KR100644420B1 - 환경 친화적인 용제를 이용하는 플립 칩 기술을 위한 플럭스 세정 - Google Patents

환경 친화적인 용제를 이용하는 플립 칩 기술을 위한 플럭스 세정 Download PDF

Info

Publication number
KR100644420B1
KR100644420B1 KR1020007010149A KR20007010149A KR100644420B1 KR 100644420 B1 KR100644420 B1 KR 100644420B1 KR 1020007010149 A KR1020007010149 A KR 1020007010149A KR 20007010149 A KR20007010149 A KR 20007010149A KR 100644420 B1 KR100644420 B1 KR 100644420B1
Authority
KR
South Korea
Prior art keywords
substrate
die
flip chip
flux
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020007010149A
Other languages
English (en)
Korean (ko)
Other versions
KR20010041857A (ko
Inventor
마스터래지엔.
스타오리온케이.
칸모하마드쥬베어
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20010041857A publication Critical patent/KR20010041857A/ko
Application granted granted Critical
Publication of KR100644420B1 publication Critical patent/KR100644420B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Landscapes

  • Wire Bonding (AREA)
KR1020007010149A 1998-03-17 1999-03-17 환경 친화적인 용제를 이용하는 플립 칩 기술을 위한 플럭스 세정 Expired - Lifetime KR100644420B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/040,651 1998-03-17
US9/040,651 1998-03-17
US09/040,651 US5988485A (en) 1998-03-17 1998-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents

Publications (2)

Publication Number Publication Date
KR20010041857A KR20010041857A (ko) 2001-05-25
KR100644420B1 true KR100644420B1 (ko) 2006-11-10

Family

ID=21912175

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007010149A Expired - Lifetime KR100644420B1 (ko) 1998-03-17 1999-03-17 환경 친화적인 용제를 이용하는 플립 칩 기술을 위한 플럭스 세정

Country Status (5)

Country Link
US (1) US5988485A (https=)
EP (1) EP1064678A1 (https=)
JP (1) JP2002507837A (https=)
KR (1) KR100644420B1 (https=)
WO (1) WO1999048142A1 (https=)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475828B1 (en) * 1999-11-10 2002-11-05 Lsi Logic Corporation Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
JP2001332575A (ja) * 2000-05-19 2001-11-30 Sony Corp フラックス洗浄方法及び半導体装置の製造方法
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6258612B1 (en) 2000-06-28 2001-07-10 Advanced Micro Devices, Inc. Determination of flux prior to package assembly
US6367679B1 (en) 2000-06-28 2002-04-09 Advanced Micro Devices, Inc. Detection of flux residue
US6597444B1 (en) 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6399902B1 (en) 2000-08-01 2002-06-04 Advanced Micro Devices, Inc. Inline flux measurement system
US6433425B1 (en) * 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
US6578755B1 (en) * 2000-09-22 2003-06-17 Flip Chip Technologies, L.L.C. Polymer collar for solder bumps
US6926190B2 (en) * 2002-03-25 2005-08-09 Micron Technology, Inc. Integrated circuit assemblies and assembly methods
DE10303588B3 (de) * 2003-01-29 2004-08-26 Infineon Technologies Ag Verfahren zur vertikalen Montage von Halbleiterbauelementen
US20050067468A1 (en) * 2003-09-30 2005-03-31 Daoqiang Lu Fluxes for flip chip assembly using water soluble polymers
US7842948B2 (en) 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
US7666714B2 (en) * 2006-12-29 2010-02-23 Intel Corporation Assembly of thin die coreless package
JP2021536131A (ja) 2018-09-04 2021-12-23 中芯集成電路（寧波）有限公司 ウェハレベルパッケージング方法およびパッケージング構造
CN110875203B (zh) * 2018-09-04 2021-11-09 中芯集成电路（宁波）有限公司 晶圆级封装方法以及封装结构

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128057A (en) * 1989-09-29 1992-07-07 Kyzen Corporation Furfuryl alcohol mixtures for use as cleaning agents

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840098C1 (https=) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
JPH0537136A (ja) * 1991-08-02 1993-02-12 Nec Corp フラツクスの洗浄方法
US5125560A (en) * 1991-11-04 1992-06-30 At&T Bell Laboratories Method of soldering including removal of flux residue
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
JP2795788B2 (ja) * 1993-02-18 1998-09-10 シャープ株式会社 半導体チップの実装方法
US5668058A (en) * 1995-12-28 1997-09-16 Nec Corporation Method of producing a flip chip

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128057A (en) * 1989-09-29 1992-07-07 Kyzen Corporation Furfuryl alcohol mixtures for use as cleaning agents

Also Published As

Publication number Publication date
WO1999048142A1 (en) 1999-09-23
JP2002507837A (ja) 2002-03-12
US5988485A (en) 1999-11-23
KR20010041857A (ko) 2001-05-25
EP1064678A1 (en) 2001-01-03

Similar Documents

Publication Publication Date Title
KR100644420B1 (ko) 환경 친화적인 용제를 이용하는 플립 칩 기술을 위한 플럭스 세정
US6774497B1 (en) Flip-chip assembly with thin underfill and thick solder mask
KR100592121B1 (ko) 플립 칩 조립을 위한 무세정 플럭스
KR100724030B1 (ko) 반도체 모듈
JP2589239B2 (ja) 熱硬化可能な接着剤およびこれを用いた電気的コンポーネント組立体
JP3757881B2 (ja) はんだ
JP4416373B2 (ja) 電子機器
KR19980070398A (ko) 용융제를 함유하는 선택적 충전형 접착막
US5973406A (en) Electronic device bonding method and electronic circuit apparatus
WO2008005586A2 (en) Flipped, stacked-chip ic packaging for high bandwidth data transfer buses
KR100269834B1 (ko) 용제 잔류물의 제거를 포함하는 납땜 방법
US7148086B2 (en) Semiconductor package with controlled solder bump wetting and fabrication method therefor
JPH06151701A (ja) 半導体装置の製造方法
US7169641B2 (en) Semiconductor package with selective underfill and fabrication method therfor
US6617195B1 (en) Method of reflowing organic packages using no-clean flux
KR100884192B1 (ko) 반도체 패키지의 제조 방법
US6770510B1 (en) Flip chip process of flux-less no-flow underfill
KR20000008347A (ko) 플립칩bga 패키지 제조방법
Zakel et al. Fluxless flip chip assembly on rigid and flexible polymer substrates using the Au-Sn metallurgy
JP2004152857A (ja) 配線基板への電子部品搭載方法
JPS58103198A (ja) 電子部品の取付け方法
CN1190260A (zh) 倒装片安装
Tsui et al. Pad redistribution technology for flip chip applications
JP3344254B2 (ja) 半導体装置製造方法
JPH01220460A (ja) 半導体装置のバンプ形成用ハンダ

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20121030

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20131017

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20141022

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20151002

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

FPAY Annual fee payment

Payment date: 20160929

Year of fee payment: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

FPAY Annual fee payment

Payment date: 20181001

Year of fee payment: 13

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

EXPY Expiration of term
PC1801 Expiration of term

St.27 status event code: N-4-6-H10-H14-oth-PC1801

Not in force date: 20190318

Ip right cessation event data comment text: Termination Category : EXPIRATION_OF_DURATION

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000