JP2002507836A - 制御された量の融剤をパッケージに塗布するための自動化したブラシ融剤処理システム - Google Patents

制御された量の融剤をパッケージに塗布するための自動化したブラシ融剤処理システム

Info

Publication number
JP2002507836A
JP2002507836A JP2000537254A JP2000537254A JP2002507836A JP 2002507836 A JP2002507836 A JP 2002507836A JP 2000537254 A JP2000537254 A JP 2000537254A JP 2000537254 A JP2000537254 A JP 2000537254A JP 2002507836 A JP2002507836 A JP 2002507836A
Authority
JP
Japan
Prior art keywords
substrate
flux
brush
chip
assembled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000537254A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002507836A5 (https=
Inventor
マスター，ラージ・エヌ
グアルダード，マリア・ジィ
カーン，モハンマド・ズーバイア
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2002507836A publication Critical patent/JP2002507836A/ja
Publication of JP2002507836A5 publication Critical patent/JP2002507836A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/097—Cleaning

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2000537254A 1998-03-17 1999-03-17 制御された量の融剤をパッケージに塗布するための自動化したブラシ融剤処理システム Pending JP2002507836A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/040,511 1998-03-17
US09/040,511 US6098867A (en) 1998-03-17 1998-03-17 Automated brush fluxing system for application of controlled amount of flux to packages
PCT/US1999/005924 WO1999048141A1 (en) 1998-03-17 1999-03-17 Automated brush fluxing system for application of controlled amount of flux to packages

Publications (2)

Publication Number Publication Date
JP2002507836A true JP2002507836A (ja) 2002-03-12
JP2002507836A5 JP2002507836A5 (https=) 2006-04-06

Family

ID=21911370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000537254A Pending JP2002507836A (ja) 1998-03-17 1999-03-17 制御された量の融剤をパッケージに塗布するための自動化したブラシ融剤処理システム

Country Status (5)

Country Link
US (1) US6098867A (https=)
EP (1) EP1064677A1 (https=)
JP (1) JP2002507836A (https=)
KR (1) KR100529746B1 (https=)
WO (1) WO1999048141A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60034970T2 (de) * 1999-03-10 2008-02-21 Unilever N.V. Gefrierschutzprotein enthaltendes Speiseeis
US6333210B1 (en) 2000-05-25 2001-12-25 Advanced Micro Devices, Inc. Process of ensuring detect free placement by solder coating on package pads
US6597444B1 (en) * 2000-06-28 2003-07-22 Advanced Micro Devices, Inc. Determination of flux coverage
US6709963B1 (en) * 2000-07-14 2004-03-23 Advanced Micro Devices, Inc. Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps
AU2001281178A1 (en) * 2000-08-24 2002-03-04 Advanced Micro Devices Inc. Controlled and programmed deposition of flux on a flip-chip die by spraying

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841751A (en) * 1969-06-04 1974-10-15 Xerox Corp Electrostatic color reproduction method
JPS5119710B2 (https=) * 1972-05-19 1976-06-19
JPS5496044A (en) * 1978-01-14 1979-07-30 Toshiba Corp Developing device of electrostatic latent images
JPS5540034A (en) * 1978-09-12 1980-03-21 Citizen Watch Co Ltd Flux coating method and coating device for soldering
JPS6326261A (ja) * 1986-03-17 1988-02-03 Alps Electric Co Ltd プリント基板のフラツクス塗布方法
US4724170A (en) * 1986-09-02 1988-02-09 The Goodyear Tire & Rubber Company Apparatus and method for applying cement to an end portion of a flexible strip
US5065692A (en) * 1990-04-30 1991-11-19 At&T Bell Laboratories Solder flux applicator
US5144711A (en) * 1991-03-25 1992-09-08 Westech Systems, Inc. Cleaning brush for semiconductor wafer
US5328085A (en) * 1992-08-18 1994-07-12 Precision Dispensing Equipment, Inc. Apparatus for applying flux
US5324406A (en) * 1992-09-10 1994-06-28 Tosoh Smd, Inc. Automatic brush plating machine
JPH0758446A (ja) * 1993-08-19 1995-03-03 Toshiba Corp フラックス塗布装置
JPH07183649A (ja) * 1993-12-22 1995-07-21 Matsushita Electric Ind Co Ltd フラックスの塗布装置
US5475889A (en) * 1994-07-15 1995-12-19 Ontrak Systems, Inc. Automatically adjustable brush assembly for cleaning semiconductor wafers

Also Published As

Publication number Publication date
KR100529746B1 (ko) 2005-11-22
US6098867A (en) 2000-08-08
KR20010041941A (ko) 2001-05-25
WO1999048141A1 (en) 1999-09-23
EP1064677A1 (en) 2001-01-03

Similar Documents

Publication Publication Date Title
JP6260814B2 (ja) 電子部品実装方法、電子部品搭載装置および電子部品実装システム
JP5719999B2 (ja) 電子部品実装方法、電子部品搭載装置および電子部品実装システム
US6103549A (en) No clean flux for flip chip assembly
JP3801674B2 (ja) 電子部品の実装方法
JP2002507836A (ja) 制御された量の融剤をパッケージに塗布するための自動化したブラシ融剤処理システム
US6722553B2 (en) Controlled and programmed deposition of flux on a flip-chip die by spraying
JP3416032B2 (ja) 接着剤塗布方法、接着剤塗布装置、及び半導体部品実装方法
JP3388152B2 (ja) 接着剤塗布方法及び接着剤塗布装置
CN1153266C (zh) 凸点的形成方法和半导体装置
JP2003273165A (ja) 電子部品実装装置および電子部品実装方法
KR100459602B1 (ko) 범프본더
JP3374998B2 (ja) フラツクス塗布方法及びその装置
US6383891B1 (en) Method for forming bump and semiconductor device
JPWO1998020541A1 (ja) バンプの形成方法および半導体装置
KR100197858B1 (ko) 리드 프레임에 스크린 프린트 기법을 이용한 개선된 칩 부착방법
JP3028031B2 (ja) ダイボンディング装置及びダイボンディング方法
US7735717B2 (en) Method of manufacturing semiconductor apparatus and method of forming viscous liquid layer
Riley Flip-chip advantages for complex electronics in microsystems
JPH11111646A (ja) 半導体装置の製造方法及び半導体装置
JPS6376356A (ja) 自動フイン付け装置
JPH05129372A (ja) 電子回路部品のマウント方法及びそれに使用する治具
JP2005123322A (ja) 半導体製造装置および製造方法
Riley et al. Gearing up for flip chip.
JP2005013841A (ja) 塗布装置および塗布方法
JP2002118142A (ja) 半導体装置の製造方法および半導体製造装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060214

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20081009

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20081021

A601 Written request for extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A601

Effective date: 20090120

A602 Written permission of extension of time

Free format text: JAPANESE INTERMEDIATE CODE: A602

Effective date: 20090127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090203

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090310

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090619

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20090727

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20090918