JP2002520140A - 自動化された半導体処理システム - Google Patents

自動化された半導体処理システム

Info

Publication number
JP2002520140A
JP2002520140A JP2000558925A JP2000558925A JP2002520140A JP 2002520140 A JP2002520140 A JP 2002520140A JP 2000558925 A JP2000558925 A JP 2000558925A JP 2000558925 A JP2000558925 A JP 2000558925A JP 2002520140 A JP2002520140 A JP 2002520140A
Authority
JP
Japan
Prior art keywords
pallet
indexer
wafer
cassette
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000558925A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002520140A5 (enExample
Inventor
ジェフリー・エイ・デイビス
ケビン・ピー・メイヤー
カート・エル・ドールチェック
Original Assignee
セミトゥール・インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/112,259 external-priority patent/US6273110B1/en
Application filed by セミトゥール・インコーポレイテッド filed Critical セミトゥール・インコーポレイテッド
Publication of JP2002520140A publication Critical patent/JP2002520140A/ja
Publication of JP2002520140A5 publication Critical patent/JP2002520140A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Cleaning By Liquid Or Steam (AREA)
JP2000558925A 1998-07-08 1999-06-25 自動化された半導体処理システム Pending JP2002520140A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US09/112,259 1998-07-08
US09/112,259 US6273110B1 (en) 1997-12-19 1998-07-08 Automated semiconductor processing system
US09/274,511 1999-03-23
US09/274,511 US6279724B1 (en) 1997-12-19 1999-03-23 Automated semiconductor processing system
PCT/US1999/014414 WO2000002675A1 (en) 1998-07-08 1999-06-25 Automated semiconductor processing system

Publications (2)

Publication Number Publication Date
JP2002520140A true JP2002520140A (ja) 2002-07-09
JP2002520140A5 JP2002520140A5 (enExample) 2006-08-03

Family

ID=26809757

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000558925A Pending JP2002520140A (ja) 1998-07-08 1999-06-25 自動化された半導体処理システム

Country Status (6)

Country Link
US (2) US6279724B1 (enExample)
EP (1) EP1109632A4 (enExample)
JP (1) JP2002520140A (enExample)
CN (1) CN1126610C (enExample)
TW (1) TW507265B (enExample)
WO (1) WO2000002675A1 (enExample)

