WO1999048142A1 - Flux cleaning for flip chip technology using environmentally friendly solvents - Google Patents

Flux cleaning for flip chip technology using environmentally friendly solvents Download PDF

Info

Publication number
WO1999048142A1
WO1999048142A1 PCT/US1999/005927 US9905927W WO9948142A1 WO 1999048142 A1 WO1999048142 A1 WO 1999048142A1 US 9905927 W US9905927 W US 9905927W WO 9948142 A1 WO9948142 A1 WO 9948142A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
die
flux
flip chip
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US1999/005927
Other languages
English (en)
French (fr)
Inventor
Raj N. Master
Orion K. Starr
Mohammad Zubair Khan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Priority to EP99912667A priority Critical patent/EP1064678A1/en
Priority to JP2000537255A priority patent/JP2002507837A/ja
Publication of WO1999048142A1 publication Critical patent/WO1999048142A1/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors

Definitions

  • Xylene, Toluene, and Terpene which are either safety hazards or health hazards. Because of these characteristics of the solvent materials, the cleaning step is very expensive because it requires highly specialized equipment. The equipment may have to be explosion proof, it may have to have special filtering systems to protect the surrounding community as well as the technicians from air pollution and/or water pollution.
  • the cleaning process is carried out with the following process parameters: time 10 -30 minutes temperature 70 - 90°C pressure 40 - 70 psi rotation speed and reversals 100-1000 rpm and 25 - reversal cycles.
  • Figure 2F shows the substrate/die module 210 with an underfill material

Landscapes

  • Wire Bonding (AREA)
PCT/US1999/005927 1998-03-17 1999-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents Ceased WO1999048142A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP99912667A EP1064678A1 (en) 1998-03-17 1999-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents
JP2000537255A JP2002507837A (ja) 1998-03-17 1999-03-17 環境にやさしい溶剤を用いた、フリップチップ技術のための融剤クリーニング

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/040,651 1998-03-17
US09/040,651 US5988485A (en) 1998-03-17 1998-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents

Publications (1)

Publication Number Publication Date
WO1999048142A1 true WO1999048142A1 (en) 1999-09-23

Family

ID=21912175

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/005927 Ceased WO1999048142A1 (en) 1998-03-17 1999-03-17 Flux cleaning for flip chip technology using environmentally friendly solvents

Country Status (5)

Country Link
US (1) US5988485A (https=)
EP (1) EP1064678A1 (https=)
JP (1) JP2002507837A (https=)
KR (1) KR100644420B1 (https=)
WO (1) WO1999048142A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10303588B3 (de) * 2003-01-29 2004-08-26 Infineon Technologies Ag Verfahren zur vertikalen Montage von Halbleiterbauelementen

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6475828B1 (en) * 1999-11-10 2002-11-05 Lsi Logic Corporation Method of using both a non-filled flux underfill and a filled flux underfill to manufacture a flip-chip
US6234379B1 (en) * 2000-02-28 2001-05-22 Nordson Corporation No-flow flux and underfill dispensing methods
JP2001332575A (ja) * 2000-05-19 2001-11-30 Sony Corp フラックス洗浄方法及び半導体装置の製造方法
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6258612B1 (en) 2000-06-28 2001-07-10 Advanced Micro Devices, Inc. Determination of flux prior to package assembly
US6367679B1 (en) 2000-06-28 2002-04-09 Advanced Micro Devices, Inc. Detection of flux residue
US6597444B1 (en) 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6399902B1 (en) 2000-08-01 2002-06-04 Advanced Micro Devices, Inc. Inline flux measurement system
US6433425B1 (en) * 2000-09-12 2002-08-13 International Business Machines Corporation Electronic package interconnect structure comprising lead-free solders
US6578755B1 (en) * 2000-09-22 2003-06-17 Flip Chip Technologies, L.L.C. Polymer collar for solder bumps
US6926190B2 (en) * 2002-03-25 2005-08-09 Micron Technology, Inc. Integrated circuit assemblies and assembly methods
US20050067468A1 (en) * 2003-09-30 2005-03-31 Daoqiang Lu Fluxes for flip chip assembly using water soluble polymers
US7842948B2 (en) 2004-02-27 2010-11-30 Nvidia Corporation Flip chip semiconductor die internal signal access system and method
US7666714B2 (en) * 2006-12-29 2010-02-23 Intel Corporation Assembly of thin die coreless package
JP2021536131A (ja) 2018-09-04 2021-12-23 中芯集成電路（寧波）有限公司 ウェハレベルパッケージング方法およびパッケージング構造
CN110875203B (zh) * 2018-09-04 2021-11-09 中芯集成电路（宁波）有限公司 晶圆级封装方法以及封装结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128057A (en) * 1989-09-29 1992-07-07 Kyzen Corporation Furfuryl alcohol mixtures for use as cleaning agents
EP0541282A2 (en) * 1991-11-04 1993-05-12 AT&T Corp. Method of soldering including removal of flux residue
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5447886A (en) * 1993-02-18 1995-09-05 Sharp Kabushiki Kaisha Method for mounting semiconductor chip on circuit board
US5668058A (en) * 1995-12-28 1997-09-16 Nec Corporation Method of producing a flip chip

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3840098C1 (https=) * 1988-11-28 1989-12-21 Helmut Walter 8900 Augsburg De Leicht
JPH0537136A (ja) * 1991-08-02 1993-02-12 Nec Corp フラツクスの洗浄方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128057A (en) * 1989-09-29 1992-07-07 Kyzen Corporation Furfuryl alcohol mixtures for use as cleaning agents
EP0541282A2 (en) * 1991-11-04 1993-05-12 AT&T Corp. Method of soldering including removal of flux residue
US5288332A (en) * 1993-02-05 1994-02-22 Honeywell Inc. A process for removing corrosive by-products from a circuit assembly
US5447886A (en) * 1993-02-18 1995-09-05 Sharp Kabushiki Kaisha Method for mounting semiconductor chip on circuit board
US5668058A (en) * 1995-12-28 1997-09-16 Nec Corporation Method of producing a flip chip

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
KYZEN CORP.: "ALCOHOL/WATER-BASED SEMI-AQUEOUS CLEANING CHEMICAL FOR ELECTRONICS; IONOX HC", XP002105651, Retrieved from the Internet <URL:http://www.kyzen.com/datasht/Ionox.htm> [retrieved on 19991106] *
Proceedings of NEPCON WEST 93, Anaheim, CA, USA, Vol. 3, pp. 1624-1625, S. Nachbor et al.: "Qualifications os Semi-Aqueous Cleaning Technology for Avionics Electronics and Production Optimization Using a Design of Experiments *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10303588B3 (de) * 2003-01-29 2004-08-26 Infineon Technologies Ag Verfahren zur vertikalen Montage von Halbleiterbauelementen

Also Published As

Publication number Publication date
JP2002507837A (ja) 2002-03-12
US5988485A (en) 1999-11-23
KR20010041857A (ko) 2001-05-25
KR100644420B1 (ko) 2006-11-10
EP1064678A1 (en) 2001-01-03

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