JP2002507837A - 環境にやさしい溶剤を用いた、フリップチップ技術のための融剤クリーニング - Google Patents

環境にやさしい溶剤を用いた、フリップチップ技術のための融剤クリーニング

Info

Publication number
JP2002507837A
JP2002507837A JP2000537255A JP2000537255A JP2002507837A JP 2002507837 A JP2002507837 A JP 2002507837A JP 2000537255 A JP2000537255 A JP 2000537255A JP 2000537255 A JP2000537255 A JP 2000537255A JP 2002507837 A JP2002507837 A JP 2002507837A
Authority
JP
Japan
Prior art keywords
substrate
die
flux
flip
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000537255A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002507837A5 (https=
Inventor
マスター，ラージ・エヌ
スター，オリオン・ケイ
カーン，モハンマド・ズーバイア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2002507837A publication Critical patent/JP2002507837A/ja
Publication of JP2002507837A5 publication Critical patent/JP2002507837A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Wire Bonding (AREA)
JP2000537255A 1998-03-17 1999-03-17 環境にやさしい溶剤を用いた、フリップチップ技術のための融剤クリーニング Pending JP2002507837A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/040,651 1998-03-17
US09/040,651 US5988485A (en) 1998-03-17 1998-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents
PCT/US1999/005927 WO1999048142A1 (en) 1998-03-17 1999-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents

Publications (2)

Publication Number Publication Date
JP2002507837A true JP2002507837A (ja) 2002-03-12
JP2002507837A5 JP2002507837A5 (https=) 2006-03-30

Family

ID=21912175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000537255A Pending JP2002507837A (ja) 1998-03-17 1999-03-17 環境にやさしい溶剤を用いた、フリップチップ技術のための融剤クリーニング

Country Status (5)

Country Link
US (1) US5988485A (https=)
EP (1) EP1064678A1 (https=)
JP (1) JP2002507837A (https=)
KR (1) KR100644420B1 (https=)
WO (1) WO1999048142A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475828B1 (en) * 1999-11-10 2002-11-05 Lsi Logic Corporation Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
JP2001332575A (ja) * 2000-05-19 2001-11-30 Sony Corp フラックス洗浄方法及び半導体装置の製造方法
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6258612B1 (en) 2000-06-28 2001-07-10 Advanced Micro Devices, Inc. Determination of flux prior to package assembly
US6367679B1 (en) 2000-06-28 2002-04-09 Advanced Micro Devices, Inc. Detection of flux residue
US6597444B1 (en) 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6399902B1 (en) 2000-08-01 2002-06-04 Advanced Micro Devices, Inc. Inline flux measurement system
US6433425B1 (en) * 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
US6578755B1 (en) * 2000-09-22 2003-06-17 Flip Chip Technologies, L.L.C. Polymer collar for solder bumps
US6926190B2 (en) * 2002-03-25 2005-08-09 Micron Technology, Inc. Integrated circuit assemblies and assembly methods
DE10303588B3 (de) * 2003-01-29 2004-08-26 Infineon Technologies Ag Verfahren zur vertikalen Montage von Halbleiterbauelementen
US20050067468A1 (en) * 2003-09-30 2005-03-31 Daoqiang Lu Fluxes for flip chip assembly using water soluble polymers
US7842948B2 (en) 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
US7666714B2 (en) * 2006-12-29 2010-02-23 Intel Corporation Assembly of thin die coreless package
JP2021536131A (ja) 2018-09-04 2021-12-23 中芯集成電路（寧波）有限公司 ウェハレベルパッケージング方法およびパッケージング構造
CN110875203B (zh) * 2018-09-04 2021-11-09 中芯集成电路（宁波）有限公司 晶圆级封装方法以及封装结构

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840098C1 (https=) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
US5128057A (en) * 1989-09-29 1992-07-07 Kyzen Corporation Furfuryl alcohol mixtures for use as cleaning agents
JPH0537136A (ja) * 1991-08-02 1993-02-12 Nec Corp フラツクスの洗浄方法
US5125560A (en) * 1991-11-04 1992-06-30 At&T Bell Laboratories Method of soldering including removal of flux residue
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
JP2795788B2 (ja) * 1993-02-18 1998-09-10 シャープ株式会社 半導体チップの実装方法
US5668058A (en) * 1995-12-28 1997-09-16 Nec Corporation Method of producing a flip chip

Also Published As

Publication number Publication date
WO1999048142A1 (en) 1999-09-23
US5988485A (en) 1999-11-23
KR20010041857A (ko) 2001-05-25
KR100644420B1 (ko) 2006-11-10
EP1064678A1 (en) 2001-01-03

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