Families Citing this family (65)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6471460B1 (en) * 1996-07-15 2002-10-29 Semitool, Inc. Apparatus for processing a microelectronic workpiece including a workpiece cassette inventory assembly
US6439824B1 (en) 2000-07-07 2002-08-27 Semitool, Inc. Automated semiconductor immersion processing system
US20030051974A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated semiconductor processing system
US6736148B2 (en) * 1997-05-05 2004-05-18 Semitool, Inc. Automated semiconductor processing system
US20030051972A1 (en) * 1997-05-05 2003-03-20 Semitool, Inc. Automated immersion processing system
US7067018B2 (en) 1997-05-05 2006-06-27 Semitool, Inc. Automated system for handling and processing wafers within a carrier
US6572320B2 (en) * 1997-05-05 2003-06-03 Semitool, Inc. Robot for handling workpieces in an automated processing system
US6565729B2 (en) 1998-03-20 2003-05-20 Semitool, Inc. Method for electrochemically depositing metal on a semiconductor workpiece
US6454514B2 (en) 1998-07-08 2002-09-24 Semitool, Inc. Microelectronic workpiece support and apparatus using the support
US6497801B1 (en) 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7264698B2 (en) 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7351315B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7020537B2 (en) 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7351314B2 (en) 2003-12-05 2008-04-01 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US6916412B2 (en) 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
US7585398B2 (en) 1999-04-13 2009-09-08 Semitool, Inc. Chambers, systems, and methods for electrochemically processing microfeature workpieces
US7438788B2 (en) 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
WO2000061837A1 (en) 1999-04-13 2000-10-19 Semitool, Inc. Workpiece processor having processing chamber with improved processing fluid flow
US7160421B2 (en) 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7189318B2 (en) 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
JP3513437B2 (ja) * 1999-09-01 2004-03-31 キヤノン株式会社 基板管理方法及び半導体露光装置
US6629053B1 (en) * 1999-11-22 2003-09-30 Lam Research Corporation Method and apparatus for determining substrate offset using optimization techniques
US6502054B1 (en) 1999-11-22 2002-12-31 Lam Research Corporation Method of and apparatus for dynamic alignment of substrates
JP2001291698A (ja) * 2000-04-10 2001-10-19 Nec Corp 処理装置および処理方法
CH714282B1 (de) * 2000-07-06 2019-04-30 Murata Machinery Ltd Lagersystem mit Förderelementen.
AU2001268656A1 (en) * 2000-07-07 2002-01-21 Semitool, Inc. Automated processing system
US6668844B2 (en) 2001-07-16 2003-12-30 Semitool, Inc. Systems and methods for processing workpieces
WO2003008114A1 (en) * 2001-07-16 2003-01-30 Semitool, Inc. Systems and methods for processing workpieces
US20040025901A1 (en) * 2001-07-16 2004-02-12 Semitool, Inc. Stationary wafer spin/spray processor
AU2002343330A1 (en) 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
EP1460676A3 (en) * 2001-11-13 2005-10-26 FSI International, Inc. Reduced footprint tool for automated processing of microelectronic substrates
KR20050044434A (ko) 2001-11-13 2005-05-12 에프 에스 아이 인터내셔날,인코포레이티드 초소형전자 기판을 처리하는 감소의 풋프린트 공구
US6991710B2 (en) 2002-02-22 2006-01-31 Semitool, Inc. Apparatus for manually and automatically processing microelectronic workpieces
JP4033689B2 (ja) * 2002-03-01 2008-01-16 東京エレクトロン株式会社 液処理装置および液処理方法
GB0204882D0 (en) * 2002-03-01 2002-04-17 Trikon Technologies Ltd Pedestal
US6893505B2 (en) 2002-05-08 2005-05-17 Semitool, Inc. Apparatus and method for regulating fluid flows, such as flows of electrochemical processing fluids
US6830057B2 (en) * 2002-11-01 2004-12-14 Semitool, Inc. Wafer container cleaning system
US7289734B2 (en) * 2002-12-24 2007-10-30 Tropic Networks Inc. Method and system for multi-level power management in an optical network
JP4606195B2 (ja) 2004-03-08 2011-01-05 富士フイルム株式会社 液晶化合物、液晶組成物、重合体、位相差板、及び楕円偏光板
US7905960B2 (en) 2004-03-24 2011-03-15 Jusung Engineering Co., Ltd. Apparatus for manufacturing substrate
CN101128177A (zh) * 2004-12-22 2008-02-20 智能医院体系有限公司 自动配药系统（apas）
US7783383B2 (en) * 2004-12-22 2010-08-24 Intelligent Hospital Systems Ltd. Automated pharmacy admixture system (APAS)
JP4613079B2 (ja) 2005-03-04 2011-01-12 富士フイルム株式会社 液晶組成物、位相差板および楕円偏光板
DE102005017945A1 (de) * 2005-04-18 2006-10-19 Paul Hartmann Ag Erste-Hilfe-Material-Einheit, Verfahren sowie Verbandsmaterialbehältnis
US8821099B2 (en) * 2005-07-11 2014-09-02 Brooks Automation, Inc. Load port module
US7931859B2 (en) 2005-12-22 2011-04-26 Intelligent Hospital Systems Ltd. Ultraviolet sanitization in pharmacy environments
ITBO20060559A1 (it) * 2006-07-26 2008-01-27 Tissue Logistics Solutions S P A Macchina per la produzione di gruppi di prodotti in rotolo.
US9117859B2 (en) 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US7602562B2 (en) 2007-05-21 2009-10-13 Electro Scientific Industries, Inc. Fluid counterbalance for a laser lens used to scribe an electronic component substrate
US8271138B2 (en) 2007-09-12 2012-09-18 Intelligent Hospital Systems Ltd. Gripper device
US8225824B2 (en) 2007-11-16 2012-07-24 Intelligent Hospital Systems, Ltd. Method and apparatus for automated fluid transfer operations
