision, high bandwidth, switching attenuator
US11782154B1 (en) 2021-11-01 2023-10-10 National Technology & Engineering Solutions Of Sandia, Llc Terrain-aided position determination using range angle radar altimetry
WO2023235623A1 (en) * 2022-06-03 2023-12-07 Formfactor, Inc. Abbreviated loopback attenuation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523312A (en) * 1981-10-29 1985-06-11 Takeda Riken Co., Ltd. IC tester
EP0513992A1 (en) * 1991-04-24 1992-11-19 Hewlett-Packard Company Wide bandwidth passive probe
WO1996015458A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same

Family Cites Families (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4354268A (en) * 1980-04-03 1982-10-12 Santek, Inc. Intelligent test head for automatic test system
US4342013A (en) 1980-08-25 1982-07-27 Pilgrim Electric Co. Bidirectional power line filter
US4472725A (en) 1982-02-01 1984-09-18 Century Iii Electronics Inc. LC Delay line for feedforward amplifier
US4616178A (en) * 1982-05-27 1986-10-07 Harris Corporation Pulsed linear integrated circuit tester
US4837622A (en) * 1985-05-10 1989-06-06 Micro-Probe, Inc. High density probe card
JPS62130367A (ja) * 1985-12-03 1987-06-12 Hitachi Electronics Eng Co Ltd 電子デバイス駆動回路
US4928062A (en) * 1988-01-20 1990-05-22 Texas Instruments Incorporated Loading and accurate measurement of integrated dynamic parameters at point of contact in automatic device handlers
US5012213A (en) 1989-12-19 1991-04-30 Motorola, Inc. Providing a PGA package with a low reflection line
US5090118A (en) * 1990-07-31 1992-02-25 Texas Instruments Incorporated High performance test head and method of making
JPH04107940A (ja) 1990-08-29 1992-04-09 Hitachi Ltd 半導体装置及びその構成部品
KR100288344B1 (ko) * 1991-09-17 2001-11-30 마쯔모또 에이찌 프린트배선판용검사전극유니트와그것을포함하는검사장치및프린트배선판용의검사방법
GB2263980B (en) * 1992-02-07 1996-04-10 Marconi Gec Ltd Apparatus and method for testing bare dies
US5182220A (en) 1992-04-02 1993-01-26 United Microelectronics Corporation CMOS on-chip ESD protection circuit and semiconductor structure
US5270673A (en) 1992-07-24 1993-12-14 Hewlett-Packard Company Surface mount microcircuit hybrid
US5424693A (en) 1993-01-13 1995-06-13 Industrial Technology Research Institute Surface mountable microwave IC package
US5309019A (en) 1993-02-26 1994-05-03 Motorola, Inc. Low inductance lead frame for a semiconductor package
US5536906A (en) 1993-07-23 1996-07-16 Texas Instruments Incorporated Package for integrated circuits
JPH0799220A (ja) * 1993-08-04 1995-04-11 Tokyo Electron Ltd プローブカード、プローブカード用同軸プローブ針、及びその製造方法
JPH07321168A (ja) * 1994-05-27 1995-12-08 Tokyo Electron Ltd プローブカード
US5521406A (en) 1994-08-31 1996-05-28 Texas Instruments Incorporated Integrated circuit with improved thermal impedance
JPH08139142A (ja) * 1994-11-09 1996-05-31 Tokyo Electron Ltd プローブ装置
US5546405A (en) * 1995-07-17 1996-08-13 Advanced Micro Devices, Inc. Debug apparatus for an automated semiconductor testing system
US5642054A (en) * 1995-08-08 1997-06-24 Hughes Aircraft Company Active circuit multi-port membrane probe for full wafer testing
US5744869A (en) 1995-12-05 1998-04-28 Motorola, Inc. Apparatus for mounting a flip-chip semiconductor device
JP3634074B2 (ja) * 1996-06-28 2005-03-30 日本発条株式会社 導電性接触子
JPH10123215A (ja) * 1996-10-21 1998-05-15 Toshiba Microelectron Corp 半導体集積回路
US5917220A (en) 1996-12-31 1999-06-29 Stmicroelectronics, Inc. Integrated circuit with improved overvoltage protection
US5901022A (en) 1997-02-24 1999-05-04 Industrial Technology Research Inst. Charged device mode ESD protection circuit
AU6964698A (en) 1997-04-16 1998-11-11 Board Of Trustees Of The Leland Stanford Junior University Distributed esd protection device for high speed integrated circuits
JPH10300778A (ja) * 1997-04-24 1998-11-13 Kiyandotsukusu Syst:Kk 高周波デバイスの高周波特性を測定する方法
US5869898A (en) 1997-04-25 1999-02-09 Nec Corporation Lead-frame having interdigitated signal and ground leads with high frequency leads positioned adjacent a corner and shielded by ground leads on either side thereof
EP0985231A1 (en) 1997-05-15 2000-03-15 Formfactor, Inc. Lithographically defined microelectronic contact structures
US6008533A (en) 1997-12-08 1999-12-28 Micron Technology, Inc. Controlling impedances of an integrated circuit
US6218910B1 (en) * 1999-02-25 2001-04-17 Formfactor, Inc. High bandwidth passive integrated circuit tester probe card assembly
US6208225B1 (en) 1999-02-25 2001-03-27 Formfactor, Inc. Filter structures for integrated circuit interfaces
US6448865B1 (en) 1999-02-25 2002-09-10 Formfactor, Inc. Integrated circuit interconnect system