JP4515507B2 (ja) * 2008-01-31 2010-08-04 東京エレクトロン株式会社 プラズマ処理システム
DE102008027861A1 (de) * 2008-06-11 2009-12-17 Vistec Semiconductor Systems Jena Gmbh Vorrichtung zum Halten von scheibenförmigen Objekten
US10294658B2 (en) 2008-12-23 2019-05-21 Xoma (Us) Llc Flexible manufacturing system
US8386070B2 (en) 2009-03-18 2013-02-26 Intelligent Hospital Systems, Ltd Automated pharmacy admixture system
USD613321S1 (en) * 2009-04-22 2010-04-06 Applied Materials, Inc. Liner with recessed panels
US8626329B2 (en) * 2009-11-20 2014-01-07 Agr Automation Ltd. Product assembly system and control software
JP5614352B2 (ja) * 2011-03-29 2014-10-29 東京エレクトロン株式会社 ローディングユニット及び処理システム
CN104245885B (zh) 2012-04-20 2016-09-07 Lg化学株式会社 可聚合液晶化合物、可聚合液晶组合物以及光学各向异性体
CN102921677B (zh) * 2012-10-24 2015-06-03 深圳创维－Rgb电子有限公司 电源板刷板除污一体化自动机
KR101992660B1 (ko) * 2012-11-28 2019-09-30 에이씨엠 리서치 (상하이) 인코포레이티드 반도체 웨이퍼의 세정 방법 및 장치
AT515531B1 (de) * 2014-09-19 2015-10-15 Siconnex Customized Solutions Gmbh Halterungssystem und Beschickungsverfahren für scheibenförmige Objekte
KR101734241B1 (ko) * 2015-12-10 2017-05-11 현대자동차 주식회사 트렁크 리드 힌지 지능형 로더유닛
TWI674930B (zh) * 2017-04-18 2019-10-21 韓商Ｓｔｉ股份有限公司 用於清潔容器的設備
CN116200717B (zh) * 2023-03-27 2025-06-13 维达力实业(深圳)有限公司 双向笼式载具移载装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL176841C (nl) * 1975-03-04 1985-06-17 Philips Nv Transport inrichting voor testmonsterdragers, alsmede deze dragers.
FR2314390A1 (fr) * 1975-06-13 1977-01-07 Sofermo Articulation modulaire autonome pour mecanismes divers et en particulier pour robots
US4506777A (en) * 1978-12-04 1985-03-26 Beckman Instruments, Inc. Sample handling apparatus
DE47132T1 (de) 1980-09-02 1983-01-20 Heraeus Quarzschmelze Gmbh, 6450 Hanau Verfahren und geraet zum ueberfuehren von gegenstaenden zwischen traggliedern.
DE3114032C2 (de) * 1981-04-07 1983-04-14 Gerd 8151 Osterwarngau Stückler Teilezuführung für einen Bestückungstisch
JPS59114206A (ja) * 1982-12-21 1984-07-02 Toshiba Corp パレツトコンベア装置
US4568234A (en) 1983-05-23 1986-02-04 Asq Boats, Inc. Wafer transfer apparatus
US4667081A (en) * 1985-02-04 1987-05-19 Spectra-Physics, Inc. Apparatus for changing the direction of a light beam passing through an articulated joint
US4806057A (en) * 1986-04-22 1989-02-21 Motion Manufacturing, Inc. Automatic wafer loading method and apparatus
JPS63219134A (ja) 1987-03-09 1988-09-12 Mitsubishi Electric Corp 拡散炉ウエハ・ハンドラ装置
US5030057A (en) * 1987-11-06 1991-07-09 Tel Sagami Limited Semiconductor wafer transferring method and apparatus and boat for thermal treatment of a semiconductor wafer
US5431421A (en) 1988-05-25 1995-07-11 Semitool, Inc. Semiconductor processor wafer holder
US5064337A (en) 1988-07-19 1991-11-12 Tokyo Electron Limited Handling apparatus for transferring carriers and a method of transferring carriers
JPH02286510A (ja) * 1989-04-28 1990-11-26 Tsubakimoto Chain Co 台車連結式コンベヤ
US5203445A (en) * 1990-03-17 1993-04-20 Tokyo Electron Sagami Limited Carrier conveying apparatus
US5186594A (en) 1990-04-19 1993-02-16 Applied Materials, Inc. Dual cassette load lock
JPH081922B2 (ja) * 1991-01-25 1996-01-10 株式会社東芝 ウェハ−保持装置
US5232328A (en) 1991-03-05 1993-08-03 Semitool, Inc. Robot loadable centrifugal semiconductor processor with extendible rotor
JPH081923B2 (ja) 1991-06-24 1996-01-10 ティーディーケイ株式会社 クリーン搬送方法及び装置
JPH05146984A (ja) 1991-07-08 1993-06-15 Murata Mach Ltd ウエハカセツト用ハンドリングロボツト
US5215420A (en) 1991-09-20 1993-06-01 Intevac, Inc. Substrate handling and processing system
NL9200446A (nl) 1992-03-10 1993-10-01 Tempress B V Inrichting voor het behandelen van microschakeling-schijven (wafers).
US5378145A (en) 1992-07-15 1995-01-03 Tokyo Electron Kabushiki Kaisha Treatment system and treatment apparatus
DE4404902C2 (de) * 1994-02-16 2002-04-11 Hauni Maschinenbau Ag Verfahren und Einrichtung zur Handhabung von Zigarettenschragen aufnehmenden Containern
US5544421A (en) 1994-04-28 1996-08-13 Semitool, Inc. Semiconductor wafer processing system
US5664337A (en) 1996-03-26 1997-09-09 Semitool, Inc. Automated semiconductor processing systems
US5784797A (en) 1994-04-28 1998-07-28 Semitool, Inc. Carrierless centrifugal semiconductor processing system
DE59611078D1 (de) 1995-03-28 2004-10-14 Brooks Automation Gmbh Be- und Entladestation für Halbleiterbearbeitungsanlagen
US5613821A (en) 1995-07-06 1997-03-25 Brooks Automation, Inc. Cluster tool batchloader of substrate carrier
US5674039A (en) 1996-07-12 1997-10-07 Fusion Systems Corporation System for transferring articles between controlled environments
US5731678A (en) 1996-07-15 1998-03-24 Semitool, Inc. Processing head for semiconductor processing machines
CH697146A5 (de) * 1996-10-09 2008-05-15 Tec Sem Ag Greifvorrichtung zur Handhabung von Wafern.
US5885045A (en) * 1997-03-17 1999-03-23 Fortrend Engineering Corporation Integrated wafer pod-load/unload and mass-transfer system

Also Published As

Publication number Publication date
EP1109632A1 (en) 2001-06-27
WO2000002675A1 (en) 2000-01-20
CN1126610C (zh) 2003-11-05
EP1109632A4 (en) 2006-11-22
US20020044855A1 (en) 2002-04-18
TW507265B (en) 2002-10-21
US6279724B1 (en) 2001-08-28
CN1308565A (zh) 2001-08-15
WO2000002675A9 (en) 2000-07-06

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