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4523312A (en) * 1981-10-29 1985-06-11 Takeda Riken Co., Ltd. IC tester
EP0513992A1 (en) * 1991-04-24 1992-11-19 Hewlett-Packard Company Wide bandwidth passive probe
WO1996015458A1 (en) * 1994-11-15 1996-05-23 Formfactor, Inc. Probe card assembly and kit, and methods of using same

Also Published As

Publication number Publication date
TW514733B (en) 2002-12-21
EP1159624B1 (en) 2004-01-02
AU3603400A (en) 2000-09-14
DE60007516D1 (de) 2004-02-05
US20040140822A1 (en) 2004-07-22
US6686754B2 (en) 2004-02-03
JP2007178440A (ja) 2007-07-12
DE60007516T2 (de) 2004-09-23
KR100793501B1 (ko) 2008-01-14
US20110115512A1 (en) 2011-05-19
JP2002538435A (ja) 2002-11-12
US6917210B2 (en) 2005-07-12
WO2000050905A1 (en) 2000-08-31
KR20060106938A (ko) 2006-10-12
KR20070038181A (ko) 2007-04-09
US6501343B2 (en) 2002-12-31
KR100757578B1 (ko) 2007-09-10
KR20010102357A (ko) 2001-11-15
US20030067316A1 (en) 2003-04-10
EP1159624A1 (en) 2001-12-05
US20010035800A1 (en) 2001-11-01
US6218910B1 (en) 2001-04-17

Similar Documents

Publication Publication Date Title
KR100757577B1 (ko) 고대역폭 수동 집적회로 시험기 탐침 카드 조립체
US6208225B1 (en) Filter structures for integrated circuit interfaces
US6822529B2 (en) Integrated circuit interconnect system
US6459343B1 (en) Integrated circuit interconnect system forming a multi-pole filter
US4764723A (en) Wafer probe
WO1999041812A1 (fr) Support de circuit integre
US5311122A (en) RF test equipment and wire bond interface circuit
US7388424B2 (en) Apparatus for providing a high frequency loop back with a DC path for a parametric test
CN110875288B (zh) 半导体器件封装
US6103978A (en) Printed wiring board having inner test-layer for improved test probing
JPWO1999041812A1 (ja) Icソケット

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

R18-X000 Changes to party contact information recorded

St.27 status event code: A-3-3-R10-R18-oth-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

A107 Divisional application of patent
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

G170 Re-publication after modification of scope of protection [patent]
PG1701 Publication of correction

St.27 status event code: A-5-5-P10-P19-oth-PG1701

Patent document republication publication date: 20080417

Republication note text: Request for Correction Notice (Document Request)

Gazette number: 1007575770000

Gazette reference publication date: 20070910

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20110823

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20120919

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20130905

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20130905

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000